Industry Directory | Consultant / Service Provider / Marketing Agency
The ideal strategic digital marketing company to help you achieve the necessary online presence for your company is Rise Rapid Marketing. We enable your company to generate the appropriate level of interaction, revenue overall, an
Industry Directory | Distributor
We are importers and distributors of jewelry manufacturing equipment
New Equipment | Soldering Robots
Hot Bar Soldering Machine Thermode Welding Double Side Soldering Simultaneously Technical Parameters Model:CWPDY2IN Power:6*2 KW Power Supply:220V 50Hz Inverter frequency: 4*2 KHz Load sustained rate: 20% Heati
2.0 Cmk @ ± 25 μmProduct description: DEK E Seriels SMT Stencil Printer E by DEK, core cycle time: 8 seconds, Substrate size: 620 mm (X) x 508.5 mm (Y), System alignment capability: > 2.0 Cmk @ ± 25 μm DEK E SMT Stencil Printer DEK E SMT Stenc
Electronics Forum | Wed Apr 24 21:33:02 EDT 2019 | pcbindex1
With the upcoming of the traditional peak season(Q3), a rising price among the mainland factories, and a continual rise in the bronze price in the London Metal Exchange in August, there is also a trend for the rise in the quotation of the PCB’s upstr
Electronics Forum | Thu Apr 11 16:37:16 EDT 2002 | pteerink
Profile would be the first place I look. Check your rise and fall rates for temp. Should be no more than 2 deg/sec for rise and 4-6 deg/sec for cooling. Phil
Used SMT Equipment | X-Ray Inspection
Nikon XTV130 Microfocus X-Ray System Make: Nikon / X-TEK Model: XT V 130 Year: 2011 Xray Source: 130kV 10W Nanotech TT Manipulator: 1.2kg 4 Axis Power Supply: 230V, 1PH, 50/60Hz, AC, 1500VA Hamamatsu Image Intensifier C7336-03 MOD X-Ray Source: Open
Used SMT Equipment | In-Circuit Testers
80 dB, rise/fall time SM-B8 = Pulse Modulator: on/off ratio >80 dB, rise/fall time SM-B9= Pulse Modulator: on/off ratio >80 dB, rise/fall time SM-B4 = Pulse Generator: only in conjunction with SM-B3/SM-B8/SM-B9; provides single, delayed and dou
Industry News | 2003-06-04 08:27:58.0
DuPont cites rising raw material, transportation and energy costs as reasons for the increase.
Industry News | 2003-02-20 08:04:10.0
The Mini-Fix card-to-cable connector is designed to withstand hundreds of mating cycles with high contact security and mechanical stability.
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Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 1999-05-06 10:36:37.0
Augmented-Fin Air-Cooled Heat Sinks Achieve Higher Performance without Significant Rise in Static Pressure Drop.
Increase productivity, improve quality, reduce costs with vertical format curing solutions from Heller Industries. Learn more: http://www.hellerindustries.com/755-Vertical-Oven.php
This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Thu May 06 00:00:00 EDT 2021 - Thu May 06 00:00:00 EDT 2021 | ,
Webinar: Networking in a Virtual World
Events Calendar | Tue Feb 15 00:00:00 EST 2022 - Thu Feb 17 00:00:00 EST 2022 | San Jose, California USA
Wafer-Level Packaging Symposium
Career Center | Hudson, Massachusetts USA | Sales/Marketing
Seasoned, sucessful Sales Rep, or Sales Rep organization wanted to represent Altronics Manufacturing Inc. Altronics is a new, well-funded company with a state of the art manufacturing facility, and an outstanding Engineering and Manufacturing staff
Career Center | Orlando, Florida USA | Sales/Marketing
We are looking for a full time field sales representative to join our growing team of professionals offering manufacturing equipment and supplies to the Electronics Manufacturing Industry. This is a new sales position that has been created due to gro
Blackfox Training Institute, LLC | https://www.blackfox.com/3-rising-pcb-assembly-trends-in-2021/
3 Rising PCB Assembly Trends In 2021 - Blackfox Skip to content Blackfox Premier Training & Certification +1 (888) 837-9959 Search: Course Calendar Course Calendar 2024 IPC Certification IPC Courses IPC-A-600 IPC 7711/7721 IPC-A-6012 IPC 7711/7721 Recert IPC-A-610 IPC/WHMA-A-620 IPC-A-610 Recert IPC/WHMA-A-620 Recert J-STD-001
| https://www.eptac.com/blog/surge-in-consumer-electronics-caused-by-rising-demand-for-telecommunications-equipment
Surge in Consumer Electronics Caused by Rising Demand for Telecommunications Equipment Looking for solder training standards, manuals, kits, and more
