IDC is the developer of a low temperature baking process for removing moisture from moisture sensative package, while they remain in either tape or tubes. It is currently engineering equipment to support the process.
Industry Directory | Consultant / Service Provider / Manufacturer / Other
Taiwan Dry Tech Corp. manufacturer of Eureka Dry Tech Fast Super Dryers for moisture/humidity proof protective storage of PCB, MSD, IC packages, meets IPC/JEDEC J-STD-033 & IPC-1601.
New Equipment | Board Handling - Storage
Eureka Dry Tech XDC-501 Fast Super Dryer Ultra Low Humidity Dry Cabinet Specs: http://www.eurekadrytech.com/fast-super-dryer/xdc-500 Capacity: 372 Liters Humidity Range: LESS THAN 5% Recovery Time: Recovers to ≤ 5% RH within 30 minutes after acces
New Equipment | Board Handling - Storage
Eureka XDC-2001 Fast Super Dryer Ultra Low Humidity Dry Cabinet Specs http://www.eurekadrytech.com/fast-super-dryer/xdc-2001 Anti-static Glass, Anti-static Paint on Body and Shelves, Anti-static Caster / Stands, 1 M ω Ground Wire Capacity: 1314 L
Electronics Forum | Mon Jul 16 12:03:42 EDT 2007 | davef
We're aware of no industy acceptance standard for max moisture content of a board. For more on moisture levels, get a copy of: "Removing Moisture from Electronic Components and Assemblies", CS Leech, Jr, Circuits Assembly, May 1994. The article disc
Electronics Forum | Tue Jun 27 08:08:23 EDT 2000 | Christopher Lampron
Hello All, My question is in regards to repackaging moisture sensitive components. I have researched the archives and found alot of valuable information. We currently have a heat sealing machine but do not have the capability of evacuating the bag pr
Used SMT Equipment | Soldering - Reflow
TrioTek: Ultraviolet UV Curing, IR Thermal Curing, Moisture Curing for encapsulants, adhesives, conformal coatings and potting compounds TrioTek™ inline curing ovens from ETS are ideal for medium to high-volume curing or drying of encapsulants, con
Used SMT Equipment | General Purpose Equipment
FEATHERS The solder paste miser efficiently and evenly mixes the solder paste to a liquid state. It helps to achieve better results of stencil printing and reflowing processes. The use of the mixer also reduces the chances of absorbing air moistur
Industry News | 2010-09-13 15:36:15.0
IPC — Association Connecting Electronics Industries® has released IPC-1601, Printed Board Handling and Storage Guidelines. The industry's sole standard on the handling, packaging and storage of printed boards, IPC-1601 provides users with guidance on how to protect printed boards from contamination, physical damage, solderability degradation, electrostatic discharge and moisture uptake.
Industry News | 2022-10-12 11:23:36.0
In the SMT industry, there are many types of cleaning machines. According to the cleaning things, there are stencil cleaner, PCBA cleaner, Wave Oven Pallet/Fixture cleaner, Mis-Print PCB cleaner, Squeegee cleaner, Nozzle cleaner, PCB surface cleaner and so on.
Parts & Supplies | Soldering - Wave
Overseas Agent and Distributor Wanted ! Features : Spray Fiuxer: 1) Oriental motor drives the flux spraying system. Spraying speed is adjusted according to PCB board width and moving speed to ensure even spraying all time. 2) Durable “Meiji
Technical Library | 2019-09-27 09:14:41.0
One of the most critical factors in preventing corrosion from occurring in electronics is maintaining the state of cleanliness. This is not an easy feat to achieve. Corrosion is defined as the deterioration of a material or its properties due to a reaction of that material with its chemical environment. [1] So, to prevent corrosion from occurring, either the material or the chemical environment must be adjusted. Adjusting the material usually means application of a protective coating or replacing a more reactive material with a less reactive material. Adjusting the chemical environment usually means removing ionic species through cleaning, and removing moisture, usually with a conformal coating or hermetic package. Ionic species and moisture are problematic because they form an electrolyte which is able to conduct ions and electricity. Any metal that comes into contact with the electrolyte can begin to corrode.
Technical Library | 2021-12-06 03:43:31.0
By potting under vacuum, components can be optimally protected from external influences. Before the potting process, air and moisture are removed from the components by vacuum. Components with geometries that are difficult to vent, coils, transformers or wound goods can be potting free of air bubbles. Potting under vacuum guarantees an even distribution of the potting material.Whatsapp 0086 134 2516 4065
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Imagineering, Inc. | https://www.pcbnet.com/blog/how-to-prevent-a-solder-ball-defect/
. Humidity – Moisture has increasingly become one of the biggest issues for printed circuit board manufacturers today. Aside from the popcorn effect and microscopic cracking, it can also cause solder balls to form due to escaping air or water
| https://www.eptac.com/wp-content/uploads/2021/11/webinar_eptac_10_21_09.pdf
Added moisture sensitive and process sensitive component usage Changed gold removal process Added heat shrinkable soldering devices
