New Equipment | Fabrication Services
RF & Microwave PCB's ACI is a leader in providing complex RF/Microwave PCB’s covering a wide spectrum of product types including Defense/Aerospace, Medical Device, Imaging, and Telecommunications Equipment. ACI supports a wide range of frequency ban
New Equipment | Selective Soldering
Mini Selective Solder Machine (Lead Free)MF302 Description: This inexpensive bench-top removes or installs through-hole components on SMT boards without damage to adjacent devices. It will process ICs, including DIPs, QFPs, PGAs, connectors
Electronics Forum | Thu Sep 02 14:02:49 EDT 2004 | russ
Frank, We are currently running lead free for approximately 1 yr. now but no where near the volumes you have mentioned. We are about 5k units per month. I personally am in agreement with you as far as OSP. I also do not like white tin finish since
Electronics Forum | Wed Jun 30 12:14:40 EDT 1999 | John Thorup
| | We are wave soldering some fabs with a lot of unmasked trace area along the edges. The trace area is solid copper covered with tin / lead, no masking, no components along the edges, same on solder side and component side (goofy board design). I
Industry News | 2010-09-13 15:36:15.0
IPC — Association Connecting Electronics Industries® has released IPC-1601, Printed Board Handling and Storage Guidelines. The industry's sole standard on the handling, packaging and storage of printed boards, IPC-1601 provides users with guidance on how to protect printed boards from contamination, physical damage, solderability degradation, electrostatic discharge and moisture uptake.
Industry News | 2007-12-19 16:20:12.0
Manncorp�s 120 Mini wave machine performs selective soldering of ICs, is ideal for single-point or single-edge soldering at lead-free temperatures to 399�C.
Effects of Tin and Copper Nanotexturization on Tin Whisker Formation SMTnet Express August 17, 2012, Subscribers: 25395, Members: Companies: 8952, Users: 33485 Effects of Tin and Copper Nanotexturization on Tin Whisker Formation First published
An Investigation of Whisker Growth on Tin Coated Wire and Braid SMTnet Express August 2, 2012, Subscribers: 25335, Members: Companies: 8941, Users: 33403 An Investigation of Whisker Growth on Tin Coated Wire and Braid First published in the 2012
| https://www.eptac.com/wp-content/uploads/2015/03/ecss_q_st_70_18c-space-product-assurance-rf-coax-cables.pdf
cleanliness, absence of oil films and freedom from tarnish or corrosion. 5.1.2 Environmental conditions a. The supplier shall have an assembly area which has a controlled environment that limits entry of contamination. b. The supplier shall
