Electronics Forum | Mon Jun 12 07:42:56 EDT 2006 | brian.perry@suntroncorp.com
We are placing a gold plated device (LCC) to a NiAu PCB using a SnPb No-clean solder. We're noticing quite a bit of difficulty with reliable joints (intermittent connectivity) and if we have to rework a particular device, adjacent devices of this sa
Electronics Forum | Thu Jan 05 12:33:30 EST 2017 | rgduval
If you haven't resolved this yet, I think you're going to want to go to either the part or the package (I'm not sure which one off hand), and make sure that the hydra heads/tools are selected for placement. You'll also want the vision set to the lin
Industry News | 2013-04-12 08:14:52.0
Following on from recent investments to augment its test facilities, including a new flying probe tester and additional AOI facilities, the investment continues at JJS Electronics with orders recently placed for a complete new state-of- the-art surface mount line. The line is in response to increased demand for their PCB assembly services and will be fully operational in January.
Industry News | 2005-02-17 09:43:45.0
STOCKHOLM, Sweden, Feb 14, 2005
Technical Library | 2018-03-15 07:23:35.0
The SMT assembly process is continuously challenged by the factors which enhance circuit board performance and limit productivity. The pick and place and reflow systems reflect these driven issues by adding more and more controls to their systems, but the fact is one of the age old processes continues to operate within the same rules since the dawn of the SMT assembly world: The SMT screen printing. (...)This paper showcases a new stencil process that was discovered by reverting to the basics:understanding the reason for each stencil material process, focusing on detailed finishes and a disciplined aperture design process, maintaining original designs, and making the correctly designed apertures to control the paste deposition. The test results drove us to focus the efforts on the aperture walls In this paper we will demonstrate with lab tests SMT process results howthe improved paste release results in improved SMT print process performance and its positive impact on SPI yields and EOL performance.
Lewis & Clark | http://www.lewis-clark.com/product-tag/linescan-camera/
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PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_problem-overriding-molded-body-calculations_topic1906.xml
; L1 keeps reverting to the calculated value. Am I doing something wrong, or is this a bug?
