Industry Directory | Manufacturer
Radiotronix set as its goal to create a new generation of highly-integrated IC-style RF module that combined ease of use, enhanced performance and lowered customer cost.
Siemens Siplace X4 Pick And Place Machine Siemens Siplace Pick And Place Machine Siemens Pick And Place Machine Siemens Pick and Place Machine Patch speed:120000CPH Dimension:1900×2734 Weight: 3460kg Product description: Siemens Siplac
0.3mm SPTE Tinplated rf shielding can for wireless module antenna ISO9001
Used SMT Equipment | In-Circuit Testers
Agilent E5515C-002-003-E1961A-E1962B-E1963A-E1966A-E1968A-E1976AAgilent-HP E5515C-002-003-E1968A-101-E1968A-102-E1968A-103-E1963A-E1962B-E1966A-E1976A-E1961A; 8960 Series 10 Wireless Communications Test Set8960 Series 10 Wireless Communications Test
Used SMT Equipment | In-Circuit Testers
Agilent E5515C-002-003-E1962B-E1963A-E1968A-F0201A-F0202AAgilent-HP E5515C-002-003-E1968A-101-E1968A-102-E1968A-103-E1968A-410-E1963A-E1963A-403-E1963A-413-F0201A-F0202A-E1962B-E1962B-406; 8960 Series 10 Wireless Communications Test Set The industry
Industry News | 2003-04-15 08:57:18.0
First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies
Industry News | 2003-05-22 08:14:29.0
RF module reference designs have been developed so that the customer can take the radio design and drop it right into their PCB or build a separate module
Technical Library | 2022-02-09 17:52:47.0
This article presents the first time that an millimeter-wave (mm-wave) multichip module (MCM) with on-demand "smart" encapsulation has been fabricated utilizing additive manufacturing technologies. RF and dc interconnects were fabricated using inkjet printing, while the encapsulation was realized using 3-D printing. Inkjet-printed interconnects feature superior RF performance, better mechanical reliability, and on-demand, low-cost fabrication process.
Technical Library | 2016-06-21 09:15:31.0
The trends in mobile electronics today are smaller, thinner and lighter. Yet, mobile devices are more powerful than ever. Applications, like wireless internet connections, RFID and Bluetooth, that have become essential in today’s devices, require more complex transmission mechanisms. As a result, manufacturers find themselves faced with the challenge of working with ultra-miniature RF cable assemblies.
In the world of makers, people enjoy the fun of designing and developing hardware/ software, even final electronic products. They will not concentrate a lot on the cost and manufacturability. But it is quite different from lab to factory, when it com
Texas Instruments New and Original CC1310F128RGZR in Stock IC VQFN-48 package CC1310F128RGZR RF Microcontroller- MCU SimpleLink 32-bit Arm Cortex-M3 Sub-1 GHz wireless MCU with 128kB Flash 48-VQFN -40 to 85 EP4CE6E
Career Center | Dallas, Texas USA | Engineering
Skills/Requirements: BSEE a must, MSEE optional, 7+ yrs experience in RF wireless systems, preferably in a commercial enviornment. Duties/Functions: Provide technicl of customer requirements to the optimized of miniaturized RF/Wireless modules. Utili
Career Center | Dallas, Texas USA | Engineering
Skills/Requirements: 5+ years design of RF microwave and support circuitry for miniturized RF/Wireless modules. Prefer someone out of Telecom. Duties/Funtions: CDMA, GSM would like to have Engineer out of small hand held mobile radio MFG. Prefer mi
Career Center | Vapi, Gujarat India | Engineering
Im kirit Vadvekar Worked as a Shift In charge in M/s. KOBIAN ECS (India) Private Ltd. Silvassa. Manufacturer of MERCURY brand computer motherboards in SMT (Surface Mounting Technology) Dept. From 26 Dec 2001 to 13Dec2003. Having knowledge of SMT mach
Career Center | Toronto, Ontario Canada | Engineering,Maintenance,Research and Development,Technical Support
DANIEL P ROONEY 6 LEATHILL RD. UNIT 45 TORONTO, ONTARIO M2J 1Z2 (416) 418-3456 (519) 623-6531(leave Message) E-mail: rooney01@hotmail.com Objective: To achieve a challenging electronics position that will allow the use of skills I have learned an
Imagineering, Inc. | https://www.pcbnet.com/blog/fr-4-vs-rogers-material-for-manufacturing-rf-pcbs/
. They are used for situations that require high speed, such as sensors, wireless controllers, and even robotics. Due to the special properties of RF PCBs, special materials and manufacturing processes are required during fabrication and assembly
KingFei SMT Tech | https://www.smtspare-parts.com/buy-nozzle_assembly-page21.html
Buy nozzle assembly, Good quality nozzle assembly manufacturer Leave a Message We will call you back soon! Your message must be between 20-3,000 characters
