Industry Directory | Manufacturer
manufacture SMT stencils, SMT pallet and wave solder pallets, epoxy stencils, BGA rework systems,micro stencils, inspection templates. small percision metal parts.Electroform. SST Stencils. Machined parts.
Industry Directory | Consultant / Service Provider / Manufacturer
Manufacturing SMT Stencil, Reballing stencil. SMT pallet; Wave solder pallet and Engineering Services
Yincae’s SMT 158 Capillary Underfill is a combination of capillary flow and no-flow underfills, rapid curing, fast flowing and easy reworking liquid epoxy that can be used as an underfill for chip scale packages, ball grid array devices, PoP (package
Dispensing Equipment for Small Batches and Rework Micro dispensing for small batches and rework. Precisely dispense solder paste, epoxy and underfill with the highest consistency, even for the smallest dots. For 25 years MARTIN have been setting
Electronics Forum | Thu Feb 26 10:33:01 EST 2015 | emeto
Take a look at articles that explain underfill process and how to remove/rework underfill: http://www.finetechusa.com/rework/applications/underfill-rework.html http://www.circuitnet.com/experts/86535.shtml
Electronics Forum | Fri Aug 07 02:32:09 EDT 1998 | P.L. Sorenson - Technical Consultant
| | | I am looking for advice or information from anyone about the possible reliability problems associated with epoxy on solder pads of discrete devices. Will the epoxy expand and lift over time, Will there be adverse reaction between the solder and
Used SMT Equipment | Adhesive Dispensers
TH-2004ab T&H Two component mixer/meter dispensing system Features: 1. Have a big capacity cartridge, make the time of importing materials minimum, and reduce waste. 2. Adopted with the TH-700J pneumatic double-liquid valve can
Industry News | 2015-11-25 16:58:05.0
On behalf of the SMTA International Technical Committee, we invite you to submit a 300 word abstract of your research for the 2016 SMTA International 2016 technical conference in Rosemont, Illinois. Papers should describe significant results from experiments, emphasize new techniques, and contain technical, economic or appropriate test data. We are looking for papers on a variety of topics related to electronics manufacturing including advanced packaging/components, assembly, business/supply chain, emerging technologies, harsh environment applications, PCB technology, and process control. Materials must be original, unpublished and non-commercial in nature.
Industry News | 2011-01-20 13:45:14.0
IPC will introduce a cyber conference at IPC APEX EXPO in Las Vegas in 2011. The IPC APEX EXPO Cyber Conference will feature live broadcasts and post-show archives of seven of the show's thirty-five technical conference sessions on April 12–14, 2011.
Technical Library | 2017-08-17 12:23:27.0
A novel epoxy flux EF-A was developed with good compatibility with no-clean solder pastes, and imparts high reliability for BGA assembly at a low cost. This compatibility with solder pastes is achieved by a well-engineered miscibility between epoxy and no-clean solder paste flux systems, and is further assured with the introduction of a venting channel. The compatibility enables a single bonding step for BGAs or CSPs, which exhibit high thermal warpage, to form a high-reliability assembly. Requirements in drop test, thermal cycling test (TCT), and SIR are all met by this epoxy flux, EF-A. The high viscosity stability at ambient temperature is another critical element in building a robust and userfriendly epoxy flux system. EF-A can be deposited with dipping, dispensing, and jetting. Its 75°C Tg facilitates good reworkability and minimizes the adverse impact of unfilled underfill material on TCT of BGA assemblies.
Technical Library | 2014-05-12 09:24:11.0
With the advancement of the electronic industry, Package on package (POP) has become increasingly popular IC package for electronic devices, particularly in mobile devices due to its benefits of miniaturization, design flexibility and cost efficiency. However, there are some issues that have been reported such as SIR drop due to small gap between top and bottom components, difficulty underfilling and rework due to stacked IC components and process yield issues. Some suppliers have reported using some methods such as dipping epoxy paste or epoxy flux to address these issues, but so far, no customer has reported using these methods or materials in their mass production. In order to address these issues for POP assembly, YINCAE has successfully developed a first individual solder joint encapsulant adhesive.
TH-2004ab T&H Two component mixer/meter dispensing system Features: 1. Have a big capacity cartridge, make the time of importing materials minimum, and reduce waste. 2. Adopted with the TH-700J pneumatic double-liquid valve can
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Career Center | Brooklyn, New York USA | Engineering,Production
Mini-Circuits designs, manufactures and distributes integrated circuits, modules, and sub-systems for high performance radio frequency (RF) and microwave applications. With design, sales and manufacturing locations in over 30 countries, Mini-Ci
Career Center | GARLAND, Texas USA | Production
exp in Fuji, Juki and universal smt pick and place machines . Component verification.
Career Center | GARLAND, Texas USA | Production
Fuji, Juki, Universal SMT pick and place machines experience.
SMTnet Express, January 8, 2020, Subscribers: 33,435, Companies: 10,958, Users: 25,498 Copper/Epoxy Joints in Printed Circuit Boards: Manufacturing and Interfacial Failure Mechanisms Credits: Polymer Competence Center Leoben GmbH PCBs have a wide
Polyphenylene Ether Macromonomers. XI. Use in Non-Epoxy Printed Wiring Boards SMTnet Express November 1, 2012, Subscribers: 25762, Members: Companies: 9029, Users: 33891 Polyphenylene Ether Macromonomers. XI. Use in Non-Epoxy Printed Wiring Boards
