Industry Directory | Manufacturer
Board level EMI/RF shields, wireless antenna, electrical contacts and clips are typical examples of components we manufacture.
Industry Directory | Manufacturer
Specialist manufacturers of EMI /RF screening and shielding products
http://www.flason-smt.com/product/Siemens-pneumatic-Feeder-Storage-Cart-Feeder-Trolley.html Siemens pneumatic Feeder Storage Cart Feeder Trolley Feeder Storage Cart Siemens Feeder Storage Cart Siemens pneumatic Feeder Storage Cart Feeder Trolle
http://www.flason-smt.com/product/Siemens-X-Seires-feeder-storage-cart-Feeder-Trolley.html Siemens X Seires feeder storage cart|Feeder Trolley Feeder storage Cart Siemens Feeder storage Cart Siemens X Seires feeder storage cart|Feeder Trolley
Used SMT Equipment | General Purpose Equipment
Shield efficiency,impedance of clip measurement and flexibility of product of our company are the best ones,it can be used for special shield clothes for high radiation in electronic and electromagnetic industries,special shield cloth of shield r
Used SMT Equipment | General Purpose Equipment
The EMI Shielding Gaskets are made of spong and conductive fabric which can be used in the gap of the equipments and provide a connection.They have good shield efficiency,impedance of clip measurement,it can be used for the high radiation instrum
Industry News | 2003-04-15 08:57:18.0
First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies
Industry News | 2016-07-10 13:54:05.0
Nordson ASYMTEK, a Nordson company (NASDAQ: NDSN), and Parker Chomerics, a Division of Parker Hannifin Corporation (NYSE:PH), are partnering at SEMICON West in Parker Chomerics' booth #6557 to demonstrate precision, high-volume spray applications for EMI coating solutions. One specific solution uses Nordson ASYMTEK's Select Coat® Conformal Coating System with a DispenseJet® applicator to apply thin coatings of Parker Chomerics' new CHO-SHIELD-604 conductive coating to achieve a target thickness of 25 µm. SEMICON West is being held at Moscone Center, San Francisco, CA, July 12-14, 2016.
Technical Library | 2008-10-15 20:16:12.0
Solder paste dispensing is usually considered a slow process. Due to the speed advantages, screen printing is used to apply solder paste whenever possible. However, screen printing is not always an option. Leveraging the high speed of piezo drive technology opens the door to a broad range of solder paste dispensing applications. The ability to dispense dots under 300-μm diameter, even as small as 125 μm, enables BGA rework, small geometry deposits for miniaturized passive components, electrical connections in recessed cavities, and RF shield attach for handheld devices.
Technical Library | 2023-07-25 16:50:02.0
Some of the new handheld communication devices offer real challenges to the paste printing process. Normally, there are very small devices like 01005 chip components as well as 0.3 mm pitch uBGA along with other devices that require higher deposits of solder paste. Surface mount connectors or RF shields with coplanarity issues fall into this category. Aperture sizes for the small devices require a stencil thickness in the 50 to 75 um (2-3 mils) range for effective paste transfer whereas the RF shield and SMT connector would like at least 150 um (6 mils) paste height. Spacing is too small to use normal step stencils. This paper will explore a different type of step stencil for this application; a "Two-Print Stencil Process" step stencil. Here is a brief description of a "Two-Print Stencil Process". A 50 to 75 um (2-3 mils) stencil is used to print solder paste for the 01005, 0.3 mm pitch uBGA and other fine pitch components. While this paste is still wet a second in-line stencil printer is used to print all other components using a second thicker stencil. This second stencil has relief pockets on the contact side of the stencil any paste was printed with the first stencil. Design guidelines for minimum keep-out distances between the relief step, the fine pitch apertures, and the RF Shields apertures as well relief pocket height clearance of the paste printed by the first print stencil will be provided.
EZ-BoardWare is a range of SMT PCB Hardware from Harwin that allows simplified EMC shielding, improves cable management and solves tricky PCB layout issues. Packaged in EIA-481-2 compliant tape & reel packaging the products integrate simply into exis
EZ-BoardWare is a range of SMT PCB Hardware from Harwin that allows simplified EMC shielding, improves cable management and solves tricky PCB layout issues. Packaged in EIA-481-2 compliant tape & reel packaging the products integrate simply into exis
Career Center | Dallas, Texas USA | Engineering
Job description: Engineer is responsible for the design of RF, Microwave and support circuitry for miniaturized Rf/Wireless modules utilizing highlt integrated semiconductors and an array of substrate and packaging technologies. Will design, simula
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/your-process/video-library/emi-conductive-coating-solution-achieving-a-target-thickness-of-25-um
Conformal Coating System with a DispenseJet ® applicator to apply thin coatings of Parker Chomerics' new CHO-SHIELD-604 conductive coating to achieve a target thickness of 25 µm
KD Electronics Ltd. | http://www.kundasmt.com/?A-Equipment-Accessories/6008.html
) 03000505-03 wiper-clip ri (tape cutter HF) 03000506-03 wiper-clip left (SIPLACE HF) 03000512-01 SHORT STROKE ZYLINDER 50x40 03000518-03 hinge (tape cutter HF
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