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CME Technology Co., Ltd. is located in Xianyang, Shaanxi National High-tech Industrial Development Zone, is specializing in manufacturing equipment for mechanical testing and simulation, environmental reliability testing.
Electronics Forum | Tue Oct 05 20:37:44 EDT 2004 | davef
Now, now Fastek let's not resort to name calling. B-)
Electronics Forum | Wed Aug 06 14:15:46 EDT 2008 | dphilbrick
If everything else solders good it has to be the part, Test solderability, insure placement force is correct and as a last resort bake the part.
Industry News | 2011-02-17 15:04:54.0
GPD Global will highlight its Positive Cavity Displacement (PCD) Dispensing in Booth #27 at the upcoming IMAPS Device Packaging conference and exhibition, scheduled to take place March 8-9, 2011 at the Radisson Fort McDowell Resort and Casino in Scottsdale, AZ.
Industry News | 2009-09-18 10:23:32.0
OXFORD, CT — September 2009 — MIRTEC Corp., the AOI market leader in North America, announces that it will exhibit its MV-3L Desktop AOI System in booth 428 at the upcoming SMTA International, scheduled to take place October 6-7, 2009 at The Town and Country Resort and Convention Center in San Diego.
Events Calendar | Mon Jan 30 00:00:00 EST 2023 - Thu Feb 02 00:00:00 EST 2023 | Kauai, Hawaii USA
Pan Pacific Microelectronics Symposium
Events Calendar | Mon Feb 10 00:00:00 EST 2020 - Thu Feb 13 00:00:00 EST 2020 | The Big Island of Hawaii, Hawaii USA
Pan Pacific Microelectronics Symposium
Conference & Exhibition: March 31 - April 2, 2009Meetings: March 29 - April 2, 2009 Mandalay Bay Resort & Convention Center, Las Vegas Materials deadline is March 1, 2009 Sent to more than 40,000 industry
Conference & Exhibition: March 31 - April 2, 2009Meetings: March 29 - April 2, 2009 Mandalay Bay Resort & Convention Center, Las Vegas Materials deadline is March 1, 2009 Sent to more than 40,000 industry
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/about-us/events/imaps-device-packaging-2017
WekoPa Resort and Casino, Fountain Hills, Arizona USA 2017-03-07 - 2017-03-09 Please join Nordson ASYMTEK for the INTERACTIVE POSTER SESSION
| http://etasmt.com/cc?ID=te_news_bulletin,23574&url=_print
. (Some practitioners pre-bake components and boards to drive out moisture. This is not encouraged and should be a last resort as baking tends to build intermetallics as well as degrade the solderability by increasing oxidation levels
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