Industry Directory | Consultant / Service Provider / Marketing Agency
The ideal strategic digital marketing company to help you achieve the necessary online presence for your company is Rise Rapid Marketing. We enable your company to generate the appropriate level of interaction, revenue overall, an
Industry Directory | Distributor
We are importers and distributors of jewelry manufacturing equipment
New Equipment | Soldering Robots
Hot Bar Soldering Machine Thermode Welding Double Side Soldering Simultaneously Technical Parameters Model:CWPDY2IN Power:6*2 KW Power Supply:220V 50Hz Inverter frequency: 4*2 KHz Load sustained rate: 20% Heati
2.0 Cmk @ ± 25 μmProduct description: DEK E Seriels SMT Stencil Printer E by DEK, core cycle time: 8 seconds, Substrate size: 620 mm (X) x 508.5 mm (Y), System alignment capability: > 2.0 Cmk @ ± 25 μm DEK E SMT Stencil Printer DEK E SMT Stenc
Electronics Forum | Fri Feb 01 13:09:16 EST 2013 | emeto
I am glad you got it. It had to be one of these.
Electronics Forum | Wed Jan 30 11:27:44 EST 2013 | ericrr
----- More ------ Due to the need to keep to run going while waiting fo the repair joker to emerge, are doing the run on just two machines.It turns out that when the faulty machine has been left on for two hours the fault disappears and the machine w
Used SMT Equipment | X-Ray Inspection
Nikon XTV130 Microfocus X-Ray System Make: Nikon / X-TEK Model: XT V 130 Year: 2011 Xray Source: 130kV 10W Nanotech TT Manipulator: 1.2kg 4 Axis Power Supply: 230V, 1PH, 50/60Hz, AC, 1500VA Hamamatsu Image Intensifier C7336-03 MOD X-Ray Source: Open
Used SMT Equipment | In-Circuit Testers
80 dB, rise/fall time SM-B8 = Pulse Modulator: on/off ratio >80 dB, rise/fall time SM-B9= Pulse Modulator: on/off ratio >80 dB, rise/fall time SM-B4 = Pulse Generator: only in conjunction with SM-B3/SM-B8/SM-B9; provides single, delayed and dou
Industry News | 2003-06-04 08:27:58.0
DuPont cites rising raw material, transportation and energy costs as reasons for the increase.
Industry News | 2003-02-20 08:04:10.0
The Mini-Fix card-to-cable connector is designed to withstand hundreds of mating cycles with high contact security and mechanical stability.
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Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 1999-05-06 10:36:37.0
Augmented-Fin Air-Cooled Heat Sinks Achieve Higher Performance without Significant Rise in Static Pressure Drop.
Increase productivity, improve quality, reduce costs with vertical format curing solutions from Heller Industries. Learn more: http://www.hellerindustries.com/755-Vertical-Oven.php
This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Thu May 06 00:00:00 EDT 2021 - Thu May 06 00:00:00 EDT 2021 | ,
Webinar: Networking in a Virtual World
Events Calendar | Tue Feb 15 00:00:00 EST 2022 - Thu Feb 17 00:00:00 EST 2022 | San Jose, California USA
Wafer-Level Packaging Symposium
Career Center | Hudson, Massachusetts USA | Sales/Marketing
Seasoned, sucessful Sales Rep, or Sales Rep organization wanted to represent Altronics Manufacturing Inc. Altronics is a new, well-funded company with a state of the art manufacturing facility, and an outstanding Engineering and Manufacturing staff
Career Center | Orlando, Florida USA | Sales/Marketing
We are looking for a full time field sales representative to join our growing team of professionals offering manufacturing equipment and supplies to the Electronics Manufacturing Industry. This is a new sales position that has been created due to gro
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/polymer-processing-systems/information/solutions-for-medical-tubing-applications
. The Nordson Solution Package for PEBAX Tubing Applications For low shear and no temperature rise, Xaloy ® Single Flighted Screw with a Stratablend ® II Mixer
| https://www.eptac.com/webinars/damage-prevention-when-soldering-ceramic-chip-capacitors
have been around for years and used in a variety of assemblies, but as their size has shrunk over time, their susceptibility to damage has continued to rise
