Industry Directory | Manufacturer
Reflow ovens for automated SMT PCB assembly, specializing in lead free processing and nitrogen reflow. The best convection reflow ovens on the market.
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1809 MK5 - Heller Advanced In-Line Vacuum Reflow Oven Nitrogen System with Balanced Flow Technology 9 Top And Bottom Heated Zones - highest zone count per linear foot in the industry! 100" Heated Length - for super throughput! 2 Internal C
Flux Free Formic Reflow Reflow in Formic Acid Vapor Heller has designed and built an production ready horizontal reflow oven for formic acid vapor. This new oven has been designed to meet Semi S2/S8 safety standards (including toxic gases). Form
Electronics Forum | Fri Mar 27 17:26:36 UTC 2026 | SMTA-74487602
Curious what everyone is using in terms of their reflow profiler. I've used KIC and ECD and liked KIC way better due to the predictive features that helped you optimize your profile. Was recently at APEX and saw SolderStar and was pretty impressed
Used SMT Equipment | Soldering - Reflow
12 Heat Zones Voltage: 400V Max PCB size: 18" Feed Direction: L-R Additional Options: EHC, CBS, CE, Gen 5.1
Used SMT Equipment | Soldering - Reflow
8 Heat Zones Voltage: 480V Max PCB size: 18" Feed Direction: L-R Additional Options: EHC
Industry News | 2013-08-15 20:58:22.0
Heller Industries announced today that they have entered into a joint development agreement with International Business Machines Corporation (NYSE: IBM), to collaborate on the development of fluxless mass reflow furnace equipment and process for high volume manufacturing. The fluxless process utilizes gas phase formic acid to replace standard fluxing agents, and eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps.
Industry News | 2017-09-16 02:29:39.0
Heller Industries has been awarded the 2017 Global Frost & Sullivan Company of the Year Award for its surface mount technology (SMT) soldering equipment that enables Industry 4.0. - the automation and data exchange in manufacturing technologies.
Technical Library | 2023-01-17 17:19:44.0
A test program was developed to evaluate the effectiveness of vacuum reflow processing on solder joint voiding and subsequent thermal cycling performance. Area array package test vehicles were assembled using conventional reflow processing and a solder paste that generated substantial void content in the solder joints. Half of the population of test vehicles then were re-processed (reflowed) using vacuum reflow. Transmission x-ray inspection showed a significant reduction in solder voiding after vacuum processing. The solder attachment reliability of the conventional and vacuum reflowed test vehicles was characterized and compared using two different accelerated thermal cycling profiles. The thermal cycling results are discussed in terms of the general impact of voiding on solder thermal fatigue reliability, results from the open literature, and the evolving industry standards for solder voiding. Recommendations are made for further work based on other void reduction methods and additional reliability studies.
Technical Library | 2020-01-28 00:23:58.0
This paper explores new advances in the reflow soldering process including vacuum technology and warpage mitigation systems. The first topic for discussion will be the implementation of a vacuum process directly in a conventional inline soldering system. The second topic presented is the mitigation of warpage on substrates or wafers.
1809 MK5 - Heller Advanced In-Line Vacuum Reflow Oven Nitrogen System with Balanced Flow Technology 9 Top And Bottom Heated Zones - highest zone count per linear foot in the industry! 100" Heated Length - for super throughput! 2 Internal C
Nano-copper sintering in formic acid vapor.
Training Courses | | | IPC J-STD-001 Expert (CSE)
The IPC J-STD-001 CSE program confirms that an individual has demonstrated the level of knowledge and understanding required to act as a subject matter expert for the IPC J-STD-001 standard.
Training Courses | ON DEMAND | | IPC J-STD-001 Trainer (CIT)
The Certified IPC J-STD-001 Trainer (CIT) courses prepare individuals as qualified trainers in the area of producing high quality soldered interconnections and prepares them to deliver Certified IPC J-STD-001 Specialist (CIS) training.
Events Calendar | Sun Apr 11 18:30:00 UTC 2021 - Sun Apr 11 18:30:00 UTC 2021 | ,
Europe Chapter Webinar: Tombstoning Components during Reflow Soldering - Causes & Cures
Events Calendar | Sun Apr 05 18:30:00 UTC 2020 - Sun Apr 05 18:30:00 UTC 2020 | ,
Reflow Simulation – X-ray & Optical Help Solves Design & Process
Career Center | Rolling Meadows, USA | Quality Control
Technical Trainer Professional solder training company is seeking individual to teach solder skills-based training as well as other electronics assembly courses. Individual should be able to communicate effectively with others. Training or teaching
Career Center | , Tirane New Zealand | Engineering,Production
We require a fully qualified SMT Engineer to take up the challenge of moving our SMT from great to world class as part of our Process Engineering Team. Reporting to the Engineering Manager the ideal candidate will have a proven track record (5 - 10 y
Career Center | KANPUR, UTTAR PRADESH India | Engineering,Management,Production
1)Responsible for Implementation of Process Control of SMT /Thru hole components assembly consisting of packages like BGA,MICRO BGA,QFP,PLCC and similar packages on the PCB�s/hybrids, wave soldering as well as reflow soldering processes., Testing of
Career Center | Flower Mound, Texas USA | Engineering,Management,Production,Quality Control,Research and Development,Technical Support
SMT and THT Soldering Process Optimization Working knowledge of MPM Screen Printers, Fuji and Siemens Placement Equipment, BTU, ERSA and Vitronics Reflow Ovens, Camalot 3500 Underfill Dispense Machine, SEHO and Electrovert Wave Soldering Systems
Featured Article Return to Front Page REFLOW SOLDERING
SMT Express, Volume 4, Issue No. 5 - from SMTnet.com Volume 4, Issue No. 5 Thursday, May 23, 2002 Featured Article Return to Front Page Book Review Reviewed by Dave Fish (davef ), Pandion Electronics, Inc. Title: Reflow Soldering
Heller Industries Inc. | https://hellerindustries.com/heller/formic-acid-reflow-process/
Curing Applications Low Void Curing SW and Automation Videos & Articles White Papers & Technical Articles Videos Thermal Process Solutions Reflow Soldering Solutions Causes & Defects
Heller 公司 | https://hellerindustries.com.cn/bit_news/heller-industries-announces-joint-development-agreement-with-ibm-for-fluxless-mass-reflow-soldering-process-for-high-volume-manufacturing/
Heller Industries Announces Joint Development Agreement with IBM for Fluxless Mass Reflow Soldering Process for High Volume Manufacturing - 电子邮件: jchen@hellerindustries.com.cn 电话: +86-21-64426180 公司 关于 新闻 事件 新设备 回流焊炉 双轨/双温度控制 固化和后端半导体 零空洞/真空炉 无助焊剂/酸性
