Industry Directory | Manufacturer
Reflow ovens for automated SMT PCB assembly, specializing in lead free processing and nitrogen reflow. The best convection reflow ovens on the market.
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Flux Free Formic Reflow Reflow in Formic Acid Vapor Heller has designed and built an production ready horizontal reflow oven for formic acid vapor. This new oven has been designed to meet Semi S2/S8 safety standards (including toxic gases). Form
Real Time Process Control with FPC: Fluid Pressure Control (Patented) Runs your pump at optimal levels at all times instead of starving or drowning it with inadequate or excessive fluid flow from the reservoir Real Time Process Control (FPC) is a b
Electronics Forum | Sat Apr 21 15:03:23 EDT 2012 | lakritzstange
Hi all, we have a Mirtec table top system MV-7. We are trying to use the ocr function to "read" the letters on the IC/resistors and so on. But the results are really bad. From other company using other machine i know that ocr is working fine. Ha
Electronics Forum | Wed Aug 15 16:06:55 EDT 2001 | davef
Coo What do you mean ehen you say "kept our BGA's under the magic 150 deg mark"?
Used SMT Equipment | Assembly Accessories
Product name: YSM20R efficient module chip mounter Product number: YSM20R Products in detail Features: A wide range of support and efficiency of the various production form With products at the same level of the world's most rapidly does
Used SMT Equipment | Chipshooters / Chip Mounters
Product name: YSM20 efficient module chipmounter Product number: YSM20 Products in detail Features: A wide range of support and efficiency ofthe various production form With products at the same level of theworld's most rapidly does uni
Industry News | 2012-05-11 20:35:45.0
Heller Industries has been awarded a 2012 SMT VISION Award in the category of Soldering Reflow for its 1936 Mark 5 Reflow Oven. The award was presented on April 25, 2012 at the Nepcon China Exhibition.
Parts & Supplies | Pick and Place/Feeders
GIC-F01 FUJI NXT Feeder Calibration JIG It is essential for this equipment that enhanced productivity , installation and quality improvement As the high efficiency vision camera is asked in order to investigate precisely and repair the error of
Parts & Supplies | Pick and Place/Feeders
GIC-Y01 YAMAHA Feeder Calibration JIG It is essential for this equipment that enhanced productivity , installation and quality improvement As the high efficiency vision camera is asked in order to investigate precisely and repair the error of de
Technical Library | 2023-01-17 17:19:44.0
A test program was developed to evaluate the effectiveness of vacuum reflow processing on solder joint voiding and subsequent thermal cycling performance. Area array package test vehicles were assembled using conventional reflow processing and a solder paste that generated substantial void content in the solder joints. Half of the population of test vehicles then were re-processed (reflowed) using vacuum reflow. Transmission x-ray inspection showed a significant reduction in solder voiding after vacuum processing. The solder attachment reliability of the conventional and vacuum reflowed test vehicles was characterized and compared using two different accelerated thermal cycling profiles. The thermal cycling results are discussed in terms of the general impact of voiding on solder thermal fatigue reliability, results from the open literature, and the evolving industry standards for solder voiding. Recommendations are made for further work based on other void reduction methods and additional reliability studies.
Technical Library | 2023-01-17 17:22:28.0
The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.
Nano-copper sintering in formic acid vapor.
Real Time Process Control with FPC: Fluid Pressure Control (Patented) Runs your pump at optimal levels at all times instead of starving or drowning it with inadequate or excessive fluid flow from the reservoir Real Time Process Control (FPC) is a b
Training Courses | | | PCB Inspection Courses
The PCB inspection courses focus on improving PCB yield and reliability through validation and detection of defects on electronics assemblies.
Training Courses | ONLINE | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Tue Aug 22 00:00:00 EDT 2023 - Tue Aug 22 00:00:00 EDT 2023 | Boca Raton, Florida USA
Space Coast Panel Discussion: Microscope Setups, Getting the Best Results From Your Equipment
Events Calendar | Thu Aug 10 00:00:00 EDT 2023 - Thu Aug 10 00:00:00 EDT 2023 | Melbourne, Florida USA
Space Coast: Microscope Setups, Getting the Best Results From Your Equipment, a Panel Discussion
Career Center | Tampa, Florida USA | Engineering
We need your expertise in In-Circuit test development and production testing. You will work closing with design, process and quality engineers to ensure that test hardware and software provides accurate results. Prepare test strategies to be used f
Career Center | Salt Lake City, Utah USA | Engineering,Production
This individual will be responsible for designing and implementing processes, procedures, and controls for electronic assembly, including surface mount, hand soldering, and mechanical assembly. Experience with the Mydata surface mounting equipment is
Career Center | RACINE, Wisconsin USA | Sales/Marketing
Business Development Leader • Experienced business leader in-depth knowledge in techincal industries, candid communicator. • Expertise in building and expanding client base, increasing name recognition and market share using a wide array of tools,
Career Center | Fort Worth, Texas USA | Engineering,Maintenance,Production,Quality Control,Research and Development
A mechanically-inclined, results-oriented, lean-driven professional with proven success in implementing programs that result in efficiencies and cost savings. Effectively communicates with diverse audiences, encourages training and employee developme
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/2596-delaminations-in-substrate
. Result The strongest signals were reflected by the large white area at right. This area is a large delamination between the molding compound and the substrate
| http://etasmt.com/cc?ID=te_news_bulletin,16161&url=_print
. the reflow soldering oven important parts use famous brands such as Japan and Germany. Some clients let us teach them how to choose the reflow oven, and some clients' engineer think use 6 heat zones or 10 heat zones is all the same result
