Industry Directory | Manufacturer
A US manufacturer of quality hand tools for those engaged in the repair, rework, R & D, testing, and assembly of electronic components and printed circuit boards from Through Hole to 2Mil Pitch Surface Mount.
Industry Directory | Consultant / Service Provider / Manufacturer / Standards Setting / Certification / Training Provider
Blackfox is the industry leader in providing IPC Certifications, Solder Training, Customized Training Programs, and Counterfeit Component Training and Certification.
The World's Best SMT Convection Reflow Ovens for Large Boards and Dual Lane 1826 Mark 5 reflow oven provides consistent performance for high volume reflow requirements while minimizing preventative maintenance and floorspace. Lead Free Certified!
Time Pressure Liquid Dispensing Pump with Foot switch / Dry contact A great addition to Fully Automatic Dispensing System Time pressure is a versatile method of dispensing that functions across a wide range of viscosities. This dispensing method wo
Electronics Forum | Thu Apr 11 12:02:18 EDT 2002 | yngwie
Thanx Dave..the doc are really informative. cheers...and have a nice weekend.
Used SMT Equipment | Soldering - Wave
We have a customer with an immediate need for an Electrovert VectraElite Wave Solder machine. Please contact us ASAP if you are able to fulfill this requirement.
Used SMT Equipment | Depanelizers / Routers
We have a customer with an urgent need for a Cencorp Router. If you, or someone you know, can help us with this active requirement please let us know ASAP.
Industry News | 2015-11-12 22:03:28.0
Heller Industries is thrilled to announce that we've partnered with the #1 Northern California Sales Representative Group - Lean-Stream!
Industry News | 2013-05-21 22:12:09.0
Based on its recent analysis of the surface mount technology (SMT) reflow soldering equipment market, Frost & Sullivan recognizes Heller Industries, Inc. with the 2013 Global Frost & Sullivan Award for Market Share Leadership.
Parts & Supplies | General Purpose Equipment
The new inspection mirror meets clean room requirements yet is sufficiently economical for non-clean room applications. A quality tool for the technician but inexpensive enough to meet the budgetary requirement of modern manufacturing. /8" Mirror He
Parts & Supplies | Pick and Place/Feeders
SM 12MM 1 FEEDER WEIGHT:12mm 4.56KG Any more requirement ,pls send me mail to :sheryl@ksunsmt.com
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2023-01-17 17:22:28.0
The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.
1809 MK5 - Heller Advanced In-Line Vacuum Reflow Oven Nitrogen System with Balanced Flow Technology 9 Top And Bottom Heated Zones - highest zone count per linear foot in the industry! 100" Heated Length - for super throughput! 2 Internal C
Increase productivity, improve quality, reduce costs with vertical format curing solutions from Heller Industries. Learn more: http://www.hellerindustries.com/755-Vertical-Oven.php
Training Courses | | | IPC J-STD-001 Specialist (CIS)
The Certified IPC J-STD-001 Specialist (CIS) training focuses on the knowledge and hand skills employees need to produce high-quality soldered interconnections.
Training Courses | | | IPC J-STD-001 Space Specialist (CIS)
The J-STD-001 Space Addendum is an additional optional module for the Certified IPC J-STD-001 CIS (Specialist) program for organizations that are required to meet these additional requirements.
Events Calendar | Tue Dec 03 00:00:00 EST 2019 - Tue Dec 03 00:00:00 EST 2019 | Anaheim, California USA
IPC Tech Ed - Process and Acceptability Requirements: Utilizing J-STD-001 and IPC-A-610 Together
Events Calendar | Thu Feb 20 00:00:00 EST 2020 - Thu Feb 20 00:00:00 EST 2020 | Manchester, New Hampshire USA
IPC Tech Ed - Process and Acceptability Requirements: Utilizing J-STD-001 and IPC-A-610 Together
Career Center | Portland, Maine USA | Sales/Marketing
Beau Tech, a manufacturer of hand tools for the electronics industry and hobby market is seeking a Sales Representative in Europe. Responsibilities include: Set up distributors in the European market. Promote product line through trade shows, etc.
Career Center | All over the world, Alabama USA | Engineering
2023 is the year for I.C.T's global localization strategy, and we are seeking talented individuals worldwide for the following positions. I.C.T adheres to the principles of "Simple, Open, Undertake, Coordination and Share" to build a pl
Career Center | GOBICHETTIPALAYAM, India | Engineering
PCB design, layout and packaging of high-speed, high-density, Mixed Technology Analog / Digital signals & RF signals, Flex, Rigid board, Commercial, Application Boards, based on client requirement and Quality Inspection of the design.
Career Center | , British Columbia Canada | Maintenance
I have 10 years experience in a number of SMT focused plants. I have overseen the relocation of three plants and the installation of all related equipment.
ASCEN Technology | https://www.ascen.ltd/Blog/machine/online_loader_unloader/list_39_2.html
. ASCEN PCB automatic loader is used for providing pcb to following machine according to producing requirement in the starting process of on-line smt manufacturing line, SMEMA pro
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_internet-connection_topic1842.xml
. Internet connection : Why is it now a requirement to... Author: JJonasSubject: 1842Posted: 21 Feb 2016 at 7:16amWhy is it now a requirement to be connected to the internet when using LE Lite
