Industry Directory | Manufacturer / Other
Rockwell Collins (NYSE: COL) is a pioneer in the development and deployment of innovative communication and aviation electronic solutions for both commercial and government applications.
Electronics Forum | Sat May 05 08:00:54 EDT 2007 | davef
Continuing with CF's point on mixed alloy processing of BGA, look here: http://www.aciusa.org/leadfree/LFS_SUMMIT-PDF/09_HILLMAN_Rockwell_Collins_BGA.pdf
Electronics Forum | Mon Nov 05 19:43:09 EST 2007 | davef
"Effects of surface finish on high frequency signal loss using various substrate materials" - Call Don Cullen at Mac Dermid or Larry Gatewood at Rockwell Collins for a copy.
Industry News | 2018-03-01 19:19:12.0
IPC bestowed its highest corporate honors on two, member companies, Rockwell Collins and Northrop Grumman Corporation. During a luncheon at IPC APEX EXPO 2018, the Peter Sarmanian Corporate Recognition Award was presented to Northrop Grumman and the Stan Plzak Corporate Recognition Award was presented to Rockwell Collins.
Industry News | 2014-11-12 13:44:46.0
Industry-leading associations IPC and SMTA jointly announce the High-Reliability Cleaning and Conformal Coating Conference scheduled to take place November 18-20, 2014 at the Chicago Marriott in Schaumburg, IL. The conference intensely focuses on best practices and new innovative technologies for meeting today’s manufacturing challenges and producing reliable hardware. Doug Pauls of Rockwell Collins will chair Session #7 “Conformal Coating Process Control.”
Technical Library | 2023-01-17 17:22:28.0
The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.
Technical Library | 2015-01-05 17:38:26.0
The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC-9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.
Events Calendar | Thu Apr 08 00:00:00 EDT 2021 - Thu Apr 08 00:00:00 EDT 2021 | ,
Huntsville Chapter Technical Meeting: Evaluating Conformal Coatings
Events Calendar | Wed Apr 26 00:00:00 EDT 2017 - Wed Apr 26 00:00:00 EDT 2017 | Chicago, Illinois USA
IPC Reliability Forum: Manufacturing High-Performance Products
SMTnet Express, January 5, 2014, Subscribers: 23,708, Members: Companies: 14,158 , Users: 37,476 The Last Will And Testament of the BGA Void Dave Hillman, Dave Adams, Tim Pearson, Brad Williams, Brittany Petrick, Ross Wilcoxon - Rockwell Collins
| https://ipcapexexpo.org/sites/default/files/inline-files/IPC-APEX-EXPO-2021-Exhibitor-Prospectus.pdf
Solutions NASA National Instruments NEC Nikon Nippon Mektron Nokia Northrop Grumman Olympus Omron Panasonic Corporation Philips Electronics Plexus Qualcomm Raytheon Ricoh Company Robert Bosch Rockwell
| https://www.eptac.com/wp-content/uploads/2021/11/webinar_eptac_12_17_08.pdf