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New Equipment | Industrial Automation
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Electronics Forum | Mon Aug 13 18:16:31 EDT 2001 | fmonette
Be very careful how you perform the removal process if you want to re-use BGA/CSP devices. As you are aware, the majority of these components are classified as moisture-sensitive by the manufacturer. This means that if they absorb too much moisture
Electronics Forum | Fri Jul 13 00:11:41 EDT 2001 | qinongzhu
We are preparing a batch of samples for test. several IC which packaged by BGA/CSP was removed from PCB by reworkstation. However, I need to re-use this IC. I want to know whether there is a way to remove the solder balls from these IC devices and ca
Industry News | 2015-05-07 19:28:29.0
MIRTEC announce a new strategic cooperation that will empower yield improvement in the electronics manufacturing industry.
Industry News | 2010-09-20 19:36:19.0
Industry-leading associations IPC and SMTA jointly announce the agenda for Session 1 of the High Performance Cleaning and Coating Conference, scheduled to take place November 16-18, 2010 at the Renaissance Hotel & Convention Center in Schaumburg, Illinois.
Technical Library | 2019-09-25 04:36:01.0
What is the main function of hot air dry oven? Drying ovens are devices used to remove moisture and other solvents from the items placed inside them through a forced convection process, collecting it elsewhere so that the object becomes dehydrated. A drying oven causes objects to dry out through evaporation. Drying ovens use convection heating,also called air forced, in which the object is heated through air currents. Water from the object escapes into the air, raising the humidity level and causing the semi-solid membranes inside the oven to absorb the water. The end result is that the oven removes water from the object being dried, leaving it dehydrated. Drying ovens contain a system for forcing convection currents to develop, usually either a fan or turbine, which aids in the heating and drying process by ensuring that the hot air circulates,many ovens are equipped with an adjustable ventilation system that allows the user to ensure that the system has an adequate air supply. For details,pls visit our website: https://climatechambers.com/articles&latestnews/what-is-the-main-function-of-hot-air-dry-oven.html
Technical Library | 2017-02-09 17:08:44.0
The SMT assembly world, especially within the commercial electronics realm, is dominated by no-clean solder paste technology. A solder paste flux residue that does not require removal is very attractive in a competitive world where every penny of assembly cost counts. One important aspect of the reliability of assembled devices is the nature of the no-clean solder paste flux residue. Most people in this field understand the importance of having a process that renders the solder paste flux residue as benign and inert as possible, thereby ensuring electrical reliability.But, of all the factors that play into the electrical reliability of the solder paste flux residue, is there any impact made by the age of the solder paste and how it was stored? This paper uses J-STD-004B SIR (Surface Insulation Resistance) testing to examine this question.
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/0453-sectioned-3d-ami
. 3V sectioning may also be done by removing individual slices or according to the acoustic properties of materials. Result The die attach area shows some non-uniformity that is probably not a reliability concern
| https://www.eptac.com/faqs/ask-helena-leo/ask/smt-polyphenylene-sulfide-pps-film-capacitors-and-defects
. I recommend contacting the manufacturer directly and getting the information from them as to the allowable damage that can occur to the component without removing and replacing the device
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