New Equipment | Test Equipment
Thermal Profiler for reflow oven Accuracy: ±1 ℃ sampling number: 12000 internal protection temperature: up to 70 ℃ for 5 minutes Temperature range: 0-500 ℃ Product description: Thermal Profiler for reflow oven INQUIRY Ther
http://www.flason-smt.com/product/Yamaha-nozzle-for-for-all-model-machine.html Yamaha nozzle for for all model machine SMT Nozzle Yamaha Nozzle Yamaha nozzle for for all model machine Usage:Yamaha pick and place machine Product description: Y
Industry News | 2023-10-18 17:43:18.0
HELLER's High UPH Vacuum Reflow Oven clinched the coveted "Step-by-Step Excellence Awards" - Innovation Award owing to its industry-leading product strength and outstanding performance.
Industry News | 2024-02-26 16:22:08.0
HELLER, a leading provider of reflow soldering equipment, concluded its 2024 Sales Kickoff Meeting in Suwon, South Korea on a high note. The meeting brought together sales representatives from all branches and subsidiaries to discuss the company's unified goals and objectives for the year ahead, and to equip them with the tools and knowledge necessary to achieve success.
Technical Library | 2014-08-19 15:39:13.0
Understanding warpage of package attach locations on PCBs under reflow temperature conditions is critical in surface mount technology. A new industry standard, IPC 9641, addresses this topic directly for the first time as an international standard.This paper begins by summarizing the sections of the IPC 9641 standard, including, measurement equipment selection, test setup and methodology, and accuracy verification. The paper goes further to discuss practical implementation of the IPC 9641 standards. Key advantages and disadvantages between available warpage measurement methods are highlighted. Choosing the correct measurement technique depends on requirements for warpage resolution, data density, measurement volume, and data correlation. From industry experience, best practice recommendations are made on warpage management of PCB land areas, covering how to setup, run, analyze, and report on local area PCB warpage.The release of IPC 9641 shows that flatness over temperature of the package land area on the PCB is critical to the SMT industry. Furthermore, compatibility of shapes between attaching surfaces in SMT, like a package and PCB, will be critical to product yield and quality in years to come.
Technical Library | 2012-12-20 14:36:09.0
The increased function of personal electronic devices, such as mobile phones and personal music devices, has driven the need for smaller and smaller active and passive components. This trend toward miniaturization, occurring at the same time as the conversion to RoHS-compliant lead-free assembly, has been a considerable challenge to the electronics assembly industry. The main reason for this is the higher reflow process temperatures required for Pb-free assembly. These higher temperatures can thermally damage the PCB and the components. In addition, the higher reflow temperatures can negatively affect the solder joint quality, especially when coupled with the smaller paste deposits required for these smaller components. If additional thermal processing is required, the risk increases even more. First Published at SMTA's International Conference on Soldering and Reliability in Toronto, May 2011
The Access Control Face Recognition system is a very widely used product. It is currently not only used in residential buildings and office buildings, but also in many scenarios. For example, corporate attendance: Some companies also use the acces
From 0 to 1 to Support the JUKI Full-auto SMT Line Smart products have had a transformative impact on society, enabling greater connectivity, convenience, and access to information. They have revolutionized industries such as entertainment and e-c
SMT Express, Issue No. 4 - from SMTnet.com Volume 1, Issue No. 4 Tuesday, September 14, 1999 Featured Article Return to Front Page CFM Increases First-pass Yield by Bob Bilbrough, Quality Contract Manufacturing, LLC If CFM is so valuable
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/grnreflo.pdf
Sony’s new, lead-free reflow profile. Since the thermal technology to accomplish this task did not exist at the time of the company’s search, it was necessary for the team to evaluate both current tech- nology and each
| https://productronica.com/en/trade-fair/press/press-releases/detail/microelectronics-one-of-the-key-industries-of-our-time.html
3.2 percent at the same time. Among other things, the trend is caused by the strong demand for electronics equipment for people working from home (e.g. PCs
