CBS Reflow Oven Machine - Advanced SMT Soldering Solution for Precision Assembly ❙ Introduce of Reflow Oven I.C.T is focused on providing advanced Reflow Oven and technology to electronics manufacturers. The I.C.T reflow oven control system is co
Factory price new design Reflow oven for pick and place machine Assembly Line Product introduction: Streamline shape design make the oven looks great,PLC+PID closed loop control to achieve high prectise temperature control and repeatable prof
Electronics Forum | Fri Feb 10 13:25:35 EST 2017 | dilogic
Today I tried to reflow a PCB for the first time. It did not went well. Can anybody tell me what did I do wrong?
Electronics Forum | Wed Feb 15 08:57:48 EST 2017 | dilogic
I tried several times - it squeaked for a while and then silence...
Industry News | 2024-02-26 16:22:08.0
HELLER, a leading provider of reflow soldering equipment, concluded its 2024 Sales Kickoff Meeting in Suwon, South Korea on a high note. The meeting brought together sales representatives from all branches and subsidiaries to discuss the company's unified goals and objectives for the year ahead, and to equip them with the tools and knowledge necessary to achieve success.
Industry News | 2023-10-18 17:43:18.0
HELLER's High UPH Vacuum Reflow Oven clinched the coveted "Step-by-Step Excellence Awards" - Innovation Award owing to its industry-leading product strength and outstanding performance.
Technical Library | 1999-05-07 08:50:40.0
To enable transistor scaling into the 21st century, new solutions such as high dielectric constaConventional scaling of gate oxide thickness, source/drain extension (SDE), junction depths, and gate lengths have enabled MOS gate dimensions to be reduced from 10mm in the 1970’s to a present day size of 0.1mm. To enable transistor scaling into the 21st century, new solutions such as high dielectric constant materials for gate insulation and shallow, ultra low resistivity junctions need to be developed. In this paper, for the first time, key scaling limits are quantified for MOS transistorsnt materials for gate insulation and shallow, ultra low resistivity junctions need to be developed.
Technical Library | 2012-12-20 14:36:09.0
The increased function of personal electronic devices, such as mobile phones and personal music devices, has driven the need for smaller and smaller active and passive components. This trend toward miniaturization, occurring at the same time as the conversion to RoHS-compliant lead-free assembly, has been a considerable challenge to the electronics assembly industry. The main reason for this is the higher reflow process temperatures required for Pb-free assembly. These higher temperatures can thermally damage the PCB and the components. In addition, the higher reflow temperatures can negatively affect the solder joint quality, especially when coupled with the smaller paste deposits required for these smaller components. If additional thermal processing is required, the risk increases even more. First Published at SMTA's International Conference on Soldering and Reliability in Toronto, May 2011
The Access Control Face Recognition system is a very widely used product. It is currently not only used in residential buildings and office buildings, but also in many scenarios. For example, corporate attendance: Some companies also use the acces
This video shows the NEW PDR IR-D3i SMT / BGA Rework station in action! Using PDR's patented Focused IR technology, the D3i & D3Vi Discovery series Rework systems have been specifically designed to cope with the challenges of repairing today's PCB
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Time For Trees - Flux Connectivity - Enabling The Connected World™ Solutions FluxLab™ Contract Manufacturing Labor Optimization Integrated Solutions Products Company Mission
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