Industry Directory | Manufacturer
AIM is a leading global manufacturer of solder assembly materials for the electronics industry.
Industry Directory | Manufacturer / Other
Foreverest™ supply materials for manufacture of defluxing, fluxes, adhesives, pastes and cleaning agents based on gum rosin derivatives.
is a water-based cleaning medium, designed to quickly remove fluxes, solder pastes from PC boards, stencils, screens and mis-prints in heated and unheated spray-in-air and ultrasonic cleaning systems. It is recommended for wave solder process and ros
Electronics Forum | Tue Mar 07 07:26:43 EST 2017 | emeto
Thank you bruce! I tried similar rosin based 6.5% but it gives me a lot of residue. Anything water based?
Electronics Forum | Tue Jul 31 18:46:40 EDT 2007 | rpadilla
Well, everyone has provided good advice, but if you are looking for a wave flux that can provide much better dwell times and consistent wetting throughout the hole fill, without making adjustments to your production process, I suggest going with Senj
Industry News | 2003-02-17 08:40:25.0
To Meet Government Environmental Standards and Individual Company Policies, While Satisfying Production Requirements
Industry News | 2010-07-02 16:00:34.0
In a victory for IPC members and the Canadian electronics industry, the Canadian Department of the Environment, on June 26, 2010, elected not to ban five rosin-containing substances from all products manufactured and sold in Canada.
Technical Library | 2024-06-19 13:59:50.0
The solderability of a nickel-palladium-gold (Ni-Pd-Au) finish on a Cu substrate was evaluated for the Pb-free solder, 95.5Sn-3.9Ag-0.6 Cu (wt.%, abbreviated Sn-Ag-Cu) and the eutectic 63Sn-37 Pb (Sn-Pb) alloy. The solder temperature was 245ºC. The flux was a rosin-based mildly activated (RMA) solution. The Ni-Pd-Au finish was tested in the as-fabricated condition as well as after exposure to one of the following accelerated storage (shelf life) regiments:
Technical Library | 2022-03-02 21:26:51.0
The solderability of a nickel-palladium-gold (Ni-Pd-Au) finish on a Cu substrate was evaluated for the Pb-free solder, 95.5Sn-3.9Ag-0.6 Cu (wt.%, abbreviated Sn-Ag-Cu) and the eutectic 63Sn-37 Pb (Sn-Pb) alloy. The solder temperature was 245ºC. The flux was a rosin-based mildly activated (RMA) solution. The Ni-Pd-Au finish was tested in the as-fabricated condition as well as after exposure to one of the following accelerated storage (shelf life) regiments: (1) 33.6, 67.2, or 336 hours in the Battelle Class 2 flowing gas environment or (2) 5, 16, or 24 hours of steam aging (88ºC, 90%RH).
Lewis & Clark | https://www.lewis-clark.com/product-tag/conformal-coating/
) 30cc Air Caps, 0-60 PSI Regulator with Digital Pressure Switches Power: 208/230V ~ 15A ~ 60Hz ~ 3 Phase Previously Running: Rosin Based Flux Condition: Complete
