Industry Directory | Manufacturer
PCB Repairs of all kinds including-Solder on Tab (Solder Removal, Gold Plating), PTH & Delam repairs, etc.
Industry Directory | Manufacturer
2Layers - 18Layers ;HASL, OSP, Gold plating, immersion Gold/Silver/Tin, removable mask, gold-finger, carbon ink;Conact Person:Rene E-mail:rene@speedingcircuit.com Website:www.speedingcircuit.com
Hitachi GXH SIGMA feeder SMT Feeder Hitachi GXH SIGMA feeder Hitachi chip mounter GXH SIGMA feeder Hitachi pick and place machine GXH SIGMA feeder Product description: Hitachi GXH SIGMA feeder INQUIRY Hitachi GXH SIGMA feeder
New Equipment | Assembly Services
G9 + automatic vision printing machine is a new product for SMT high-end application field, which can perfectly meet the process requirements of 03015, 0.25pich and other fine spacing, high precision and high speed. Introduction to standard function
Used SMT Equipment | THT Equipment
High temperature, lead-free Solder Fountain used for removal and replacement of through-hole components
Used SMT Equipment | Soldering - Wave
Speedline Technologies Electrovert EPK Gold Wave Solder Machine - just removered from production in working conditon. Currently in production and available now. 11/2005 DOM, 208VAC 3 Phase Power, Reciprocating Spray Fluxer, L to R Board Flow, Heavy D
Industry News | 2018-10-18 11:08:03.0
Different Techniques for Plating
Industry News | 2016-06-15 20:20:37.0
The first ever Rework Experience Competition was held at this year’s SMT Hybrid Packaging international exhibition and conference. This competition tested competitor’s skills in reworking a finished printed circuit board. There were seven total competitors and all seven successfully completed the challenge. Ljupce Talevski, from Aluwave AB took first place. In second place was Ekatarina Stahlmann from Grundig Business Syst. Coming in third place was Conny Hielscher from Grundig Business Syst.
Technical Library | 1999-05-07 11:28:39.0
There are many things that can go wrong when soldering to gold plate over nickel surfaces. First of all, we know that gold and solder are not good friends, as any time solder comes into contact with gold, something seems to go wrong. Either the solder bonds to the gold and eventually pulls off as the tin and gold cross-migrate, leaving voids; or the solder completely removes the gold and is expected to bond to the metal which was under the gold.
Technical Library | 2020-08-27 01:22:45.0
Initially adopted internal specifications for acceptance of printed circuit boards (PCBs) used for wire bonding was that there were no nodules or scratches allowed on the wirebond pads when inspected under 20X magnification. The nodules and scratches were not defined by measurable dimensions and were considered to be unacceptable if there was any sign of a visual blemish on wire-bondable features. Analysis of the yield at a PCB manufacturer monitored monthly for over two years indicated that the target yield could not be achieved, and the main reasons for yield loss were due to nodules and scratches on the wirebonding pads. The PCB manufacturer attempted to eliminate nodules and scratches. First, a light-scrubbing step was added after electroless copper plating to remove any co-deposited fine particles that acted as a seed for nodules at the time of copper plating. Then, the electrolytic copper plating tank was emptied, fully cleaned, and filtered to eliminate the possibility of co-deposited particles in the electroplating process. Both actions greatly reduced the density of the nodules but did not fully eliminate them. Even though there was only one nodule on any wire-bonding pad, the board was still considered a reject. To reduce scratches on wirebonding pads, the PCB manufacturer utilized foam trays after routing the boards so that they did not make direct contact with other boards. This action significantly reduced the scratches on wire-bonding pads, even though some isolated scratches still appeared from time to time, which caused the boards to be rejected. Even with these significant improvements, the target yield remained unachievable. Another approach was then taken to consider if wire bonding could be successfully performed over nodules and scratches and if there was a dimensional threshold where wire bonding could be successful. A gold ball bonding process called either stand-off-stitch bonding (SSB) or ball-stitch-on-ball bonding (BSOB) was used to determine the effects of nodules and scratches on wire bonds. The dimension of nodules, including height, and the size of scratches, including width, were measured before wire bonding. Wire bonding was then performed directly on various sizes of nodules and scratches on the bonding pad, and the evaluation of wire bonds was conducted using wire pull tests before and after reliability testing. Based on the results of the wire-bonding evaluation, the internal specification for nodules and scratches for wirebondable PCBs was modified to allow nodules and scratches with a certain height and a width limitation compared to initially adopted internal specifications of no nodules and no scratches. Such an approach resulted in improved yield at the PCB manufacturer.
Safe, precision rework for SMD, BGA, and other high value chips The versatile SV560A rework station combines precision, reliability, and affordability in an all-in-one solution for all your rework needs, from complex, densely populated PCBAs to simpl
Designed for wafer processing, Nordson MARCH's SPHERE™ series plasma systems, the StratoSPHERE offers superior plasma treatment for high-throughput advanced semiconductor packaging applications. The StratoSPHERE plasma system is ideal for wafer pro
SMTnet Express, October 10, 2024, Subscribers: 25,836, Companies: 12,282, Users: 29,256 █ Electronics Manufacturing Technical Articles Brief description of ENIG for Multilayer PCB ENIG (Electroless Nickel/Immersion Gold) is to deposit
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/first-bond-ball-pull-stud-bump-pull?con=t
Contact Global HQ Africa Asia Central and South America Europe USA and Canada First Bond Ball/Stud Bump Pull Copper is increasingly replacing gold as the interconnect material for wire bonds, stud
Imagineering, Inc. | https://www.pcbnet.com/blog/understanding-the-pcb-fabrication-process-from-design-to-delivery/
. For example, electroless nickel immersion gold (ENIG) is a common surface finish due to its long shelf life and RoHS compliance . However, it’s more expensive than other options
