Industry Directory | Research Institute / Laboratory / School
MUAnalysis is an independent lab for Component Failure Analysis and Reliability Testing in Ottawa, Ontario Canada. We also would be pleased to discuss your analysis needs. We also perform all non-destructive testing ...
Industry Directory | Manufacturer's Representative
X-ray Fluorescence (XRF) analyzers developed for RoHS testing, solder composition, etc. Handheld XRF and Desktop systems are available; rental options as well.
Retrofit existing system with Innovative Dispensing Technology for Excellent Dispense Control and Repeatability Advanced pump technologies available for retrofitting include: True Volumetric Pump, Precision Auger Pump, Simplified Jetting Pump and Ti
Do you have a unique component that isn’t available in tape and reel? Tired of hand placing those components because you don’t have a compatible feeder? Can’t find JEDEC trays for your components and you need one yesterday? The answer to all of
Electronics Forum | Tue Sep 24 23:02:59 EDT 2002 | redmary
For the COB process, what thickness for plating Au is suitable? IS there any specification for this issue?
Electronics Forum | Tue Sep 24 23:03:14 EDT 2002 | redmary
we used the ball bonding, just normal chip on board. as I know the the electroless Ni/immersion Au, the gold thickness is about 0.13um at most, what about chemical plating or electrolytic plating? any experience on it, thanks
Used SMT Equipment | Adhesive Dispensers
TH-2004L1 Rotary dispensing machine Feature 1. Can as your require to setting before the delay time, after the delay time, dispensing time, motor speed, even on the glue, non-contact trace 2. Use imported Slide cylinder, so that the machine running
Used SMT Equipment | Repair/Rework
Lead Free Preheater with fume extractor for rework. Includes: stand show in picture OKI fume extractor with hoses and filters (model: BVX-200) Hakko FR-802 available separately This unit is located in the CEE facility in the Chicago
Industry News | 2013-08-15 20:58:22.0
Heller Industries announced today that they have entered into a joint development agreement with International Business Machines Corporation (NYSE: IBM), to collaborate on the development of fluxless mass reflow furnace equipment and process for high volume manufacturing. The fluxless process utilizes gas phase formic acid to replace standard fluxing agents, and eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps.
Industry News | 2017-09-16 02:29:39.0
Heller Industries has been awarded the 2017 Global Frost & Sullivan Company of the Year Award for its surface mount technology (SMT) soldering equipment that enables Industry 4.0. - the automation and data exchange in manufacturing technologies.
Parts & Supplies | Circuit Board Assembly Products
KHY-M652L-00 SENSOR,POS 1 YG12 KHM-M654B-01 SENSOR,FIBER 1 YS24 KHM-M654C-01 SENSOR,FIBER 2 YS12 KHM-M654B-010 SENSOR,FIBER 1 KHM-M654C-012 SENSOR,FIBER 2 YG12 KHM-M654B-01 KHM-M654C-01 KHY-M652K-00 KHY-M652L-00 KHY-M652M-00 KHY-M65
Parts & Supplies | SMT Equipment
KHY-M652L-00 SENSOR,POS 1 YG12 KHM-M654B-01 SENSOR,FIBER 1 YS24 KHM-M654C-01 SENSOR,FIBER 2 YS12 KHM-M654B-010 SENSOR,FIBER 1 KHM-M654C-012 SENSOR,FIBER 2 YG12 KHM-M654B-01 KHM-M654C-01 KHY-M652K-00 KHY-M652L-00 KHY-M652M-00 KHY-M65
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2023-01-17 17:12:33.0
Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU "die to lid/heat spreader" (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances.
https://www.ascen.ltd/component_tape_feeder/ Robotic component axial tape feeder for robot that use to cuts and bends taped axial components,and then holds the component so that the robot can pick them up online or link to the SMT insertion machine f
Smart Electronic Shelves Fixed electronic shelf instructions ※ Multi-color LED (set according to the actual needs of customers), support multiple sets of work orders at the same time to prepare materials for delivery ※ double-sided access material ※
Training Courses | | | IPC/WHMA-A-620 Specialist (CIS)
The Certified IPC/WHMA-A-620 Specialist (CIS) training focuses on cable and wire harness fabrication and installation.
Training Courses | ONLINE | | ESD Control Training Courses
Browse training and certification programs for electrostatic discharge (ESD) control in electronics assembly.
Events Calendar | Tue Jun 09 00:00:00 EDT 2020 - Tue Jun 09 00:00:00 EDT 2020 | ,
Critical Environmental Requirements for Electronics Conference
Events Calendar | Tue Feb 19 00:00:00 EST 2019 - Tue Feb 19 00:00:00 EST 2019 | Elkridge, Maryland USA
SMTA Capital Chapter: Non-Destructive BGA/Area Array Component Rework
Career Center | Santa Cruz, California USA | Production,Quality Control
Soldering Technician, Touch-up for PCBAs Perform hand soldering and touch-up rework for Printed Circuit Board Assemblies (PCBA), cables and associated equipment. Inspect PCBA for defects, loose connections, missing components. Solder to perform r
Career Center | Pittsburgh, Pennsylvania USA | Sales/Marketing
Individual(s) will be responsible for the development and growth of electronics assembly and manufacturing business. The sales representative will cultivate new relationships and develop/enhance current relationships to increase the company's positi
SMTnet Express, May 19, 2022, Subscribers: 25,528, Companies: 11,568, Users: 27,231 Electronics Manufacturing Technical Articles Non-Destructive Characterization of Mechanically Processed Waste Printed Circuit Boards: X
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/divisions/test-and-inspection/our-technologies---acoustic-microscopy?con=t&page=37
) technology for nondestructive internal inspection and analysis. Nordson TEST & INSPECTION's C-SAM acoustic microscopes are recognized as the benchmark for accuracy
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/silkscreen-for-connectors_topic1394.html
. So for this part I would show a gap in the silkscreen, but where the notch is placed. Possibly even the number (14) could be shown. The requirement for the silkscreen to be visible after placement is dependant upon the manufacturing environment - is the silkscreen an important inspection aid
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