New Equipment | Solder Materials
ALPHA® EF-Series fluxes offer environmentally friendly benefits, while providing unmatched soldering performance. The ALPHA soldering flux line is unsurpassed in providing wave soldering process solutions. Its alcohol-based fluxes provide excellent w
Electronics Forum | Fri Sep 08 12:03:24 EDT 2017 | rameshraja
Hi, I need the RF 800 Flux Acid titration procedure and also require EPT of the same to add thinner ( RF 800 additive), i.e we are using the flux rf 800 for our wave soldering process having foam fluxer , after 2 hours we are taking sample from the
Electronics Forum | Thu Aug 12 08:03:54 EDT 2004 | Rafal M.
We used fluxes: Cobar 94-QMB (no bismuth), RF800, Cobar94RXZ-M, with foam and spray fluxers: MBO clean alloy SN63PB37.experienced with changing preheatting, speed of covoyer single and double wave., we tried every combination. I think the problem is
Technical Library | 2021-10-20 18:21:06.0
The solderability of the SAC305 alloy in contact with printed circuit boards (PCB) having different surface finishes was examined using the wetting balance method. The study was performed at a temperature of 260 _C on three types of PCBs covered with (1) hot air solder leveling (HASL LF), (2) electroless nickel immersion gold (ENIG), and (3) organic surface protectant (OSP), organic finish, all on Cu substrates and two types of fluxes (EF2202 and RF800). The results showed that the PCB substrate surface finish has a strong effect on the value of both the wetting time t0 and the contact angle h. The shortest wetting time was noted for the OSP finish (t0 = 0.6 s with EF2202 flux and t0 = 0.98 s with RF800 flux), while the ENIG finish showed the longest wetting time (t0 = 1.36 s with EF2202 flux and t0 = 1.55 s with RF800 flux). The h values calculated from the wetting balance tests were as follows: the lowest h of 45_ was formed on HASL LF (EF2202 flux), the highest h of 63_ was noted on the OSP finish, while on the ENIG finish, it was 58_ (EF2202 flux). After the solderability tests, the interface characterization of cross-sectional samples was performed by means of scanning electron microscopy coupled with energy dispersive spectroscopy.
Heller Industries Inc. | https://hellerindustries.com/void-free-soldering/
. As a result, void free solder connections are increasingly a necessity in order to comply with today’s reliability standards. Voids in solder joints can lead to many undesirable issues such as Device overheating Reduced electrical performance Reduced RF performance for high-frequency applications Lower overall reliability
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