Industry Directory | Manufacturer
Established in 2003,Shenzhen Keyou PCB Co. Ltd is a professional high-tech factory that is engaged in PCBs manufacturing,including high-precision double sided and multilayer circuit boards from China.
Small but powerful reflow oven. 300 mm process width. Sophisticated zone separation between zones enables profiles that are normally possible only on larger and much more expensive systems. Small footprint 2.0x0.7 m. 4 zone convection 300 mm sold
New Equipment | Solder Materials
Introducing LF-4300 (lead-free) and 4300 (tin-lead), two revolutionary synthetic solder pastes that offer such unparalleled versatility and forgiveness, we still don’t believe it. Both the LF-4300 and the 4300 offer true multi-process capabilities,
Electronics Forum | Wed Jul 16 03:03:36 EDT 2008 | lococost
if it's still under warranty, why dont you let essemtec fix it?
Electronics Forum | Tue Jul 15 12:11:22 EDT 2008 | gabriella
Hello, I would remove a link, if I was you. As I can hear from you their support is not good anyway(if it is in warranty, they should help you, wright?).
Used SMT Equipment | Soldering - Reflow
This machine is included in an online auction. Please visit the following website for more details on this machine. http://bajabid.hibid.com/catalog/116587/wyndsor-sealed-bid-auction/?tab=0&q=8
Used SMT Equipment | Soldering - Reflow
2022 Essemtec RO300FC Reflow Oven Demo Never Used in Production Reflow Oven The Essemtec RO300FC is a full convection reflow oven designed for the reflow soldering of lead-free solder pastes and the curing of adhesives. Here are some key features
Industry News | 2009-01-23 19:18:23.0
You are invited to submit a paper to the electronic industry's premier forum on the manufacture of electronic products utilizing surface mount and related technologies.
Industry News | 2015-11-25 16:58:05.0
On behalf of the SMTA International Technical Committee, we invite you to submit a 300 word abstract of your research for the 2016 SMTA International 2016 technical conference in Rosemont, Illinois. Papers should describe significant results from experiments, emphasize new techniques, and contain technical, economic or appropriate test data. We are looking for papers on a variety of topics related to electronics manufacturing including advanced packaging/components, assembly, business/supply chain, emerging technologies, harsh environment applications, PCB technology, and process control. Materials must be original, unpublished and non-commercial in nature.
Technical Library | 2014-06-19 18:13:23.0
For high-density electronic packaging,the application of flip-chip solder joints has been well received in the microelectronics industry. High-lead(Pb) solders such as Sn5Pb95 are presently granted immunity from the RoHS requirements for their use in high-end flip-chip devices, especially in military applications. In flip-chip technology for consumer electronic products, organic substrates have replaced ceramic substrates due to the demand for less weight and low cost. However, the liquidus temperatures of high-Pb solders are over 300°C which would damage organic substrates during reflow because of the low glass transition temperature. To overcome this difficulty, the composite solder approach was developed...
Career Center | karachi, Sind Pakistan | Engineering,Production,Quality Control
For Research and Development Centre: --------------------------------------- -Give Recommendations regarding the functionality & operational security aspects in the ongoing projects by analyzing the detailed operations & functions of the product. -Mo
High Reliability Lead-free Solder SN100C(Sn-0.7Cu-0.05Ni+Ge) High Reliability Lead-free Solder SN100C(Sn-0.7Cu-0.05Ni+Ge) While the situation varies from country to country, nearly one year after the EU RoHS Directive came into force
KD Electronics Ltd. | http://www.kundasmt.com/?A-Equipment-Accessories/6009.html
breaker 5SX2/3pol/20A-AC 03043686-02 Trailing cable distributor sector 1 03043687-02 Trailing cable distributor sector 2 03043700S01 Instep lock / Z-axis 03043707-02 Souns absorber complete / C
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/best_papers.cfm
. Benlih Huang and Dr. Ning-Cheng Lee, Indium Corporation of America "Low Cost Solder Bumping Via Paste Reflow" 2000: N.P. Kim, M.J. Holland, C.-P. Chien, and M.H. Tanielian, Boeing Corporation
