Industry Directory | Manufacturer
Global supplier of advanced thermal processing equipment and processes to the electronics assembly market.
New Equipment | Solder Paste Stencils
Eliminate hours of solder mask damage repair time for bga sites while improving rework yield. Are you frustrated by the time it takes to repair mask damage underneath the BGA during the rework process? Are you squeezed for space on the PCB in an
Reflow oven with five (5) top and five (5) bottom vertical heating zones, the ERO-500 is an economic solution for low to medium volume production runs. Utilizing plenum convection heating technology, the ERO-500 provides uniform temperature profilin
Electronics Forum | Tue Nov 21 12:35:59 EST 2006 | CK the Flip
It probably depends on the Silver content. We are also using Sn62Pb36Ag2. The paste manufacturer told us that the reason for the small silver content was so that it could wet better to the lead-free component and board finishes bearing silver.
Electronics Forum | Mon Jun 17 19:10:04 EDT 2013 | hegemon
You have not mentioned exactly how the BGA was reflowed onto the board. Was it sent through the oven again after the mini-stencil, or was it heateed up and reflowed using a BGA rework station, or other hot air device?? From the sound of it (outside
Used SMT Equipment | Soldering - Reflow
Heller REFLOW OVEN MK3 2013 Condition: 2013 USED Standard type Feel free to contact me if interested!! Availability: Available on backorder The 1800 models support high mix / high volume throughput… at speeds up to 32 inches (80 centimeters) per min
Used SMT Equipment | Turnkey Lines
Functional Pre-Owned Complete SMT Assembly Line - Still Operational (Subject to prior sell, I am listing this on other venues) Up for sale is a full turnkey SMT line and all of it's accessories, of which there are a lot, fe
Industry News | 2022-12-14 12:21:04.0
MIRTEC will premier its complete line of 3D AOI and SPI Inspection Systems in Booth #1841 at the 2023 IPC APEX EXPO. The premier technical conference and exhibition for the electronics manufacturing industry will take place Jan. 24-26, 2023, at the San Diego Convention Center in California.
Industry News | 2023-04-11 09:52:04.0
MIRTEC will premier its complete line of 3D AOI and SPI Inspection Systems at SMTconnect, scheduled to take place May 9-11, 2023 in Nuremberg, Germany. The company will showcase a total of five (5) Inspection Systems specifically designed to address the full spectrum of inspection requirements associated with the electronics manufacturing industry in Hall 4A, Stand 128.
Technical Library | 2021-09-29 13:35:21.0
In PCB circuit assemblies the trend is moving to more SMD components with finer pitch connections. The majority of the assemblies still have a small amount of through hole (THT) components. Some of them can't withstand high reflow temperatures, while others are there because of their mechanical robustness. In automotive applications these THT components are also present. Many products for cars, including steering units, radio and navigation, and air compressors also use THT technology to connect board-to-board, PCB's to metal shields or housings out of plastic or even aluminium. This is not a simple 2D plain soldering technology, as it requires handling, efficient thermal heating and handling of heavy (up to 10 kg) parts. Soldering technology becomes more 3D where connections have to be made on different levels. For this technology robots using solder wire fail because of the spattering of the flux in the wires and the long cycle time. In wave soldering using pallets the wave height is limited and pin in paste reflow is only a 2D application with space limitations. Selective soldering using dedicated plates with nozzles on the solder area is the preferred way to make these connections. All joints can be soldered in one dip resulting in short cycle times. Additional soldering on a small select nozzle can make the system even more flexible. The soldering can only be successful when there is enough thermal heat in the assembly before the solder touches the board. A forced convection preheat is a must for many applications to bring enough heat into the metal and board materials. The challenge in a dip soldering process is to get a sufficient hole fill without bridging and minimize the number of solder balls. A new cover was designed to improve the nitrogen environment. Reducing oxygen levels benefits the wetting, but increases the risk for solder balling. Previous investigations showed that solder balling can be minimized by selecting proper materials for solder resist and flux.
DescriptionThe Electrovert® Electra™ is an advanced, meticulously engineered wave soldering system designed for high-mass and high-volume manufacturers. Although intended for maximum throughput requirements, the Electra also offers maximum process fl
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
SMTnet Express, August 26, 2021, Subscribers: 26,759, Companies: 11,431, Users: 26,816 Low Melting Temperature Sn-Bi Solder: Effect of Alloying and Nanoparticle Addition on the Microstructural, Thermal, Interfacial Bonding
SMTnet Express, May 13, 2021, Subscribers: 27,139, Companies: 11,353, Users: 26,641 Low Melting Temperature Sn-Bi Solder: Effect of Alloying and Nanoparticle Addition on the Microstructural, Thermal, Interfacial Bonding
Heller Industries Inc. | https://hellerindustries.com/parts/3683k/
3683K - TEMPERATURE CONTROL CAL-3200 Phone 1-973-377-6800 Company About News Events New Equipment Convection Reflow Ovens Reflow Oven MK7 -New
| https://www.smtfactory.com/What-is-the-function-of-the-temperature-and-humidity-sensor-in-Lyra-Reflow-Oven-id44562477.html
paste solder pre-allocated on the printed board pads. . This kind of Lyra Reflow Oven has a heating circuit inside, which heats air or nitrogen to a high enough temperature and blows it to the circuit board where the component is already attached, so that