Industry Directory | Other / Manufacturer
Rockwell Collins (NYSE: COL) is a pioneer in the development and deployment of innovative communication and aviation electronic solutions for both commercial and government applications.
Industry News | 2018-03-01 19:19:12.0
IPC bestowed its highest corporate honors on two, member companies, Rockwell Collins and Northrop Grumman Corporation. During a luncheon at IPC APEX EXPO 2018, the Peter Sarmanian Corporate Recognition Award was presented to Northrop Grumman and the Stan Plzak Corporate Recognition Award was presented to Rockwell Collins.
Industry News | 2018-03-01 19:13:43.0
In recognition and acknowledgement of his extraordinary contributions to IPC and the electronics industry, Dave Hillman, Rockwell Collins, was presented with the IPC Raymond E. Pritchard Hall of Fame Award at IPC APEX EXPO on Tuesday, February 27 at the San Diego Convention Center. IPC’s most prestigious award, the Hall of Fame is given to individuals who have provided exceptional service and advancement to IPC and the electronics industry.
Technical Library | 2023-01-17 17:22:28.0
The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.
Technical Library | 2015-01-05 17:38:26.0
The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC-9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.
Events Calendar | Wed Apr 07 18:30:00 UTC 2021 - Wed Apr 07 18:30:00 UTC 2021 | ,
Huntsville Chapter Technical Meeting: Evaluating Conformal Coatings
SMTnet Express, January 5, 2014, Subscribers: 23,708, Members: Companies: 14,158 , Users: 37,476 The Last Will And Testament of the BGA Void Dave Hillman, Dave Adams, Tim Pearson, Brad Williams, Brittany Petrick, Ross Wilcoxon - Rockwell Collins
| https://ipcapexexpo.org/sites/default/files/inline-files/IPC-APEX-EXPO-2021-Exhibitor-Prospectus.pdf
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| https://www.eptac.com/wp-content/uploads/2021/11/webinar_eptac_12_17_08.pdf
