Industry Directory | Manufacturer
RF Electronics provides a customized integrated RF Shield Box for manual or automatic testing at an off-the-shelf solution price. Our Pre-Certified testbed services include equipment assembly, systems integration, and testing
Industry Directory | Manufacturer
Specialist manufacturers of EMI /RF screening and shielding products
Two-piece Drawn RF Shields Engineering Kit, EMI Shielded Cans, RF Shielding Cabinets for PCB, Board Level Shielding, Tin Plated Steel, SMD. Seamless Protective EMI/RFI Cages, available for purchasing online! Complimentary CAD files are available for
New Equipment | Test Equipment
LBA EMFaraCage® faraday cages are EMI and RFI shielded boxes and RF test enclosures which bring convenience to device testing. The faraday cage is ideal for isolating critical systems in high field RF environments, or wherever RF ingress or egress mu
Electronics Forum | Wed Apr 28 22:16:51 EDT 1999 | Steve Gregory
| Hi everyone, | We started our first machine placed shield test today.We will be machine placing shields with in the next two months. I used a Fuji Qp242 today. There were no problems with pickup etc,. just vision errors. I'm sure we will work the
Electronics Forum | Thu May 01 11:56:04 EDT 2008 | realchunks
It sounds like this part is floating on your solder joint during reflow. You may need to redesign your pad geometry. In general with this type of clip - smaller pads are better. If you cannotcahnge pad size, try changing the openings on your stenc
Used SMT Equipment | In-Circuit Testers
Ramsey STE5000 Wireless device testing Perfect for 802.11a, b, g Bluetooth, RFID, 3G testing Wide variety of I/O options Super isolation up to 18GHz Stock models to fit your custom applications The STE5000 enclosure represents a breakthrough
Used SMT Equipment | In-Circuit Testers
Ramsey STE5000 Ramsey STE5000 Wireless device testing Perfect for 802.11a, b, g Bluetooth, RFID, 3G testing Wide variety of I/O options Super isolation up to 18GHz Stock models to fit your custom applications The STE5000 enclosure repres
Industry News | 2003-04-15 08:57:18.0
First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies
Industry News | 2016-07-10 13:54:05.0
Nordson ASYMTEK, a Nordson company (NASDAQ: NDSN), and Parker Chomerics, a Division of Parker Hannifin Corporation (NYSE:PH), are partnering at SEMICON West in Parker Chomerics' booth #6557 to demonstrate precision, high-volume spray applications for EMI coating solutions. One specific solution uses Nordson ASYMTEK's Select Coat® Conformal Coating System with a DispenseJet® applicator to apply thin coatings of Parker Chomerics' new CHO-SHIELD-604 conductive coating to achieve a target thickness of 25 µm. SEMICON West is being held at Moscone Center, San Francisco, CA, July 12-14, 2016.
Parts & Supplies | Pick and Place/Feeders
SIEMENS COMPONENTS CAMERA 24x24 00336791S04 More others items pls contact with me by Jasmine@qy-smt.com 00336222-01 SOKO-NOZZLE 7XX A6,5×3,5a5,5×1,5 00336690-02 CONVERSION PC-BOARD PORTAL 00336247-02 ADHESIVE FILM 00336778-01 HAN ADD-ON HOUSIN
Parts & Supplies | Assembly Accessories
Detailed Product Description Features: 7 Channel Brand: KIC Part Name: X5 Reflow Profiler Model: X5 Condition: Original New Leadtime: 7days KIC X5 Thermal Profiler with SPC software and RF capability For Reflow Track More Data Points With 7,
Technical Library | 2008-10-15 20:16:12.0
Solder paste dispensing is usually considered a slow process. Due to the speed advantages, screen printing is used to apply solder paste whenever possible. However, screen printing is not always an option. Leveraging the high speed of piezo drive technology opens the door to a broad range of solder paste dispensing applications. The ability to dispense dots under 300-μm diameter, even as small as 125 μm, enables BGA rework, small geometry deposits for miniaturized passive components, electrical connections in recessed cavities, and RF shield attach for handheld devices.
Technical Library | 2023-07-25 16:50:02.0
Some of the new handheld communication devices offer real challenges to the paste printing process. Normally, there are very small devices like 01005 chip components as well as 0.3 mm pitch uBGA along with other devices that require higher deposits of solder paste. Surface mount connectors or RF shields with coplanarity issues fall into this category. Aperture sizes for the small devices require a stencil thickness in the 50 to 75 um (2-3 mils) range for effective paste transfer whereas the RF shield and SMT connector would like at least 150 um (6 mils) paste height. Spacing is too small to use normal step stencils. This paper will explore a different type of step stencil for this application; a "Two-Print Stencil Process" step stencil. Here is a brief description of a "Two-Print Stencil Process". A 50 to 75 um (2-3 mils) stencil is used to print solder paste for the 01005, 0.3 mm pitch uBGA and other fine pitch components. While this paste is still wet a second in-line stencil printer is used to print all other components using a second thicker stencil. This second stencil has relief pockets on the contact side of the stencil any paste was printed with the first stencil. Design guidelines for minimum keep-out distances between the relief step, the fine pitch apertures, and the RF Shields apertures as well relief pocket height clearance of the paste printed by the first print stencil will be provided.
Ningbo Hexin customized with metal shielding cover for pcb board with reel and tape packing
Ningbo Hexin customized with metal shielding cover for pcb board with reel and tape packing
Events Calendar | Wed Apr 26 00:00:00 EDT 2017 - Thu Apr 27 00:00:00 EDT 2017 | Paris, France
2017 RaMP Workshop and Tabletop Exhibition
International Microelectronics Assembly and Packaging Society (IMAPS)
Career Center | Dallas, Texas USA | Engineering
Job description: Engineer is responsible for the design of RF, Microwave and support circuitry for miniaturized Rf/Wireless modules utilizing highlt integrated semiconductors and an array of substrate and packaging technologies. Will design, simula
Career Center | Kathmandu, Nepal | Engineering
I have been working from last 4 years in different field and post. Where i can gather different experiences and enhanced my knowledge of real field. I am really storng canididates for the technical post. Hon of bachelor in electronics and communicat
| https://www.eptac.com/faqs/ask-helena-leo/ask/j-std-001e-2010-4-5-1-gold-removal-issues
: 4.5.1, Gold Removal Issues Question: Since we are seeing more and more components with gold finish on the solder attachment pads(specifically, leadless ICs mostly with bottom side terminations only for RF circuitry
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/your-process/video-library/emi-conductive-coating-solution-achieving-a-target-thickness-of-25-um
Conformal Coating System with a DispenseJet ® applicator to apply thin coatings of Parker Chomerics' new CHO-SHIELD-604 conductive coating to achieve a target thickness of 25 µm
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