New Equipment | Solder Materials
Big-Size Vacuum Soldering Oven for IGBT, MOS 1.Reflow soldering Typically high number of voids cause a large non conductive area 2.Vacuum soldering Very low number of voids, Typically 3.Applications Power Semiconductors;Hybrid
Industry News | 2019-12-09 14:44:26.0
The SMT Reflow Soldering Equipment (Global) award was awarded to Heller Industries by Frost & Sullivan.
Dinghua Technology-- the leading manufacturer of BGA rework station, Automatic screw locking machine, Automatic soldering station and non-standard equipment. For more details, please just contact John, WhatsApp/Wechat:+86 1576811 4827 , Skype: si
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/0402-min-size-land-pattern_topic30_post6316.html
. Use the “Least” environment for EIA 0402 (1005 metric) chip components. No one should ever use the Most environment for this chip size due to excessive solder
Heller Industries Inc. | https://hellerindustries.com/1505-mark-v-series-smt-reflow-oven/
) of this reflow oven is similar size to benchtop reflow machines but is IN-LINE for maximum throughput! 5 heated zones -allows for more precise profile definition than lab machines
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