New Equipment | Test Equipment
One platform embedded instruments for validation, test and debug (ScanWorks®) ScanWorks® tools validate, characterize and test chips and circuit boards in development, manufacturing and field service. Structural integrity tests can be re-used over t
New Equipment | Test Equipment
One platform for debug and trace (SourcePoint™) SourcePoint™ (formerly an Arium product) is a platform of debug and trace tools for C/C++ embedded software and firmware for either Intel® or ARM® systems. This robust environment features multiple vie
Electronics Forum | Fri Jan 25 12:14:18 EST 2013 | johng
I'm using urethane conformal coat and have fisheyes and dewetting after coating even though the PWAs have been through the wash cycle twice. I'm looking at using Ionox 13302 in an ultrasonic cleaner as a short term solution until root cause can be id
Electronics Forum | Fri Jan 25 12:15:04 EST 2013 | johng
I'm using urethane conformal coat and have fisheyes and dewetting after coating even though the PWAs have been through the wash cycle twice. I'm looking at using Ionox 13302 in an ultrasonic cleaner as a short term solution until root cause can be id
Industry News | 2018-10-18 08:21:10.0
How to Prevent Non-Wetting Defect during the SMT Reflow Process
Industry News | 2022-05-05 17:16:31.0
The SMTA is pleased to announce the finalized technical program for the International Conference for Electronics Hardware Enabling Technologies. The in-person conference will take place June 14 - 15, 2022 at the Centennial College Event Centre in Toronto, Ontario, Canada.
Technical Library | 2009-10-14 21:17:47.0
Electrochemical migration (ECM) is defined as the growth of conductive metal filaments across a printed circuit board (PCB) in the presence of an electrolytic solution and a DC voltage bias. ECM, also known as dendritic growth, is a critical issue in the electronics industry because the intermittent failure behavior of ECM is a likely root-cause of the high occurrence of field failures identified as no trouble found (NTF)/could not duplicate (CND)
Technical Library | 2020-09-30 19:23:47.0
There is an increase in the number of optical sensors and cameras being integrated into electronics devices. These go beyond cell phone cameras into automotive sensors, wearables, and other smart devices. The applications can be lens bonding, waveguide imprinting, or other applications where the adhesive is in the optical pathway. To support these various optical applications, new materials with tailorable optical properties are required. There is often a mismatched refractive index between plastic lenses such as PC (Poly Carbonate), COP (Cyclo Olefin Polymer), COC (Cyclo Olefin Copolymer), PMMA (Poly Methyl Methacrylate), and UV curable liquid adhesive. A UV curable liquid adhesive is needed where you can alter the refractive index from 1.470 to 1.730, and maintain high optical performance as yellowness index, haze, and transmittance. This wide range of refractive index possibilities provides optimized optical design. Using particular plastic lens must consider how chemical attack is occurring during the process. Another consideration is that before the UV curable liquid adhesive is cured, chemical raw component can attack the plastic lens which then cracks and delaminates. We will also show engineering and reliability data which defined root cause and provided how optical performance is maintained under different reliability conditions.
SMTnet Express, July 19, 2018, Subscribers: 31,194, Companies: 10,991, Users: 24,953 Improve SMT Assembly Yields Using Root Cause Analysis in Stencil Design Greg Smith; FCT ASSEMBLY, INC. Reduction of first pass defects in the SMT assembly process
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/our-company/news-room/feature-content-roll-up-page/hubert-kufner-engineers-innovation-for-nonwovens-in-luneburg-germany
. He credits the success of his innovative ventures to his commitment to finding the root cause of a problem and maintains that no one person can be greater than his or her team
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
z dimensions, and get further to root cause X. CONCLUSIONS The increasing usage of heterogeneous integration will lead to increasing complexities in manufacturing assemblies and stresses during system lifetime (Fig. 24): from more benign but long
