All aspects of electronic interconnect solutions are available, including package and substrate design and lay-out, thermal analysis, high-speed simulation, process development, test engineering, and materials procurement. Technology assessment generally involves short turnaround times and consist of one or more of the following activities:
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Electronics Forum | Thu Feb 25 10:17:44 EST 1999 | Joe Cameron
I second Dave's encouragement to use the archives. It's a wealth of info and the search engine usually get's me what I want the first time. By the way, Richard, are you soldering your thermocouple to a ball on the BGA with hi-temp solder? It'd hel
Electronics Forum | Wed May 26 14:01:18 EDT 1999 | Bill Schreiber
Dear Ricardo, We have a number of published articles on our web site. One of them is titled "Improving Screen Printing Yields" by Richard Clouthier of AMTX stencils (now Photo Stencil). This article appeared in EP&P magizine and also Asian Electron
Industry News | 2003-04-21 10:09:08.0
New Sales, Marketing Channel for Emerging EDA Companies
Industry News | 2013-05-23 20:06:11.0
The SMTA proudly announces 33 engineers have received SMTA Certification for SMT Processes since May 2012. The SMTA Certification program is unique as it recognizes and certifies the entire SMT assembly process at an engineering level.
Technical Library | 2014-03-27 14:32:24.0
The surface finish you select will have a large influence on quality, reliability and cost. It is a complex decision that impacts many areas of the business. Select a finish that optimal for the business (and not just one function). Know that there are engineering tricks to improve on weak areas of each finish. Stay current in this field because new developments continue to be made.
Technical Library | 2010-07-08 19:56:15.0
As technology becomes increasingly reliant on electronics, understanding the reliability of lead-free solder also becomes increasingly important. This research project focused on phase transformation kinetics with the lead-free solder SAC 305. Today in the electronics industry, SAC 305 is the most widely used solder, making it a high priority to understand its long-term stability and performance in a variety of service conditions. Recent evidence has shifted the focus from thermal aging to reflow temperature and time above liquidus values during initial solder melting.
Events Calendar | Mon Apr 12 00:00:00 EDT 2021 - Mon Apr 12 00:00:00 EDT 2021 | ,
Europe Chapter Webinar: Tombstoning Components during Reflow Soldering - Causes & Cures
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SMTnet Express, August 17, 2017, Subscribers: 30,720, Companies: 10,649, Users: 23,665 The Effect of Vacuum Reflow Processing On Solder Joint Voiding And Thermal Fatigue Reliability Richard Coyle, Richard Popowich, Charmaine Johnson - Nokia Bell
SMTnet Express, January 8, 2015, Subscribers: 23,708, Members: Companies: 14,158 , Users: 37,476 The Effect of Pb Mixing Levels on Solder Joint Reliability and Failure Mode of Backward Compatible, High Density Ball Grid Array Assemblies Richard
Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf
. THE EFFECT OF VACUUM REFLOW PROCESSING ON SOLDER JOINT VOIDING AND THERMAL FATIGUE RELIABILITY Richard Coyle1, Dave Hillman2, Michael Barnes3, David Heller3, Charmaine Johnson1, Richard Popowich1
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/Vacuum-Void-Reduction-Reflow.pdf
. THE EFFECT OF VACUUM REFLOW PROCESSING ON SOLDER JOINT VOIDING AND THERMAL FATIGUE RELIABILITY Richard Coyle1, Dave Hillman2, Michael Barnes3, David Heller3, Charmaine Johnson1, Richard Popowich1
