New Equipment | Assembly Services
RF/Microwave & Antenna PCB Assembly Our assembly division has earned a reputation of helping our customers efficiently focus the use of their resources by reducing their supply base, their inventory and compressing cycle time’s in-turn increasing th
Electronics Forum | Mon Feb 27 17:08:15 EST 2006 | GS
3,5 ugr/cm2 NaCl) or power components, or Raw PCB. Nothing with the solder process or fluxes. Ion Chromatography analysis was necessary to help understanding of contamination origin. When occasionally we run TIC on a NC assembled PBA (Paste ROL0 or
Electronics Forum | Sat Sep 26 03:23:46 EDT 1998 | Jeff Sanchez
| | O-H-H-H-H-H-H-H Lawdy, lawdy... | | My babuh done left me... | | my dawg pee'd on my leg... | | my cornflakes are all poopy... | | don't make me hafta beg... | | I got's dem backplane blues, o-h-h-h-h-h lawdy..." | | OH! | | | | Hi there! Sca
Industry News | 2011-08-24 17:13:21.0
The IPC Conference on Reliability: Assembly Process for a Reliable Product will be held November 1-2, 2011, in Irvine, Calif. The conference will address reliability issues that arise at the assembly level, dedicating half-day programs on new developments in each of three key areas: materials, processes, and test and inspection.
Industry News | 2019-01-05 16:56:23.0
Metcal today announced plans to exhibit at the 2019 IPC APEX EXPO, scheduled to take place Jan. 29-31, 2019 at the San Diego Convention Center. The company will demonstrate its Connection Validation (CV) Robotic Soldering System, CV Soldering System with new hand-pieces, CV-500 Soldering System and VFX-1000H Volume Fume Extraction System in Booth #1314.
Technical Library | 2019-01-02 21:51:49.0
Failed solder joints remain a constant source of printed circuit board failure. Soldering is the bonding of metallic surfaces via an intermetallic compound (IMC). The interaction between thermal energy delivery, flux chemistry, and solder chemistry creates the solder bond or joint. Today, reliability relies on visual inspection; operator experience and skill, control of influencers e.g. tip geometry, tip temperature, and collection and analysis of process data. Each factor involved with the formation of the solder joint is an element of risk and can affect either throughput or repeatability. Mitigating this risk in hand soldering requires the identification of these factors and a means to address them.
A technology that identifies the intermetallic compound formation, enables the system to provide closed loop feedback to the operator and validates the condition of the solder joint. This technology works in conjunction with SmartHeat® and patented C
Events Calendar | Wed May 10 00:00:00 EDT 2017 - Wed May 10 00:00:00 EDT 2017 | Itasca, Illinois USA
Kester to Host Technical Rework Seminar
SMTnet Express, January 3, 2019, Subscribers: 31,567, Companies: 10,676, Users: 25,564 Risk Mitigation in Hand Soldering Credits: Metcal Failed solder joints remain a constant source of printed circuit board failure. Soldering is the bonding
SMTnet Express, October 12, 2017, Subscribers: 30,913, Companies: 10,757, Users: 23,915 Mitigation of Pure Tin Risk by Tin-Lead SMT Reflow- Results of an Industry Round-Robin David Pinsky, Tom Hester - Raytheon , Dr. Anduin Touw - The Boeing
Blackfox Training Institute, LLC | https://www.blackfox.com/blackfox-courses/lead-free-soldering/
. The program provides hand soldering operators and inspectors with a step-by-step approach to lead free soldering processes. It details the variables that needs special attention in ensuring the quality of soldering techniques, and preventing defects and repairs
| https://productronica.com/en/program/live-demonstrations/ipc-cfx-demo-line/
Newsroom Press releases Exhibitor press releases Photos Videos Services Accreditation Press Center Trade magazines & Publications Contacts for journalists At the fair Opening hours Fairgrounds map Services at the trade fair Program Program overview Live-Demonstrations Cleanroom Drones in Logistics IPC Hand
