that has fully reflowed is very square to the board
SMT Express, Volume 4, Issue No. 5 - from SMTnet.com Volume 4, Issue No. 5 Thursday, May 23, 2002 Featured Article Return to Front Page Book Review Reviewed by Dave Fish (davef ), Pandion Electronics, Inc. Title: Reflow Soldering
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/best_papers.cfm
: Shatil Haque, Lumileds Lighting (Malaysia) Sdn. Bhd. "Packaging of High-Power LEDs Using Au Stud Bump Interconnects" 2004: Chrys Shea, Cookson Electronics "Optimizing Stencil Design for Lead-free SMT Processing" 2003
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/ball-shear-solder-ball-shear?con=t&page=4
. Shear testing is in accordance with: JEDEC JESD22-B116 - Au Ball Shear JEDEC JESD22-B117 – Solder Ball Shear ASTM F1269 - Ball Bond Shear The position of shear tool during testing is critical for accurate and repeatable test results
