New SMT Equipment: removing tarnish from immersion tin (6)

RF/Microwave PCB Fabrication: Single Layer - Double Layer - Multi-Layer - Plated Through Holes

RF/Microwave PCB Fabrication: Single Layer - Double Layer - Multi-Layer - Plated Through Holes

New Equipment | Fabrication Services

RF & Microwave PCB's ACI is a leader in providing complex RF/Microwave PCB’s covering a wide spectrum of product types including Defense/Aerospace, Medical Device, Imaging, and Telecommunications Equipment. ACI supports a wide range of frequency ban

Advanced Circuitry International

IONOX® FCR - High Strength Semi-Aqueous Electronics Cleaner

IONOX® FCR - High Strength Semi-Aqueous Electronics Cleaner

New Equipment | Cleaning Agents

IONOX® FCR is a solvent blend designed for removing rosin, low solids and water soluble fluxes while being environmentally friendly. Easy to use, FCR is applied as received. A water rinse is required to remove all traces of soils and cleaner residues

KYZEN Corporation

Electronics Forum: removing tarnish from immersion tin (22)

Lead Free ...

Electronics Forum | Thu Sep 02 14:02:49 EDT 2004 | russ

Frank, We are currently running lead free for approximately 1 yr. now but no where near the volumes you have mentioned. We are about 5k units per month. I personally am in agreement with you as far as OSP. I also do not like white tin finish since

Re: Wave solder edge covers

Electronics Forum | Wed Jun 30 12:14:40 EDT 1999 | John Thorup

| | We are wave soldering some fabs with a lot of unmasked trace area along the edges. The trace area is solid copper covered with tin / lead, no masking, no components along the edges, same on solder side and component side (goofy board design). I

Industry News: removing tarnish from immersion tin (9)

Different Techniques for Plating

Industry News | 2018-10-18 11:08:03.0

Different Techniques for Plating

Flason Electronic Co.,limited

IPC Delivers New Standard on Handling, Packaging and Storage of Printed Boards

Industry News | 2010-09-13 15:36:15.0

IPC — Association Connecting Electronics Industries® has released IPC-1601, Printed Board Handling and Storage Guidelines. The industry's sole standard on the handling, packaging and storage of printed boards, IPC-1601 provides users with guidance on how to protect printed boards from contamination, physical damage, solderability degradation, electrostatic discharge and moisture uptake.

Association Connecting Electronics Industries (IPC)

Express Newsletter: removing tarnish from immersion tin (906)

Effects of Tin and Copper Nanotexturization on Tin Whisker Formation

Effects of Tin and Copper Nanotexturization on Tin Whisker Formation SMTnet Express August 17, 2012, Subscribers: 25395, Members: Companies: 8952, Users: 33485 Effects of Tin and Copper Nanotexturization on Tin Whisker Formation First published

An Investigation of Whisker Growth on Tin Coated Wire and Braid

An Investigation of Whisker Growth on Tin Coated Wire and Braid SMTnet Express August 2, 2012, Subscribers: 25335, Members: Companies: 8941, Users: 33403 An Investigation of Whisker Growth on Tin Coated Wire and Braid First published in the 2012

Partner Websites: removing tarnish from immersion tin (3)

ECSS-Q-ST-70-18C

| https://www.eptac.com/wp-content/uploads/2015/03/ecss_q_st_70_18c-space-product-assurance-rf-coax-cables.pdf

 cleanliness, absence of oil  films and  freedom  from  tarnish  or corrosion.  5.1.2 Environmental conditions a. The  supplier  shall  have  an  assembly  area  which  has  a  controlled  environment that limits entry of contamination.  b. The  supplier  shall


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