Industry Directory | Manufacturer
We supply reflow oven, wave solder machine and board handling conveyors. We offer standard products shown on the website.
Industry Directory | Manufacturer
Global supplier of advanced thermal processing equipment and processes to the electronics assembly market.
Heller 1707 MK7 SMT Reflow Oven 7 Heating ZonesMax PCB Width: 56cmWeight: 1450KGDimension: 360x152x144cmProduct description: Heller 1707 MK7 SMT Reflow Oven, 7 Heating Zones, Max PCB Width: 56cm, Weight: 1450KG, Dimension: 360x152x144cm Heller
ASCEN-PCB multi cutter separator applies to automatic online separate the PCB board. High efficiency multi cutter PCB depeneling machine can directly connect the reflow oven and pick and the pick and place machine on the SMT production line. Th
Electronics Forum | Thu Aug 11 12:45:42 EDT 2016 | anhsang38
Dear All I have a question for the reflow machine. I'm using Vitronics(Mr933+)reflow. The peak temperature of the (Chip, LED, SOT) component higher than (QFP,LGA) about 4 degree when i measured proflie. All of them on the same board . I don't know w
Electronics Forum | Fri Oct 08 10:08:48 EDT 1999 | Glenn Robertson
| | | | I have a board, 4 spacers needed to be soldered on the board | | | | first with the normal 62Sn37Pb alloy. Then, capacitors are manually soldered on the boards. The density of the board is quite high. If we wave soldered capacitors first,
Used SMT Equipment | Soldering - Reflow
1. This product is made of imported stainless steel materials from Japan and is enclosed with the original Nano insulation materials from the United States. 2. This product has an extremely long service life. The general time is three to five years
Used SMT Equipment | Soldering - Reflow
Heller REFLOW OVEN MK3 2013 Condition: 2013 USED Standard type Feel free to contact me if interested!! Availability: Available on backorder The 1800 models support high mix / high volume throughput… at speeds up to 32 inches (80 centimeters) per min
Industry News | 2005-09-19 16:07:56.0
No higher temperature and No process changes needed
Industry News | 2018-10-18 08:42:00.0
Reflow oven zone temperature set up and thermal profile
Parts & Supplies | Soldering - Reflow
Brand New SMT2010 TABLE-TOP REFLOW OVEN LEAD-FREE Description: This is a brand new, SMT2010 Reflow oven. More and more surface mount devices (SMD) are used on electronic circuit boards. Large floor model reflow ovens are expensive and heavy, no
Technical Library | 2013-01-24 19:16:35.0
The electronics industry has mainly adopted the higher melting point Sn3Ag0.5Cu solder alloys for lead-free reflow soldering applications. For applications where temperature sensitive components and boards are used this has created a need to develop low melting point lead-free alloy solder pastes. Tin-bismuth and tin-bismuth-silver containing alloys were used to address the temperature issue with development done on Sn58Bi, Sn57.6Bi0.4Ag, Sn57Bi1Ag lead-free solder alloy pastes. Investigations included paste printing studies, reflow and wetting analysis on different substrates and board surface finishes and head-in-pillow paste performance in addition to paste-in-hole reflow tests. Voiding was also investigated on tin-bismuth and tin-bismuth-silver versus Sn3Ag0.5Cu soldered QFN/MLF/BTC components. Mechanical bond strength testing was also done comparing Sn58Bi, Sn37Pb and Sn3Ag0.5Cu soldered components. The results of the work are reported.
Technical Library | 2014-06-26 16:43:12.0
Edgebond adhesives have been widely used by the industry for improving the shock performance of area array packages. Most of the studies focus on the impact of material properties, such as coefficient of thermal expansion (CTE) and glass transition temperature (Tg), on reliability at room temperature. However, the operating temperature of a component on the printed circuit board bonded with edgebond adhesive can be close to or exceed Tg of the adhesive, where the material properties may be very different than at room temperature.
· What is the difference between SMT vacuum reflow soldering machine and ordinary reflow soldering machine? · What problems can be solved by smt vacuum reflow soldering machine? · What is the basic principle of vacuum reflow machine? · Ho
High Performance Reflow Soldering Oven ❙ Introduce of Reflow Oven High performance reflow soldering oven, SMT reflow oven, soldering oven, SMD soldering machine, for soldering surface mount components to a printed circuit board or PCB. 1.
Events Calendar | Mon Nov 19 00:00:00 EST 2018 - Mon Nov 19 00:00:00 EST 2018 | ,
Hand Soldering & De-Soldering with Lead-Free Solder - Webinar
Events Calendar | Tue Apr 13 00:00:00 EDT 2021 - Tue Apr 13 00:00:00 EDT 2021 | ,
Boston Chapter Webinar: Cleaning Chemistry For PWB and Rework - Part 2, session 1
Career Center | Rocklin, California USA | Production
General Overview of Position With this new position Parallax aims to improve our USA manufacturing throughput in a time when most companies normally only send work offshore. This raises the standard for requiring efficient use of our Pick and Place
Career Center | INDIA, India | Engineering,Quality Control
BACHELOR OF ENGINEERING IN ELECTRICAL AND ELECTRONICS ENGINEERING EXPERIENCE IN SURFACE MOUNT MANUFACTURING TECHNOLOGY.
SMT Express, Issue No. 4 - from SMTnet.com Volume 1, Issue No. 4 Tuesday, September 14, 1999 Featured Article Return to Front Page MULTILAYER BOARD (MLB) CONSTRUCTIONS FOR HIGHEST LAMINATE INTEGRITY, DIMENSIONAL STABILITY, AND ELECTRICAL
Blackfox Training Institute, LLC | https://www.blackfox.com/blackfox-courses/high-temp-soldering/
. The act of implementing HMP solder will require soldering temperatures that are higher than standard Sn/Pb eutectic solders. Manufacturers soldering at high temperatures need to be aware of a few simple rules to prevent catastrophic component or board failures
Imagineering, Inc. | https://www.pcbnet.com/blog/high-temperature-pcb-considerations-for-high-heat-applications/
. IS410, IS420, and G200 are some well-known examples. High Temperature PCB Design Requires a High Degree of Expertise A higher Tg point equates to a higher temperature requirement during the lamination process, affecting both the printed circuit board
