Industry Directory | Manufacturer
Hitechpcba is a wоrld-lеаding PCB Manufacturing & PCB Assembly company with more than 20 years experience in the electronics manufacturing industry. We focus on Circuit board fabrication, PCB assembly, electronic parts sourcing.
Industry Directory | Manufacturer
Rogers' high performance laminates and bondplies are engineered to meet stringent customer requirements for 5G wireless communication, wired infrastructure, automotive radar sensors, aerospace, satellites and more.
Rogers 4350 PCB/Ceramic PCB Layer count: Single-sided PCB Board thickness: 0.8mm Copper thickness: 1oz Dielectric Constant(DK): 3.48 Surface treatment: Immersion Gold
Electronics Forum | Tue Aug 21 11:18:56 EDT 2001 | roger
Michael, Please keep in mind that this is an SMT Forum, designed to exchange technical information and opinions. While you are free to suggest that a reader investigate a particlar product or service, please save the full-blown advertising for SMT o
Industry News | 2003-02-13 07:53:53.0
Belgian Laminate Plant Set to Come Online
Industry News | 2003-06-24 08:14:51.0
R/flex� 3850 laminate is produced in a range of copper and LCP thicknesses, just as the single-clad laminate, and is available in standard panel formats.
Parts & Supplies | Circuit Board Assembly Products
1) Rogers4350B/4003C, Double-sided Layer, 2) 0.5mm thick/0.2mm thick 3) 1/1 oz copper thickness 4) Line space width: 0.15-0.2mm 5) Immersion gold.
Parts & Supplies | Circuit Board Assembly Products
1). FR-4 Tg 170 + Rogers 4350B 2). 290*130mm/1up 3). 6 layers at 1.6mm thick 4). Green solder mask/White ident 5). 35um copper finished, ED copper. 6). Electroless gold. 7). Countersunk slots.
Technical Library | 2019-12-30 02:11:05.0
(ROHS, Halogen Free & Reach Compliance) FR-4 (Tg130-180): ShengYi, ITEQ, KB, Huazheng High Speed FR4, Ceramics & Telflon, Rogers
Technical Library | 2011-06-16 18:59:43.0
Based on tests carried out with commercially available chemistry, this paper discusses the advantages available through the use of NEAP processes for inner layer bonding and soldermask pretreatment. The process is characterized with a view to high volume
A brief demonstration of the ScanCAD Precision Material Removal System for PCB Reverse Engineering
Events Calendar | Tue Aug 22 00:00:00 EDT 2023 - Tue Aug 22 00:00:00 EDT 2023 | Boca Raton, Florida USA
Space Coast Panel Discussion: Microscope Setups, Getting the Best Results From Your Equipment
Career Center | San Jose, California USA | Engineering
www.srqconsultants.com : for all Job Reqs This Analog IC Test Development Engineer position will require senior level ability on at least one of the following machines: Teradyne: Catalyst, A5XX, J750, Tiger Agilent 84000, 94000 Credence Duo, Quarte
Career Center | , California USA | Engineering
www.srqconsultants.com : for all Job Reqs This Lead Analog IC Test Development Engineer position will require senior level ability on at least one of the following machines: Teradyne: Catalyst, A5XX, J750, Tiger Agilent 84000, 94000 Credence Duo, Q
Career Center | North York, | Engineering,Quality Control,Technical Support
GSM/EDGE, CDMA, UMTS cellular networks, WCDMA, Inukshuk networks, SS7, HSPA, TDMoIP, IP, TCP/IP, Ethernet, Messaging and Data Networks, Radio Prop
Career Center | Springdale, Arkansas USA | Production,Research and Development
solder, electronic assembly, pcb repair, wave solder, smt, solder pot, testing unit,dexterity, program IC's,the rest in resume
| https://www.eptac.com/faqs/ask-helena-leo/ask/reliability-of-reworked-lead-free-assemblies
) and three repairs for a total of five heat cycles. This was all based upon the work done by Roger Wild from IBM. With the denser boards of today and the surface mount process, there are more thermal excursions due to components on both sides of the board, hence we have to be careful as to how and when we heat
