Industry Directory | Manufacturer
Niktec delivers on that commitment by providing in-house technical support to trouble-shoot sensitive and mission critical technology challenges, creating innovative solutions to reuse exiting proven hardware or provide new ...
Industry Directory | Manufacturer
Buyers of Scrap Materials and Surplus Machinery, Equipment and Inventories Precious Metal Refining Warehouse Liquidation PCB & Electronic Scrap Recycling Purchasing of Used Surplus Semiconductor
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Technip has pioneered the development of critical products that have permitted the emergence of new concepts in offshore field development. With almost 75% of the market, Technip is the world leader in the design and manufacturing of flexible pipe.
Electronics Forum | Fri Sep 13 14:26:44 EDT 2002 | davef
We do not reuse paste that is on the stencil at the end of a shift. Search the fine SMTnet Archives for previous descussions on this topic.
Electronics Forum | Thu Sep 23 16:14:39 EDT 2004 | russ
Control the temp during removal and re-use them. Do not exceed reflow parameters during removal. They should be good up to around 5 reworks. My opinion Russ
Used SMT Equipment | Pick and Place/Feeders
IPLACE D4 is a very powerful placement machine, equipped with four cantilevers and four 12-nozzle collection and placement heads, not only can achieve a precision of 50 microns, but also can mount 01005 components. ***Combining*** and ***flexibility
Used SMT Equipment | Chipshooters / Chip Mounters
AX-201 2006 2x HA standard placement head, 2x BA camera, 1x CA camera, TEU reuse station In excellent condition
Industry News | 2003-06-02 09:14:01.0
Specification-Driven Circuit Design Environment Now Slashes Validation Time Up to 10x
Industry News | 2011-11-03 21:52:00.0
By davef: I was fortunate to be able to attend the SMTAI Exhibition Oct. 18-19, 2011. While I was walking around looking at the booths and talking to the exhibitors, I got this idea that I would report back on things that I found interesting. You know spread the news, since not everyone was there.
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Parts & Supplies | Pick and Place/Feeders
KME NPM accessory pulley N610127907AA 1 N510039140AB FIBER CFT0208 D3 conveyor track stop sensor 2 N510040164AB FIBER CFT0209 D3 conveyor track stop sensor 3 N510060977AA BELT TA-4UEB M/D 4.5WX990.0L D3 track conveyor belt (loss item) 4 N5100651
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Parts & Supplies | Pick and Place/Feeders
N210071634AA Panasonic CM602 press cover fixed PIN 1 N510039140AB FIBER CFT0208 D3 conveyor track stop sensor 2 N510040164AB FIBER CFT0209 D3 conveyor track stop sensor 3 N510060977AA BELT TA-4UEB M/D 4.5WX990.0L D3 track conveyor belt (loss ite
Technical Library | 2019-05-30 10:59:13.0
In the current economic environment, the ability to reuse ball grid array(BGA) components that have failed due to solder defects may be an efficient way for electronics manufacturers to reduce costs. Cost may not be the only driving factor in the decision to engage in this recycling practice. The increasing demands placed upon the complexity of microprocessors and integrated circuits (ICs) has decreased the availability of some components, and increased their lead time. Because of this, reballing may provide a means to meet schedule, reduce rework turn-around time, and give a manufacturer a decisive advantage over other companies in an ever increasingly competitive market. This article will discuss the process of reballing BGA components (Figure 1), examining preparation (the preform method, the screen method), and cleaning and bake-out.
Technical Library | 2019-09-23 09:35:00.0
Failure analysis (FA), by its very nature, is needed only when things goawry. Before any testing is performed on the sample, a decision mustbe made as to whether or not the sample is allowed to be destroyedin the process of testing. Non-destructive testing can allow for re-use of the assembly since the functionality is not altered, but there still remains the possibility that inadvertent damage can occur through the course of the analysis. If non-destructive testing is preferred, then the following types of analysis can be performed. The testing can be divided into four categories: visual, X-ray (X-ray imaging and X-ray fluorescence), cleanliness (resistivity of solvent extract, ion chromatography, and Fourier transform infrared spectroscopy), and mechanical (non-destructive wire bond pull).
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Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Send the Special Express To Others Email this Special Express to: Your friend Your co-worker A decision maker in your company A Colleague NOTE: You may re-use this e-mail form as many times
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/about/weee
" (also known as "e-waste"). It refers to regulations, typically passed at a country, state or provincial level, aimed at promoting the reuse and recycling of electrical and electronic equipment and thereby reducing resource
| https://unisoft-cim.com/f2p-files.html
& Fixture GERBER Translations Other Services Testimonials Overview Pricing Contact Us .F2P Files The .F2P files are where annotation overlays, such as those circled in yellow below, can be saved and stored for reuse. A
