Packaging of electronic components. Tape and reeling electronic components and devices.
Industry Directory | Manufacturer
HJS Automation International Limited, is a scientific and technological intelligent automation enterprise integrating R & D, production, sales and service. Products is SMD tape and reel machine, used for SMT and semiconductor.
Proven Peel Back Force Measurement Supplying consistent SMT carrier packaging is critical for customers using SMT pick-and-place machines. Nothing will stop a production line faster than carrier cover tape that doesn’t peel back properly. The proble
Eliminate Body Stress with Versatile CF-8 GPD's CF-8 eliminates component body stress. Versatility is the key word for the CF-8. Simple tooling changes make short or long run production jobs quick and easy. Capabilities Meets exacting military s
Electronics Forum | Sat Feb 28 14:00:18 EST 1998 | Gary Simbulan
I have run across reference to EIA-481 for specifications on Tape And Reel components for automatic placement and am looking for something similar that specifies standards or dimensions for IC Tubes or sticks. I am trying to make the vibatory feeder
Electronics Forum | Thu Mar 19 17:02:50 EST 1998 | TaeDong Park
| I have run across reference to EIA-481 for specifications on Tape And Reel components for automatic placement and am looking for something similar that specifies standards or dimensions for IC Tubes or sticks. I am trying to make the vibatory feed
Used SMT Equipment | SMT Equipment
Product Name :Panasoinc NPM module Product number: two modules NPM Detailed product introduction 2D inspection head function of NPM tape coating machine: 1, NPM check head resolution: 9 m 2, NPM check head vision: 21.1 * 17.6mm 3, check proc
Used SMT Equipment | SMT Equipment
Product Name :Panasoinc NPM module Product number: two modules NPM Detailed product introduction 2D inspection head function of NPM tape coating machine: 1, NPM check head resolution: 9 m 2, NPM check head vision: 21.1 * 17.6mm 3, check proc
Industry News | 2016-02-27 22:07:08.0
GPD Global will exhibit in Booth#1818 at the upcoming IPC APEX EXPO 2016 Conference and Exhibition. See a live demonstration of 01005 dispensing on the MAX series high precision dispenser, the intuitively programmed Island series benchtop dispenser, and a full range of dispense pumps used on GPD dispense systems.
Industry News | 2011-02-17 15:04:54.0
GPD Global will highlight its Positive Cavity Displacement (PCD) Dispensing in Booth #27 at the upcoming IMAPS Device Packaging conference and exhibition, scheduled to take place March 8-9, 2011 at the Radisson Fort McDowell Resort and Casino in Scottsdale, AZ.
Parts & Supplies | Component Packaging
1 KHY-M7151-00 EJECTOR,RESIN 1 1-1 KHY-M7151-01 EJECTOR,RESIN 1 (2008/12/26) MEY0069 OK 2 KHY-M4592-01 VAC SENSOR BRD ASSY 1 3 KHY-M71CA-00 COVER,VAC SENSOR 1 4 $TL10-01 JOINT 2 5 90563-23J060 SPACER 4 6 91312-03005 BOLT HEX.SOCKET HEAD 6
Parts & Supplies | Component Packaging
1 KHY-M7151-00 EJECTOR,RESIN 1 1-1 KHY-M7151-01 EJECTOR,RESIN 1 (2008/12/26) MEY0069 OK 2 KHY-M4592-01 VAC SENSOR BRD ASSY 1 3 KHY-M71CA-00 COVER,VAC SENSOR 1 4 $TL10-01 JOINT 2 5 90563-23J060 SPACER 4 6 91312-03005 BOLT HEX.SOCKET HEAD 6
Technical Library | 2020-04-14 15:56:32.0
This paper will focus on the application requirements of solder printing small aperture designs, concentrating on 008004 (inch) / 0201 (metric) size components, and the results of a design of experiment printing these challenging apertures. As Moore's law continues to be applied to component miniaturization, the next installment of reduced packaging has arrived in the form of the 008004/0201 for resistors and capacitors. Component size roughly the size of a grain of sand presents specific challenges to the solder printing process. To address these challenges, each aspect of the printing process will need be examined. This includes essential machine requirements, including correct squeegee blades, tooling support, and calibrations, to meet the demanding specifications. The correct match and design of materials will be addressed, focusing on the stencil and substrate design along with solder paste and cleaning solvent requirements. A design of experiment will be reviewed that applies the machine and materials discussed, including the printer and Solder Paste Inspection (SPI) setup and the specific machine parameters used. The results of these DOE's will then be closely examined.
Technical Library | 2021-12-31 06:09:47.0
The packaging method of surface mount components has become an important part of the SMT system. It directly affects the efficiency of assembly production and must be optimized in combination with the type and number of feeders of the SMT machine. There are four main types of packaging for surface mount components, Tape, tube, tray and bulk.
Proven Peel Back Force Measurement Supplying consistent SMT carrier packaging is critical for customers using SMT pick-and-place machines. Nothing will stop a production line faster than carrier cover tape that doesn’t peel back properly. The proble
Eliminate Body Stress with Versatile CF-8 GPD's CF-8 eliminates component body stress. Versatility is the key word for the CF-8. Simple tooling changes make short or long run production jobs quick and easy. Capabilities Meets exacting military s
Training Courses | ONLINE | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Mon May 04 00:00:00 EDT 2020 - Mon May 04 00:00:00 EDT 2020 | ,
Ball Grid Array Rework - How to Do It Successfully
Events Calendar | Wed Apr 19 00:00:00 EDT 2017 - Fri Apr 21 00:00:00 EDT 2017 | Nara, Japan
Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2017)
International Microelectronics Assembly and Packaging Society (IMAPS)
Career Center | Boise, Idaho USA | Engineering
In need of a contract engineer ASAP!! This person will help with the fabrication of implantable medical devices. Incumbent must have electronic packaging and uBGA experience. The qualifications are below. This position will be from 3-9 months and nee
Career Center | Bangalore, India | Engineering,Maintenance,Production,Technical Support
SMT Stencil designing & Knowledge of full SMT process software known CAD/CAM -circuit CAM Pro 7.3,GC Power station, GCCAM Edit,Auto CAD, Fault finding of Electronic Boards & Servicing electronic machines.
Career Center | NEW DELHI, India | Technical Support
I am having almost 20 years of experience in the field of electronics repairs domestic & industrial, able to work on any circuit and PCB without any schematic or diagram. I have all the records and certifications with me and fully c
KingFei SMT Tech | https://www.smtspare-parts.com/sale-11928258-semi-auto-smd-taping-machine-for-smd-components-packaging-tape-machine.html
Semi-Auto SMD Taping Machine For SMD Components Packaging Tape Machine Leave a Message We will call you back soon! Your message must be between 20-3,000 characters
Lewis & Clark | http://www.lewis-clark.com/product-tag/tape/
Tape Archives - Lewis and Clark Skip to content My Cart: 0 View Cart Checkout No products in the cart. Subtotal: View Cart Checkout Lewis and Clark We Discover Equipment Opportunities NH: 603-594-4229 FL: 813-888-7436 sales@lewis
