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The exclusive supplier of SIPAD Solid Solder Deposit in North America and the only SIPAD Solid Solder Deposit (SSD) coating service bureau in the world.
New Equipment | Cleaning Agents
AQUANOX® A8820D is a pour and go, engineered micro-cell cleaning fluid designed to remove wet solder paste and uncured adhesive from stencils used with the surface mount printing process. No Mixing or Monitoring For Spray-in-Air & Select Ultrason
New Equipment | Rework & Repair Equipment
Patented Inductive-Convection Heating Technology Provides Ultimate Thermal Performance Conventional resistance coil heating technology has been successfully used in convective rework stations for decades to install and remove a variety of BGA, QFN,
Electronics Forum | Tue Jan 14 13:21:17 EST 2014 | emeto
This is according to Kester What happens if the paste gets too cold? At temperatures below -15oC (5oF), one or more components of the solder paste may crystallize, producing a non-homogeneous appearance to the solder paste. Such non-homogeneity may
Electronics Forum | Wed Oct 26 23:29:57 EDT 2005 | milroyperera
Hi, As I have seen in the data sheets from solder paste suppliers they always recommend to keep the solder paste until it reaches the ambient temperature after taking out from normal storage temperature. Mostly the storage temperature is 5 - 10 Cels
Industry News | 2003-04-07 10:16:38.0
Portable Products and Optoelectronic Applications Still Hold Promise for Growth
Industry News | 2018-10-18 08:17:09.0
How to Prevent Solder Joint Voiding and Cold Solder Defects during the SMT Reflow Process
Technical Library | 2020-11-24 23:12:27.0
In a lead-free reflow process, temperatures are higher, and materials use outgasses more than in a leaded reflow process. The trends toward higher density populated boards and more pin-in-paste technology also increase solder paste use. More components and more solder paste result in more outgassing of chemistry during the reflow process. Some assemblies report condensation of vapors when the cold printed circuit board enters the oven. Little is known about the interaction between these condensed materials in terms of the interaction between these condensed materials and the reliability of the assembly. Apart from the question of reliability, a printed circuit board contaminated with a small film of residues after reflow soldering is not desirable.
How to Maintain a Reflow Oven Proper reflow overn maintenance can extend its life cycle, keep the machine in good condition, and improve production efficiency and product quality. One of the most important tasks for properly maintaining a reflow ove
SMT Express, Issue No. 3 - from SMTnet.com Volume 1, Issue No. 3 Wednesday, August 18, 1999 Featured Article Return to Previous Page BGA REWORK Earl Moon Proof Of Design (POD) PRE OPERATIONAL REQUIREMENTS The following requirements shall
SMT Express, Volume 3, Issue No. 5 - from SMTnet.com Volume 3, Issue No. 5 Thursday, May 17, 2001 Featured Article Return to Front Page A Closer Look at Area Array Components by Gil Zweig , Glenbrook Technologies, Inc . Combining
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/products/efd-products/solderplus-solder-paste
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: KOH YOUNG KY8030-3 SMT Solder Paste Inspection3D SPI System Model: KY8030-3 Product Name SMT LED Production Line Type Semi Auto Optional Application SMT PCBA LED Factory After-sales Service Provided Engineer availble to install and training machine in oversea