Manufacturer of thermocouples, thermocouple wire, RTD's, temperature sensors.
Industry Directory | Manufacturer
Established in 1983, Therm-x takes pride in delivering thermal solutions incorporating our vertical integration capabilities including; Thermal Design and Test, CNC Machining, Metal Joining, Sheet Metal Manufacturing & more...
Heller 1707 MK7 SMT Reflow Oven 7 Heating ZonesMax PCB Width: 56cmWeight: 1450KGDimension: 360x152x144cmProduct description: Heller 1707 MK7 SMT Reflow Oven, 7 Heating Zones, Max PCB Width: 56cm, Weight: 1450KG, Dimension: 360x152x144cm Heller
Main product: SMT Assembly Reflow Oven, SMT Hot Air Reflow Oven, Lead Free Reflow Oven, SMT Reflow Oven, SMT Mounting Machine, Elctronic Equipment, PCB Machine, reflow oven, SMT Assembly, SMT/SMD Equipment, PCB Printer, screen printing SMT assembly
Electronics Forum | Sun Jan 17 22:16:04 EST 2016 | cmarasigan
We are using KIC (kicthermal.com) in reflow profiling. It uses thermocouple wires about 0.5 meter only each point. Previously, Winkic the machine built in software which requires about 5 meters wire. No need for the operator to stand there and feed t
Electronics Forum | Wed Jan 13 11:13:56 EST 2016 | proceng1
I'm asking about how to manage the long wires. I don't understand how your suggestion applies.
Used SMT Equipment | Soldering - Reflow
Still running production unit new unit delivered before the end of the year. The Heller 1809 MK5 is a reflow soldering system used in electronics manufacturing. Here are some key specifications and features: Model: 1809 MK5 Heating Zones: 9 Zones
Used SMT Equipment | Soldering - Reflow
Heller REFLOW OVEN MK3 2013 Condition: 2013 USED Standard type Feel free to contact me if interested!! Availability: Available on backorder The 1800 models support high mix / high volume throughput… at speeds up to 32 inches (80 centimeters) per min
Industry News | 2003-03-26 08:25:40.0
The QVE00033 transmissive switch's small size, surface mount package and performance make it ideal for noncontact switching applications in disk drives, card detectors, mise and trackballs.
Industry News | 2005-09-19 16:07:56.0
No higher temperature and No process changes needed
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Parts & Supplies | Pick and Place/Feeders
HELLER - SPARE PARTS HC1 TEMPRERATURE CONTROLLER .HC1 Rotary Encoder Heller ..E40H12-200-6-L-B Motor for Heller oven ..86YSY80-2 HEATER OF HELLER ..HEATER OF HELLER Reflow Heller Heater ..HL-255 Heller Motor JF1F071N Encoder
Parts & Supplies | Assembly Accessories
46564804 Universal AI Parts 46442717 Universal AI Parts 46364706 Universal AI Parts 46364705 Universal AI Parts 46191601 Universal AI Parts 46191501 Universal AI Parts 45989301 Universal AI Parts 45987901 Universal AI Parts 45711604 Universal
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2009-12-14 20:24:19.0
In the lead-free era, thermal profiling has a critical role in the SMT assembly process. We discuss the profiling, tools, practical issues, and inspection methods of golden boards, and related tools. As the process window narrows, profiling equipment and/or thermocouple (TC) errors must be taken into consideration. In addition, the accuracy and attachment method of the thermocouple will significantly impact critical assemblies.
slim kic 2000 Specifications: KIC 2000 Profiler * 9 Channels Slim Kit KIC 2000 Profiler * 9 Channels * Full Original Package, with original Thermal Couples, Protective Shield, Software, etc * Technical Support and Warranty from USA * Thermal Pr
SLIM KIC 2000 SPECIFICATIONS: KIC 2000 Profiler * 9 Channels Slim Kit KIC 2000 Profiler * 9 Channels * Full Original Package, with original Thermal Couples, Protective Shield, Software, etc * Technical Support and Warranty from USA * Thermal Pr
Training Courses | | | IPC J-STD-001 Trainer (CIT)
The Certified IPC J-STD-001 Trainer (CIT) courses prepare individuals as qualified trainers in the area of producing high quality soldered interconnections and prepares them to deliver Certified IPC J-STD-001 Specialist (CIS) training.
Training Courses | | | IPC J-STD-001 Trainer (CIT)
The Certified IPC J-STD-001 Trainer (CIT) courses prepare individuals as qualified trainers in the area of producing high quality soldered interconnections and prepares them to deliver Certified IPC J-STD-001 Specialist (CIS) training.
Events Calendar | Wed Jun 22 00:00:00 EDT 2022 - Wed Jun 22 00:00:00 EDT 2022 | ,
Empire Chapter Webinar: LIVE Action Reflow Focused Process
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Career Center | Oldsmar, Florida USA | Engineering,Maintenance,Production
Job Title: Assembler 2 – IPC 610 – 2nd Shift Address: 3655 Tampa Rd, Oldsmar FL 34677 Duration: 1 year Pay Rate: $15-$18 Hours: 9/80 schedule Monday –Thursday 3:30pm – 1:00am, Friday 2:30pm to 11:00pm Job Description: Performs a variety of dut
Career Center | Racine, Wisconsin USA | Engineering
Cree currently has a job vacancy for an SMT Process Technician in our Lighting Manufacturing facility in Racine, Wisconsin. Summary: This person will be a primary contributor to the startup of a new SMT production line for LED PCB Assembly. This
Career Center | binan city, Laguna Philippines | Engineering,Maintenance,Technical Support
6.5 Years Experience in Semiconductor Industry Specializing in Dispensing process and Equipment. 5.0 Years of Experience in Field Service Engineering. Machine Commissioning / Customer support 24 / 7, Technical Support for Customer machine and process
Career Center | san diego,, California USA | Engineering,Production,Quality Control,Technical Support
SMT Process Engineer, ISO-9001, IPC-600/610/620/7711/7721, J-STD-001, Thermal profiling, Lean manufacturing.
Evaluating The Accuracy Of a Nondestructive Thermocouple Attach Method For Area-Array Package Profiling Evaluating The Accuracy Of a Nondestructive Thermocouple Attach Method For Area-Array Package Profiling The oven recipe, which consists
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SMT Reflow Oven Reflow soldering process-SMT Technical-Reflow oven,SMT Reflow Soldering Oven-cmsadmin Reflow oven,SMT Reflow Soldering Oven 当前位置: Home >> News
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dima/processes/hot-bar-reflow-soldering-systems?con=t&page=4
. Making these connections simultaneously also prevents wires disconnecting while soldering the neighboring one. Hot Bar Reflow Soldering Benefits Fast temperature ramp-up and cool-down Closed loop temperature control Accurate positioning of the parts Multiple connections can be made simultaneously Cost
