Electronics Forum | Wed May 21 04:50:51 EDT 2008 | aj
Hi all, We had similar problems a while back. Boards would fail at test but if you applied pressure to the BGA they would pass. Turned out that during the PTH assembly process the Operators were flexing the cards during the insertion of an Oupin C
Electronics Forum | Mon Nov 09 07:21:02 EST 2009 | CL
Good Morning, I have seen many posts regarding BGA voiding being excessive and what can be done to better the condition. I have a customer that has an assembly that we have had a diufficult time with. We have spent a lot of time debugging the proces
Industry News | 2018-10-18 08:14:11.0
How to Prevent the Tombstone and Open Defects during the SMT Reflow Process
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
| https://ipcapexexpo.org/education/call-for-participation
) Onshoring/Reshoring PCB and Component Storage and Handling Preventative Maintenance Problem Solving/Design of Experiments/Root Cause Analysis Sustainability Supply Chain Management Traceability
| https://www.eptac.com/blog/5-common-solder-mistakes-and-how-to-resolve-them
: Can I repair a lifted pad? A: A lifted pad refers to a soldering pad on a printed circuit board that has detached from the surface of a PCB
