New Equipment | Education/Training
This is a "real life" how to solder kit including both throughhole and SMT components. The board has ground planes that you would find in a real PCB assembly. Upon completion the sudents will have a working board. If you are trying to instruct new
New Equipment | Solder Materials
90% on area ratios of 0.50 and a stencil life >8 hours. H10’s powerful wetting characteristics eliminate NWO (HiP) defects and improve pad coverage on all surface finishes. H10 reduces voiding on BGA, BTC and LGA and offers enhanced electrochemical r
Electronics Forum | Mon Jul 22 01:05:14 EDT 2002 | lysik
Try George King at SCI in Hunsville AL. the have done so much stuff for the military since 196?. Plant 1 is al about HI REL and MIL SPEC. they do small jobs as well as big jobs.
Electronics Forum | Thu Oct 09 22:57:10 EDT 2008 | dphilbrick
Customer Specification, parts must be certified to have no less than 3% lead content on the lead prior to attach! It's a Hi Rel Mil Spec FAR Clause in the RFQ.
Used SMT Equipment | General Purpose Test & Measurement
Agilent-Keysight E5515C-002-003-E1962B-E1968A-201 8960 Series 10 Wireless Communications Test Set The industry standard for high-speed, accurate and reliable RF measurements, coupled with flexible network emulation The Agilent E5515C hardware
Used SMT Equipment | In-Circuit Testers
Agilent-Keysight E5515C 8960 Series 10 Wireless Communications Test Set The industry standard for high-speed, accurate and reliable RF measurements, coupled with flexible network emulation The Agilent E5515C hardware platform for the 8960 wir
Industry News | 2009-05-11 11:22:26.0
Balver Zinn Group has named LAPA Enterprises as manufacturer's representative for the leading Balver Zinn and Cobar brands for North California and Northern Nevada.
Industry News | 2022-08-26 09:15:23.0
SHENMAO America, Inc. will exhibit at the SMTA Guadalajara Expo & Tech Forum, scheduled to take place Sept. 21-22, 2022, at the Expo Guadalajara in Jalisco, Mexico. The company will showcase its PF918-P250 Thermal Fatigue Resistance Lead-free Solder Paste. The new paste can increase thermal reliability performance by a minimum of 30 percent.
Parts & Supplies | Other Equipment
6ES7 312-1AD10-0AB0 6ES7 312-5BD01-0AB0 6ES7 313-5BE01-0AB0 6ES7 313-6BE01-0AB0 6ES7 313-6CE01-0AB0 6ES7 314-1AF11-0AB0 6ES7 314-6BF02-0AB0 6ES7 314-6CF02-0AB0 6ES7 315-2AG10-0AB0 6ES7 315-2EG10-0AB0 6ES7 315-6
Rohde & Schwarz CMU200 Loaded with Options THIS UNIT INCLUDES OPTIONS: B12,B21,B54,B56,B68,B96,U99.U65,K16,K17,K20,K21,K22,K23,K24,K29,K42,K43,K47,K48,K53,K57,K58,K59,K61,K62,K63,K64,K65,K66,K67,K68 Rohde & Schwarz CMU200 Universal Radio Commun
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/hu-HU/divisions/efd/resource-center/solder-selection-guide
minőséget. Kisebb méretű por használata csak többe kerül. PORMÉRET Por típusa Por mérete (mikron) Sirályszárny menetemelkedés (mm/hüvelyk) Négyzet/kör alakú nyílás (mm/hüvelyk) Adagolási pont átm. (mm/hüvelyk) Általános célú adagolóhegy mérete (gauge) Kúpos adagolóhely mérete (gauge) II 45-75 µ 0.65 / 0.025 0.65 / 0.025 0.80 / 0.030 21 22 III 25-45
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
., Nathan Blattau, Ph.D., Joelle Arnold, and Craig Hillman, Ph.D. Abstract 23-1 Solder Joint Reliability Analysis and Testing of a Dual Row QFN Package Luke England, et al. Abstract 2009 22-4 Evaluation of Lead-free Solders, Halogen-free Laminates, and
