Industry Directory: remove copper from snpb solder bath (1)

Aoki Laboratories Ltd. [Solder Products Supplier]

Industry Directory | Manufacturer

Aoki Laboratories Ltd. is an ISO-9002 certified company specializes in manufacturing of Sn/Pb Bar Solder, Cored Wire and Paste.Environmental friendly products, such as: lead-free solder, no-clean non-halide solder flux, no-clean cored wire and Non-CFC cleaner, are compliance with ISO-14001 requirements.

New SMT Equipment: remove copper from snpb solder bath (22)

IPC-7711/21 Rework, Modification and Repair of Electronic Assemblies

IPC-7711/21 Rework, Modification and Repair of Electronic Assemblies

New Equipment | Education/Training

This guide includes everything needed for repair and rework of electronic assemblies and printed circuit boards! IPC-7711B/7721B Rework, Modification and Repair of Electronic Assemblies has received a complete procedure by procedure update to assure

BEST Inc.

SN100C - Lead-Free Solder Alloy

SN100C - Lead-Free Solder Alloy

New Equipment | Solder Materials

SN100C is a lead-free solder alloy developed by Nihon Superior in Japan that is comprised of tin-copper-nickel + germanium. SN100C offers user-friendly properties and has been proven in commercial production since 1999. The result of these advantages

AIM Solder

Electronics Forum: remove copper from snpb solder bath (185)

How to remove Oxides from older components? Fine Pitch

Electronics Forum | Thu Aug 06 19:20:09 EDT 2009 | boloxis

easy, just dip the ICs on a very weak solution of Nitric Acid, by very weak I mean like drops of Fuming Nitric acid in a half full DI water beaker. Place the beaker on a Ultrasonic bath and dip/shake the ICs in the solution in 5~ 10 seconds only. You

What is the best way to remove OSP coatings.

Electronics Forum | Tue Sep 11 22:52:18 EDT 2007 | davef

Here are some options for removing OSP coatings from pads of the BGA substrates. * Leave the substrates in storage for 13-14 months. Shelf life of OSP coating is ~12 months, depending on the product. * Wash the substrates in your aqueous washer. Ea

Industry News: remove copper from snpb solder bath (86)

SQC in Electronics Manufacturing

Industry News | 2003-06-10 08:16:44.0

The following text describes the application of NWA Quality Analyst to quality control in the assembly of electronic components.

SMTnet

Application of lead-free solder

Industry News | 2018-10-18 09:34:29.0

Application of lead-free solder

Flason Electronic Co.,limited

Parts & Supplies: remove copper from snpb solder bath (1)

Global Active Wave Soldering Machine GS350P

Global Active Wave Soldering Machine GS350P

Parts & Supplies | Soldering - Wave

Overseas Agent and Distributor Wanted ! Features : Spray Fiuxer: 1) Oriental motor drives the flux spraying system. Spraying speed is adjusted according to PCB board width and moving speed to ensure even spraying all time. 2) Durable “Meiji

Xtreme Marketing LLP

Technical Library: remove copper from snpb solder bath (2)

Solder Joint Reliability of Pb-free Sn-Ag-Cu Ball Grid Array (BGA) Components in Sn-Pb Assembly Process

Technical Library | 2020-10-27 02:07:31.0

For companies that choose to take the Pb-free exemption under the European Union's RoHS Directive and continue to manufacture tin-lead (Sn-Pb) electronic products, there is a growing concern about the lack of Sn-Pb ball grid array (BGA) components. Many companies are compelled to use the Pb-free Sn-Ag-Cu (SAC) BGA components in a Sn-Pb process, for which the assembly process and solder joint reliability have not yet been fully characterized. A careful experimental investigation was undertaken to evaluate the reliability of solder joints of SAC BGA components formed using Sn-Pb solder paste. This evaluation specifically looked at the impact of package size, solder ball volume, printed circuit board (PCB) surface finish, time above liquidus and peak temperature on reliability. Four different BGA package sizes (ranging from 8 to 45 mm2) were selected with ball-to-ball pitch size ranging from 0.5mm to 1.27mm. Two different PCB finishes were used: electroless nickel immersion gold (ENIG) and organic solderability preservative (OSP) on copper. Four different profiles were developed with the maximum peak temperatures of 210oC and 215oC and time above liquidus ranging from 60 to 120 seconds using Sn-Pb paste. One profile was generated for a lead-free control. A total of 60 boards were assembled. Some of the boards were subjected to an as assembled analysis while others were subjected to an accelerated thermal cycling (ATC) test in the temperature range of -40oC to 125oC for a maximum of 3500 cycles in accordance with IPC 9701A standard. Weibull plots were created and failure analysis performed. Analysis of as-assembled solder joints revealed that for a time above liquidus of 120 seconds and below, the degree of mixing between the BGA SAC ball alloy and the Sn-Pb solder paste was less than 100 percent for packages with a ball pitch of 0.8mm or greater. Depending on package size, the peak reflow temperature was observed to have a significant impact on the solder joint microstructural homogeneity. The influence of reflow process parameters on solder joint reliability was clearly manifested in the Weibull plots. This paper provides a discussion of the impact of various profiles' characteristics on the extent of mixing between SAC and Sn-Pb solder alloys and the associated thermal cyclic fatigue performance.

