New Equipment | Rework & Repair Equipment
BGA Rework Stations from the BGA Experts with over 25 years rework process experience and customer support! For high volume BGA Rework on even the largest computer and networking boards! The model SV560A has a high resolution optical system for pla
New Equipment | Rework & Repair Equipment
Legendary Military Workhorse with Proven Reliability, Longevity & Durability Utilized at all major US and International Military depots, you'll find the PRC 2000 at shipboard repair shops, mobile maintenance vans and thousands of intermediate mainte
Electronics Forum | Sat Mar 06 08:01:45 EST 1999 | Scott Cook
| Can someone please advise me to the rework procedure for removal and replacing Ceramic Chip Capacitors (e.g. 0805, 1206, etc.)? | | Is it necessary to pre-heat ceramic capacitors before soldering them onto a PCB with a soldering iron? Is this just
Electronics Forum | Wed May 19 20:24:09 EDT 2021 | kumarb
Thank you Michal. Very much appreciated. We are thinking along the same lines. However, we are being very afraid to even cut the official wire ties that are securing the head 1 and head 2 wiring. We have a new VAC2 solenoid in transit that will arr
Industry News | 2016-06-27 14:19:56.0
Virtual Industries today announced that it will exhibit in Booth #834 at SEMICON West, scheduled to take place July 12-14, 2016 at the Moscone Center in San Francisco, CA. Company representatives will demonstrate the TWEEZER-VAC® Elite and ADJUST-A-VAC® Elite.
Industry News | 2016-10-11 18:47:39.0
Virtual Industries today announced that it will exhibit in Booth A1, 148 at electronica, scheduled to take place Nov. 8-11, 2016 at the Messe München. Company representatives will demonstrate the TWEEZER-VAC® Elite and ADJUST-A-VAC® Elite.
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SMTnet Express, May 3, 2018, Subscribers: 31,026, Companies: 10,927, Users: 24,677 Hot Air vs. IR BGA Rework Stations Dennis O'Donnell; Precision PCB Services, Inc Hot Air and IR are the two main types of rework stations used by OEMs and PCB
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Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
. Subbarayan and R. Kinyanjui, J. Deutsch and M. Abstract 20-3 ULTRASONIC GOLD TO GOLD FLIP CHIP INTERCONNECT PROCESS USING LOW COST SUBSTRATES Philip Couts and M. Kawahara Abstract 20-3 CONSIDERATIONS IN SELECTING FLUXES FOR LEAD-FREE WAVE SOLDERING Chrys Shea
