Conveniently view and share profiles on mobile devices Software Description Auto-Focus Power™ is a ‘recipe search engine’ with an intelligent database Every manual profile will populate the database. The correlations between the oven properties,
Electronics Forum | Thu Apr 22 18:02:04 EDT 2004 | davef
Could you be looking for this: http://www.assemblymag.com/CDA/ArticleInformation/features/BNP__Features__Item/0,6493,108063,00.html
Electronics Forum | Thu Apr 22 20:49:01 EDT 2004 | bunmiog
... or this http://www.smtnet.com/express/199908/bgarework/index.cfm?cfid=40896&cftoken=34317412
Industry News | 2011-05-03 22:50:52.0
Assemblers who have tried to resolve problems that stem from the rapidly growing array of advanced packages are getting some help from IPC with the newly released IPC-7093, Design and Assembly Process Implementation for Bottom Termination Components. This standard describes the critical design, assembly, inspection, repair, and reliability issues associated with bottom termination components (BTCs) whose external connections consist of metallized terminals that are an integral part of the component body.
Industry News | 2019-03-10 20:30:11.0
The proliferation of tighter microvia densities and signal integrity requirements in printed boards within the electronics industry has revealed reliability concerns with microvia structures in high performance products. A number of IPC OEM member companies have approached IPC with examples of microvia failures in high-profile hardware that were not observed until after bare printed board fabrication, inspection and acceptance, including:
SMT Express, Volume 2, Issue No. 9 - from SMTnet.com Volume 2, Issue No. 9 Thursday, September 14, 2000 Featured Article Return to Front Page Reflow Profiling The Benefits of Implementing a Ramp-to-Spike Profile by David Suraski /AIM
INSERT INTO tracking_express (userid, username, page_id, ts) VALUES ('#Quser_profile.id#', '#Quser_profile.username#', 8, (#ts#)) SMT Express, Volume 2, Issue No. 1 - from SMTnet.com Volume 2, Issue No. 1 Thursday, January 20, 2000
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/Vacuum-Void-Reduction-Reflow-1.pdf
. Recommendations are made for further work based on other void reduction methods and additional reliability studies. Key words: Solder joint voiding, vacuum reflow processing, thermal fatigue reliability, thermal cycling, lead-free alloys
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/footprint-for-solderable-jumper_topic2089.html
) There are versions of this footprint. 1. without any solder paste for an open solderable jumper 2. with solder paste over both pads and the gap between the pads for a close jumper after reflow A resistor would be something like "RESC1608X70" Is there any naming convention or recommendations for both footprints
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