Electronics Forum | Wed May 21 12:26:24 EDT 2003 | Michael Ling
If I need to test whether our products can withstand the solder reflow process, is there any tests that I can perform other than putting the products through the actual relfow process.
Electronics Forum | Thu Jun 19 12:47:47 EDT 2003 | russ
I would believe that the connector spec is for the max temp that it can withstand while the paste is the max temp that you need to achieve. Solder balls are usually from excessive ramp rates in the oven. I would contact the connector mfg. and see wh
Parts & Supplies | Soldering - Reflow
decommissioned from an HVC70 Series Conceptronic relfow oven FOB: MN
