Industry Directory | Manufacturer
DriSteem provides reliable and efficient humidity control, evaporative cooling, and water treatment solutions for commercial and industrial applications.
Industry Directory | Manufacturer
Flason is high-tech enterprise focusing on SMT research and development,building new advanced solutions in SMT Assembly machines, like reflow oven, wave soldering machine, pick and place machine, AOI,SPI,PCB conveyor etc.
Retrofit existing system with Innovative Dispensing Technology for Excellent Dispense Control and Repeatability Advanced pump technologies available for retrofitting include: True Volumetric Pump, Precision Auger Pump, Simplified Jetting Pump and Ti
Jetting Simplified Jetting pumps are excellent for dispensing small volumes of fluid at high rates of speed. The NCM5000 simplifies jetting to its basic elements - this means easy set up, cleaning, and maintenance for you. The drive system is design
Electronics Forum | Sat Jan 15 21:52:15 EST 2000 | Dave Bartlett
I am looking for information comparing the reliability of smt boards vs thru hole boards. Also, information on when to use thru hole instead of smt if there is such a case. Background - We currently make temperature controller with a mix or smt and
Electronics Forum | Fri May 07 17:02:01 EDT 1999 | Earl Moon
| On 1.27mm (0.050 inches) Standard Ball Grid Array's. | The ball size diameter starts at approximately 0.025 inches. | | If the ball size decreases to 0.012 inches (due to the solder flowing down a via) is the solder connection reliable? | | This
Used SMT Equipment | SMT Equipment
Model No：KS-6004-S Portable conveyor Cycle time：Approx 15seconds Power supply：100-230V AC (customized), single phase Power load：Max 150V/A Air pressure： 4-6 bar Air volume：MAX 10L/minute Transport height：900±20mm (or customized) Transport di
Used SMT Equipment | SMT Equipment
Product Name: Samsung EXCEN-PRO Product number: Samsung EXCEN-PRO Detailed product introduction Samsung EXCEN-PRO high speed chip mounter parameters EXCEN is equipped with 16 suction nozzles, rotary head of the high-speed modular chip mounter, it
Industry News | 2021-11-08 14:38:39.0
Heller Industries, a leading supplier of reflow soldering ovens for electronic manufacturing and pressure curing ovens for back-end semicondutor manufacturing, today announced they will be exhibiting their new MK7 reflow oven at the San Diego Conference Center January 25-27, 2022.
Industry News | 2016-06-22 15:33:28.0
Based on its recent analysis of the surface mount technology (SMT) reflow soldering equipment market, Frost & Sullivan recognizes Heller Industries, Inc. with the 2016 Global Frost & Sullivan Award for Growth Excellence Leadership. Heller Industries has made remarkable improvements to its product and technology portfolios over the last 10 years to emerge a top participant in the SMT reflow soldering equipment market.
Parts & Supplies | Tape and Reel
Product Description Pressure sensitive adhesive designed to adhere to both polystyrene and polycarbonate carrier tapes Excellent clarity Ultra smooth peel back Static dissipative on inner and outer layers All splice tape
Parts & Supplies | Adhesive Dispensers
ianHao Dispensing valve series is based on the fluid requirements of a variety of applications should be developed and designed, TianHao dispensing valve now has high precision, good stability, simple structure, easy maintenance And other characteris
Technical Library | 2023-01-17 17:12:33.0
Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU "die to lid/heat spreader" (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances.
Technical Library | 2023-09-16 06:29:26.0
Explore our range of reflow ovens designed to streamline your PCB assembly process. Achieve consistent and high-quality soldering for your electronic components.
http://www.gpd-global.com No drip no drool across a wide range of fluid viscosities (low-to-mid and low-to-high). No manual adjustment to compensate for pump variability. Truly Volumetric PCD Pumps for total control of dispensing fluids. Ability to
Jetting Simplified Jetting pumps are excellent for dispensing small volumes of fluid at high rates of speed. The NCM5000 simplifies jetting to its basic elements - this means easy set up, cleaning, and maintenance for you. The drive system is design
Training Courses | | | IPC-7711/7721 Specialist (CIS)
The Certified IPC-7711/7721 Specialist (CIS) training focuses on rework of electronic assemblies and repair and modification of printed boards and electronic assemblies.
Training Courses | | | IPC-7711/7721 Specialist (CIS)
The Certified IPC-7711/7721 Specialist (CIS) training focuses on rework of electronic assemblies and repair and modification of printed boards and electronic assemblies.
Events Calendar | Thu Mar 18 00:00:00 EDT 2021 - Thu Mar 18 00:00:00 EDT 2021 | ,
Silicon Valley Chapter Webinar: Electronics Reliability for Autonomous Vehicles
Events Calendar | Mon Dec 02 00:00:00 EST 2019 - Mon Dec 02 00:00:00 EST 2019 | ,
Webinar: QFN/LGA Design, Assembly Process Issues & Reliability Failures
Career Center | Austin, Texas USA | Engineering
KN Research is assisting it's award-winning high-tech client to fill a Staff Reliability Engineer position. We are seeking an experienced Reliability Engineer with strong skills in hands-on product failure analysis, field failure and internal failur
Career Center | Lenexa, Kansas USA | Engineering
IM091891 - Senior Electronic/Electrical Design & Development Engineer - Wisconsin Excellent engineering management opportunity with a leading manufacturer of mobile construction equipment. The Senior Design & Development Engineer will lead the dev
Career Center | Phoenix, Arizona | Engineering,Management,Production,Quality Control,Research and Development,Sales/Marketing,Technical Support
• Highly motivated, solution oriented professional with proven record synergizing scientific, engineering, and business administration backgrounds to drive and sustain customer satisfaction and long term improvements. • Articulate communicator that a
Career Center | , District of Columbia | Engineering,Management,Production,Sales/Marketing
• Strong technical leadership and decision-making skills; strong verbal and written communication skills to provide clear, crisp direction for key issue resolution; and good team skills to facilitate cross-functional cross -site team effectiveness.
Manufacturability & Reliability Challenges with Leadless Near Chip Scale (LNCSP) Packages in Pb-Free Processes Manufacturability & Reliability Challenges with Leadless Near Chip Scale (LNCSP) Packages in Pb-Free Processes by: Cheryl Tulkoff, Greg
Manufacturability & Reliability Challenges with Leadless Near Chip Scale (LNCSP) Packages in Pb-Free Processes Manufacturability & Reliability Challenges with Leadless Near Chip Scale (LNCSP) Packages in Pb-Free Processes Leadless, near chip scale
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/reflowevolution.pdf
Reflow Evolution Reduces Costs, Improves Reliability Reflow Evolution Reduces Costs, Improves Reliability New solder reflow technology is resulting in lower nitrogen consumption and significant cost
Imagineering, Inc. | https://www.pcbnet.com/blog/as9100-hdi-aerospace-applications/
AS9100: Reliability and PCB Material Selection for Aerospace Applications Skip to main content Resources Support Contact Us FAQs Live Chat My Account 847-806-0003 Menu PCB Capabilities Fabrication Technology
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