Industry Directory | Manufacturer
Niktec delivers on that commitment by providing in-house technical support to trouble-shoot sensitive and mission critical technology challenges, creating innovative solutions to reuse exiting proven hardware or provide new ...
Industry Directory | Manufacturer
Buyers of Scrap Materials and Surplus Machinery, Equipment and Inventories Precious Metal Refining Warehouse Liquidation PCB & Electronic Scrap Recycling Purchasing of Used Surplus Semiconductor
Industrial Cleaning Wipes�� �� Highly absorbent in water, grease and oil �� Strong-resists solvents �� Multi-plies for extra absorbency and wipe dry �� Ideal for glass and smooth surface cleaning �� No streaks �� Reinforced for extra durability - st
Technip has pioneered the development of critical products that have permitted the emergence of new concepts in offshore field development. With almost 75% of the market, Technip is the world leader in the design and manufacturing of flexible pipe.
Electronics Forum | Fri Sep 13 14:26:44 EDT 2002 | davef
We do not reuse paste that is on the stencil at the end of a shift. Search the fine SMTnet Archives for previous descussions on this topic.
Electronics Forum | Thu Sep 23 16:14:39 EDT 2004 | russ
Control the temp during removal and re-use them. Do not exceed reflow parameters during removal. They should be good up to around 5 reworks. My opinion Russ
Used SMT Equipment | Pick and Place/Feeders
IPLACE D4 is a very powerful placement machine, equipped with four cantilevers and four 12-nozzle collection and placement heads, not only can achieve a precision of 50 microns, but also can mount 01005 components. ***Combining*** and ***flexibility
Used SMT Equipment | Chipshooters / Chip Mounters
AX-201 2006 2x HA standard placement head, 2x BA camera, 1x CA camera, TEU reuse station In excellent condition
Industry News | 2003-06-02 09:14:01.0
Specification-Driven Circuit Design Environment Now Slashes Validation Time Up to 10x
Industry News | 2014-02-04 17:36:26.0
he U.S. Environmental Protection Agency’s (EPA) reporting requirements for manufacturing byproducts sent for recycling are “burdensome, unnecessary, and actually discourage recycling,” an industry expert told Congress today.
_1.jpg)
Parts & Supplies | Pick and Place/Feeders
KME NPM accessory pulley N610127907AA 1 N510039140AB FIBER CFT0208 D3 conveyor track stop sensor 2 N510040164AB FIBER CFT0209 D3 conveyor track stop sensor 3 N510060977AA BELT TA-4UEB M/D 4.5WX990.0L D3 track conveyor belt (loss item) 4 N5100651
_1.jpg)
Parts & Supplies | Pick and Place/Feeders
N210071634AA Panasonic CM602 press cover fixed PIN 1 N510039140AB FIBER CFT0208 D3 conveyor track stop sensor 2 N510040164AB FIBER CFT0209 D3 conveyor track stop sensor 3 N510060977AA BELT TA-4UEB M/D 4.5WX990.0L D3 track conveyor belt (loss ite
Technical Library | 2020-07-08 20:05:59.0
There is a compelling need for functional testing of high-speed input/output signals on circuit boards ranging from 1 gigabit per second (Gbps) to several hundred Gbps. While manufacturing tests such as Automatic Optical Inspection (AOI) and In-Circuit Test (ICT) are useful in identifying catastrophic defects, most high-speed signals require more scrutiny for failure modes that arise due to high-speed conditions, such as jitter. Functional ATE is seldom fast enough to measure high-speed signals and interpret results automatically. Additionally, to measure these adverse effects it is necessary to have the tester connections very close to the unit under test (UUT) as lead wires connecting the instruments can distort the signal. The solution we describe here involves the use of a field programmable gate array (FPGA) to implement the test instrument called a synthetic instrument (SI). SIs can be designed using VHDL or Verilog descriptions and "synthesized" into an FPGA. A variety of general-purpose instruments, such as signal generators, voltmeters, waveform analyzers can thus be synthesized, but the FPGA approach need not be limited to instruments with traditional instrument equivalents. Rather, more complex and peculiar test functions that pertain to high-speed I/O applications, such as bit error rate tests, SerDes tests, even USB 3.0 (running at 5 Gbps) protocol tests can be programmed and synthesized within an FPGA. By using specific-purpose test mechanisms for high-speed I/O the test engineer can reduce test development time. The synthetic instruments as well as the tests themselves can find applications in several UUTs. In some cases, the same test can be reused without any