10 years of PTH Mil-Std PWBs experience and now beginning to turn to set up our shop for SMT
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Dedicated in PCB and PCBA manufacturing. Complete stock of Special materials,like Rogers, Isola, Ventec,Thinflex etc. Full certifications like UL, ISO9001, RoHS etc. Prototype and volume orders are welcome, robin@yaxindatech.com
Currently the DOD's only Mil-P-55110F certified facility located in the Avionics Division of Warner Robins Air Logistics Center in Robins AFB, GA. We currently manufacture SS, DS, & ML PTH rigid PWBs as well as SS, DS, & ML flexible circuits in supp
Axial- Radial & Dip Inserter DIP section Radial section AXIAL RADIAL INSERTER Radial section Manufacturer Blakell FUJI Model Robin (0036) FBA 8300 (0013+ 0014) Type Axial/Radial/Dip Inserter Axial /Radial Metric Vintage 1991 Serial Nu
Electronics Forum | Thu Jul 25 23:54:53 EDT 2013 | Robin
Hi, Please share the detail input like machine model, & when the error appears. Regards, Robin
Electronics Forum | Tue Mar 24 09:48:15 EST 1998 | Steve Schrader
| Do you know if there is an IPC standard or industry standard | that addresses the proper process for handling MSD's in the production environment....? (rework etc.) | Not the receiving area. | Thanks so much, | Robin Arnold | PCB Development | Har
Industry News | 2018-10-18 19:57:48.0
Industry-leading associations IPC and SMTA jointly announce the High-Reliability Cleaning and Conformal Coating Conference, scheduled to take place November 13-15, 2018 at Chicago Marriott, Schaumburg, Illinois. The conference is focused on the cleanliness of highly dense electronic assemblies to achieve quality and reliability within the stated in-field environment.
Industry News | 2001-01-23 10:52:31.0
IPC has honored 27 members at IPC SMEMA Council's Electronic Assembly Process Exhibition and Conference (APEXSM) in San Diego, CA for their contributions to IPC and the electronics industry.
Technical Library | 2017-06-29 16:39:30.0
Currently there is no industry standard test method for measuring dielectric properties of circuit board materials at frequencies greater than about 10 GHz. Various materials vendors and test labs take different approaches to determine these properties. It is common for these different approaches to yield varying values of key properties like permittivity and loss tangent. The D-24C Task Group of IPC has developed this round robin program to assess these various methods from the "bottom up" to determine if standardized methods can be agreed upon to provide the industry with more accurate and valid characteristics of dielectrics used in high-frequency and high-speed applications.
Technical Library | 2017-10-12 15:45:25.0
The risk associated with whisker growth from pure tin solderable terminations is fully mitigated when all of the pure tin is dissolved into tin-lead solder during SMT reflow. In order to take full advantage of this phenomenon, it is necessary to understand the conditions under which such coverage can be assured. A round robin study has been performed by IPC Task group 8-81f, during which identical sets of test vehicles were assembled at multiple locations, in accordance with IPC J-STD-001, Class 3. All of the test vehicles were analyzed to determine the extent of complete tin dissolution on a variety of component types. Results of this study are presented together with relevant conclusions and recommendations to guide high reliability end-users on the applicability and limitations of this mitigation strategy.
Career Center | Phoenix, Arizona | Engineering,Management,Production,Quality Control,Research and Development,Sales/Marketing,Technical Support
• Highly motivated, solution oriented professional with proven record synergizing scientific, engineering, and business administration backgrounds to drive and sustain customer satisfaction and long term improvements. • Articulate communicator that a
SMTnet Express, June 29, 2017, Subscribers: 30,527, Companies: 10,624, Users: 23,443 Round Robin of High Frequency Test Methods by IPC-D24C Task Group Glenn Oliver, Jonathan Weldon - DuPont , Chudy Nwachukwu - Isola, John Coonrod - Rogers
SMTnet Express, October 12, 2017, Subscribers: 30,913, Companies: 10,757, Users: 23,915 Mitigation of Pure Tin Risk by Tin-Lead SMT Reflow- Results of an Industry Round-Robin David Pinsky, Tom Hester - Raytheon , Dr. Anduin Touw - The Boeing
GPD Global | https://www.gpd-global.com/co_website/contact-salesteams-usa.php
: 949-636-8552 e-mail: rudy@pmrreps.com web site: www.pmrreps.com California - San Diego ^ PMR Representatives Robin Gable mobile: 949-350-3488 e-mail: robin@pmrreps.com web site: www.pmrreps.com Colorado
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/best_papers.cfm
: Marie Cole, IBM Microelectronics "Process Optimization for 1.0 mm Pitch CBGA" 1998: Robin O’Connor, Michael Gibson and Douglas Gullion, Delphi Delco Electronics Systems "Cleaning for High Reliability Flip-Chip-on-Laminate Assembly" 1997: Richard S
