Industry Directory | Manufacturer
A manufacturer of desoldering braid (wick) with an emphasis on continuing advancement in soldering/desoldering technology, visual and x-ray inspection systems, fume extraction, and solder paste inspection systems.
New Equipment | Solder Materials
All AMTECH liquid fluxes are available in Flux-Righter™, a unique tool for rework and touch-up soldering. Flux-Righter™ allows a controlled amount of flux to be applied, thus eliminating the mess from conventional flux bottles. Flux-Righter™ is ideal
New Equipment | Solder Paste Stencils
Stentech produces mini stencils; small stencils that are used mainly for BGA re-work. Mini stencils are designed to deposit precise amounts of solder paste for single BGA footprints on loaded PCBs. These precision stencils mimic the footprint and ape
Electronics Forum | Fri Nov 09 16:57:27 EST 2001 | davef
Sure, it�s fine to use the proper amount of flux and no solder when reworking BGA. Recognize that these new solder connections have less metal and a lower standoff than similar BGA solder connections that have not been reworked. This undoubtedly
Electronics Forum | Tue Feb 20 16:56:36 EST 2001 | davef
There has been substantial amount of FEA done on predicting BGA ball reliability, but this has most often been applied to assessing the reliability of the design of products, rather than the effects of rework. This sounds like an interesting proje
Used SMT Equipment | Adhesive Dispensers
TH-2004KJ T&H Liquid Dispenser with high volume controller Features: Applicable to all kinds of fluid loading a large number. Have TH-600J is Suck-Back valve or TH-500J Diaphragm Valve Can select. Suck-Back feature eliminates post-dispense "drippin
Industry News | 2003-06-04 09:19:23.0
With increasing demand for fine pitch placements and a growing amount of fast turnaround high-tech low-volume prototype work, Speedboard has invested in additional SMT/BGA placement/rework equipment.
Industry News | 2003-06-10 08:16:44.0
The following text describes the application of NWA Quality Analyst to quality control in the assembly of electronic components.
Technical Library | 2016-08-18 15:38:09.0
The Selective Reflow Rework Process is an approach to improving the high volume rework process, increasing process capabilities and process repeatability by using a standard reflow oven of 12 zones, pick and place machinery, semi-automated printing gear and Solder Paste Inspection (SPI) implementations. This approach was able to reduce the amount of rework equipment by more than half. Our human resource requirements (indirect and direct labor) were cut by more than 50% and our rolled throughput yield increased from 68.9% to 84.14%. The Selective Reflow Rework Process is less reliant upon operators and has become a repeatable, stable rework process.
Technical Library | 2019-06-06 00:19:02.0
More and more people and things are using electronic devices to communicate. Subsequently, many electronic products, in particular mobile base stations and core network nodes, need to handle enormous amounts of data per second. One important link in this communication chain is high speed pressfit connectors that are often used to connect mother boards and back planes in core network nodes. These new high speed pressfit connectors have several hundreds of thin, short and weak pins that are prone to damage. Small variations in via hole dimensions or hole plating thickness affect the connections; if the holes are too small, the pins may be bentor permanently deformed and if the holes are too large they will not form gas tight connections.The goal of this project was to understand how rework of these new high speed pressfit connectors affects connection strengths, hole wall deformations and plating cracks.
Higher, faster, further! And also bigger: Ersa HR 600 XL – the ultimate solution for professional big board rework up to 24 x 24 inches. See the capabilities and flexibility of this exciting machine. More about HR 600 XL ? https://big-board-rework.de
SMT Framed Stencils are laser cut solder paste stencils designed to work on SMT printing machines. These laser cut stencils are permanently glued into a frame. These framed stencils are are designed for highly repeatable continuous operation in volum
Events Calendar | Tue Apr 13 00:00:00 EDT 2021 - Tue Apr 13 00:00:00 EDT 2021 | ,
Boston Chapter Webinar: Cleaning Chemistry For PWB and Rework - Part 2, session 1
Events Calendar | Tue Apr 13 00:00:00 EDT 2021 - Tue Apr 13 00:00:00 EDT 2021 | ,
Boston Chapter Webinar: Cleaning Chemistry For PWB and Rework - Part 2, session 2
Career Center | Houston, Texas USA | Engineering,Management,Quality Control,Technical Support
Seasoned Process & Quality Engineer. Degreed Chemical Engineer. 20+ years in Electronics Semiconductor manufacturing. Proficient in Quality Statistical tools, Design of Experiments, FMEAs, APQP, PPAP, ISO 9000, ISO/TS 16949 etc.
SMT Express, Volume 2, Issue No. 7 - from SMTnet.com Volume 2, Issue No. 7 Wednesday, July 12, 2000 Featured Article Return to Front Page Photonic Soldering for Rework Applications As appeared in Circuits Assembly, June 2000 Erick Russell
Article Return to Front Page Rework Management and Opti
| https://www.eptac.com/faqs/ask-helena-leo/ask/the-difference-between-touch-up-rework-and-repair
The Difference Between Touch-up, Rework and Repair - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
GPD Global | https://www.gpd-global.com/co_website/pcdpumpseries-pcdforunderfill.php
. Underfill deposits a low viscosity fluid underneath a device - either a flip chip or a BGA. In both cases, the idea is to dispense a repeatable volume that will result in a uniform amount of fluid around all sides of the device