alteration. For example, a USB 3.0 bus is ubiquitous, and a test aimed at fault detection and diagnoses can be used as part of the test of any UUT that uses this bus. Additionally, parts of the test set may be reused for testing another high-speed I/O. It is reasonable to utilize some of the test routines used in a USB 3.0 test, in the development of a USB 3.1 (running at 10 Gbps), even if the latter has substantial differences in protocol. Many of the SI developed for one protocol can be reused as is, while other SIs may need to undergo modifications before reuse. The modifications will likely take less time and effort than starting from scratch. This paper illustrates an example of high-speed I/O testing, generalizes failure modes that are likely to occur in high-speed I/O, and offers a strategy for testing them with SIs within FPGAs. This strategy offers several advantages besides reusability, including tester proximity to the UUT, test modularization, standardization approaching an ATE-agnostic test development process, overcoming physical limitations of general-purpose test instruments, and utilization of specific-purpose test instruments. Additionally, test instrument obsolescence can be overcome by upgrading to ever-faster and larger FPGAs without losing any previously developed design effort. With SIs and tests scalable and upward compatible, the test engineer need not start test development for high-speed I/O from scratch, which will substantially reduce time and effort.
Technical Library | 2021-06-07 19:06:32.0
The technological growth of the last decades has brought many improvements in daily life, but also concerns on how to deal with electronic waste. Electrical and electronic equipment waste is the fastest-growing rate in the industrialized world. One of the elements of electronic equipment is the printed circuit board (PCB) and almost every electronic equipment has a PCB inside it. While waste PCB (WPCB) recycling may result in the recovery of potentially precious materials and the reuse of some components, it is a challenging task because its composition diversity requires a cautious pre-processing stage to achieve optimal recycling outcomes. Our research focused on proposing a method to evaluate the economic feasibility of recycling integrated circuits (ICs) from WPCB. The proposed method can help decide whether to dismantle a separate WPCB before the physical or mechanical recycling process and consists of estimating the IC area from a WPCB, calculating the IC's weight using surface density, and estimating how much metal can be recovered by recycling those ICs. To estimate the IC area in a WPCB, we used a state-of-the-art object detection deep learning model (YOLO) and the PCB DSLR image dataset to detect the WPCB's ICs. Regarding IC detection, the best result was obtained with the partitioned analysis of each image through a sliding window, thus creating new images of smaller dimensions, reaching 86.77% mAP. As a final result, we estimate that the Deep PCB Dataset has a total of 1079.18 g of ICs, from which it would be possible to recover at least 909.94 g of metals and silicon elements from all WPCBs' ICs. Since there is a high variability in the compositions of WPCBs, it is possible to calculate the gross income for each WPCB and use it as a decision criterion for the type of pre-processing.
ASCEN specializing the PCB cutting machine, Please check: www.pcbasc.com www.aliexpress.com/store/1377040 led strip aluminum plate cutter free porn girl online v-cut pcb cutting doule layer pcb cutter depanelizing pcba plate machine aluminum pcb se
http://www.pcb-separator.com ??????????? ???????? ????/?????/V??????????????/LED depaneling equipment/separator/LED separator manufacturer/supplier/
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Send the Special Express To Others Email this Special Express to: Your friend Your co-worker A decision maker in your company A Colleague NOTE: You may re-use this e-mail form as many times
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/about/weee
" (also known as "e-waste"). It refers to regulations, typically passed at a country, state or provincial level, aimed at promoting the reuse and recycling of electrical and electronic equipment and thereby reducing resource
| https://unisoft-cim.com/f2p-files.html
& Fixture GERBER Translations Other Services Testimonials Overview Pricing Contact Us .F2P Files The .F2P files are where annotation overlays, such as those circled in yellow below, can be saved and stored for reuse. A
.gif)
winsouce.jpg)
