New Advanced Precision Auger Pump - Single Pump Solution The Precision Auger pump is designed to work with mid-to-high viscosity liquid such as glues, conductive, and non-conductive adhesive and pastes. The pump is controlled with a servo motor equ
New Equipment | Board Handling - Storage
The F9051 PCB Transport Cart has 3 shelves of card guides. Each level can hold fifty 11" long PCBs. The card guides are made of conductive material fo safe and convenient handling of PCBs during assembly. Additional shelves cand be added. Center to c
Electronics Forum | Tue May 22 11:38:04 EDT 2012 | naynayno
I am looking for IPC or other published standards that specify cleanliness levels for: 1) solder paste stencils 2) selective solder pallets When we cleaned PCB's we used a limit of 4 M-ohms. Now that we have transitioned to No-Clean, I am wonderi
Electronics Forum | Tue May 22 14:30:54 EDT 2012 | davef
There is no standard, nor should there be. You need to establish a standard that meets your customer requirements. The problem with those old-timey standard is that there's just so many choices. What works for you just might be too strict [or loose]
Used SMT Equipment | Board Cleaners
Speedline Aquastorm 50 Batch Wash Model: Aquastorm 50 Batch Vintage: 8/2015 Power Clean Basket – Big Board Stackable Rack Automatic Chemistry Dosing System Conductivity Probe For Rinse Discharge Resistivity Meter for Final Rinse Power: 480V, 3-Phase,
Used SMT Equipment | Board Cleaners
Aquastorm 50 Electrovert Series Cleaning System Used in production for one week. Power Clean Basket - Big Board 440-480 Vac (3 phase) 60 Hertz Closed loop rinse without filtration media (pre-plumbed for customer supplied filtration media) C
Industry News | 2016-02-27 22:11:00.0
GPD Global has advanced its auger pump technology with the introduction of the newly developed Precision Auger Pump. This pump was designed to offer a wide range of functionality in your process development by being compatible with a wide range of auger/cartridge assemblies.
Industry News | 2020-01-07 11:09:15.0
IPC-8921 establishes classifications and designations for woven and knitted e-textiles integrated with e-fibers, e-yarns and e-wires. It also standardizes key characteristics and durability testing for these materials as well as the industry test methods to be used to test against those characteristics.
Technical Library | 2020-10-14 14:33:36.0
Epoxy based adhesives are prevalent interface materials for all levels of electronic packaging. One reason for their widespread success is their ability to accept fillers. Fillers allow the adhesive formulator to tailor the electrical and thermal properties of a given epoxy. Silver flake allow the adhesive to be both electrically conductive and thermally conductive. For potting applications, heat sinking, and general encapsulation where high electrical isolation is required, aluminum oxide has been the filler of choice. Today, advanced Boron Nitride filled epoxies challenge alternative thermal interface materials like silicones, greases, tapes, or pads. The paper discusses key attributes for designing and formulating advanced thermally conductive epoxies. Comparisons to other common fillers used in packaging are made. The filler size, shape and distribution, as well as concentration in the resin, will determine the adhesive viscosity and rheology. Correlation's between Thermal Resistance calculations and adhesive viscosity are made. Examples are shown that determination of thermal conductivity values in "bulk" form, do not translate into actual package thermal resistance. Four commercially available thermally conductive adhesives were obtained for the study. Adhesives were screened by shear strength measurements, Thermal Cycling ( -55 °C to 125 °C ) Resistance, and damp heat ( 85 °C / 85 %RH ) resistance. The results indicate that low modulus Boron Nitride filled epoxies are superior in formulation and design. Careful selection of stress relief agents, filler morphology, and concentration levels are critical choices the skilled formulator must make. The advantages and limitations of each are discussed and demonstrated.
Technical Library | 2016-05-19 16:03:37.0
As consumers become more reliant on their handheld electronic devices and take them into new environments, devices are increasingly exposed to situations that can cause failure. In response, the electronics industry is making these devices more resistant to environmental exposures. Printed circuit board assemblies, handheld devices and wearables can benefit from a protective conformal coating to minimize device failures by providing a barrier to environmental exposure and contamination. Traditional conformal coatings can be applied very thick and often require thermal or UV curing steps that add extra cost and processing time compared to alternative technologies. These coatings, due to their thickness, commonly require time and effort to mask connectors in order to permit electrical conductivity. Ultra-thin fluorochemical coatings, however, can provide excellent protection, are thin enough to not necessarily require component masking and do not necessarily require curing. In this work, ultra-thin fluoropolymer coatings were tested by internal and industry approved test methods, such as IEC (ingress protection), IPC (conformal coating qualification), and ASTM (flowers-of-sulfur exposure), to determine whether this level of protection and process ease was possible.
New Advanced Precision Auger Pump - Single Pump Solution The Precision Auger pump is designed to work with mid-to-high viscosity liquid such as glues, conductive, and non-conductive adhesive and pastes. The pump is controlled with a servo motor equ
Squeegee Cleaning Machine ETA-4200 If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. PCBA Cleaning Machine, On-line PCBA Cleaning Machine, Ste
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