Sanmina-SCI

Analysis of Laminate Material Properties for Correlation to Pad Cratering

Technical Library | 2016-10-20 18:13:34.0

Pad cratering failure has emerged due to the transition from traditional SnPb to SnAgCu alloys in soldering of printed circuit assemblies. Pb-free-compatible laminate materials in the printed circuit board tend to fracture under ball grid array pads when subjected to high strain mechanical loads. In this study, two Pb-free-compatible laminates were tested, plus one dicycure non-Pb-free-compatible as control. One set of these samples were as-received and another was subjected to five reflows. It is assumed that mechanical properties of different materials have an influence on the susceptibility of laminates to fracture. However, the pad cratering phenomenon occurs at the layer of resin between the exterior copper and the first glass in the weave. Bulk mechanical properties have not been a good indicator of pad crater susceptibility. In this study, mechanical characterization of hardness and Young’s modulus was carried out in the critical area where pad cratering occurs using nano-indentation at the surface and in a cross-section. The measurements show higher modulus and hardness in the Pb-free compatible laminates than in the dicy-cured laminate. Few changes are seen after reflow – which is known to have an effect -- indicating that these properties do not provide a complete prediction. Measurements of the copper pad showed significant material property changes after reflow.

CALCE Center for Advanced Life Cycle Engineering

Videos: remove copper from snpb solder bath (8)

Pillarhouse Jade Pro Series

Pillarhouse Jade Pro Series

Videos

Ultra-flexible, offline, multi-platform selective soldering system Designed to meet the needs of the small batch manufacturer who requires high levels of production flexibility. The Jade Pro offers the ability to regularly change solder alloys witho

Pillarhouse USA

Pillarhouse Jade Pro Series

Pillarhouse Jade Pro Series

Videos

Ultra-flexible, offline, multi-platform, quick load twin PCB rotary table selective soldering system Designed to meet the needs of the small batch manufacturer who requires high levels of production flexibility. The Jade Prodex offers the ability to

Pillarhouse USA

Training Courses: remove copper from snpb solder bath (1)

IPC-A-600 Acceptability of Printed Boards Training and Certification Program

Training Courses | ON DEMAND | | IPC-600 Trainer (CIT)

The Certified IPC-600 Trainer (CIT) courses recognize individuals as qualified trainers in the area of quality assurance of bare printed circuit boards and prepare them to deliver Certified IPC-600 (CIS) training.

PIEK International Education Centre

Express Newsletter: remove copper from snpb solder bath (1135)

SMTnet Express - April 20, 2017

SMTnet Express, April 20, 2017, Subscribers: 30,402, Companies: 10,575, Users: 23,153 High Throw Electroless Copper - Enabling new Opportunities for IC Substrates and HDI Manufacturing Tobias Sponholz, Lars-Eric Pribyl, Frank Brüning, Robin Taylor

SMT Express, Issue No. 2 - from SMTnet.com

SMT Express, Issue No. 2 - from SMTnet.com Volume 1, Issue No. 2 Wednesday, July 14, 1999 Featured Article Return to Front Page THE LABORATORY A PRIMARY EVALUATION AND QUALIFICATION FACTOR TO DETERMINE PCB SUPPLIER PROCESS CAPABILITIES Earl

Partner Websites: remove copper from snpb solder bath (129)

Solder Selection Guide

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-selection-guide

(Restriction of Hazardous Substances) directive and sometimes it is a corporate directive. Some applications that fall under the RoHS directive are exempt from being lead-free because the reflow temperature requirements can only be met with high-lead solder alloys which are exempt under RoHS regulation

ASYMTEK Products | Nordson Electronics Solutions

SN100C Lead-Free Bar Solder

| https://pcbasupplies.com/sn100c-lead-free-bar-solder/

. NT100Ge can be used as a drop-in replacement for any existing 99C or SN100C solder bath, without the need for pot dumps or swaps.  There are no videos yet There are no downloads yet More From PCBASupplies A supplier of PCB assembly and final assembly products including unique, hard to find, or new to market supplies. Sn63 Solder Bar


remove copper from snpb solder bath searches for Companies, Equipment, Machines, Suppliers & Information

Sm t t t t t t t t t t net
  1 2 3 4 5 6 7 8 9 10 Next
used smt parts china

Nozzles, Feeders, Spare Parts - Siemens, Fuji, Juki, Yamaha, etc...
SMT spare parts - Qinyi Electronics

Reflow Soldering 101 Training Course
Win Source Online Electronic parts

Software for SMT placement & AOI - Free Download.
PCB Handling Machine with CE

Training online, at your facility, or at one of our worldwide training centers"