Industry Directory | Manufacturer
AIM is a leading global manufacturer of solder assembly materials for the electronics industry.
Industry Directory | Manufacturer / Other
Foreverest™ supply materials for manufacture of defluxing, fluxes, adhesives, pastes and cleaning agents based on gum rosin derivatives.
is a water-based cleaning medium, designed to quickly remove fluxes, solder pastes from PC boards, stencils, screens and mis-prints in heated and unheated spray-in-air and ultrasonic cleaning systems. It is recommended for wave solder process and ros
Electronics Forum | Tue Mar 07 07:26:43 EST 2017 | emeto
Thank you bruce! I tried similar rosin based 6.5% but it gives me a lot of residue. Anything water based?
Electronics Forum | Tue Jul 31 18:46:40 EDT 2007 | rpadilla
Well, everyone has provided good advice, but if you are looking for a wave flux that can provide much better dwell times and consistent wetting throughout the hole fill, without making adjustments to your production process, I suggest going with Senj
Industry News | 2003-02-17 08:40:25.0
To Meet Government Environmental Standards and Individual Company Policies, While Satisfying Production Requirements
Industry News | 2010-07-02 16:00:34.0
In a victory for IPC members and the Canadian electronics industry, the Canadian Department of the Environment, on June 26, 2010, elected not to ban five rosin-containing substances from all products manufactured and sold in Canada.
Technical Library | 2020-03-09 10:50:17.0
A customer called the Helpline seeking advice for cleaning no-clean fluxes prior to applying a conformal coating. The customer's assemblies were manufactured with a no-clean rosin based solder paste (ROL0) and were cleaned with an isopropyl alcohol (IPA) wash. After cleaning, a white residue was sometimes found in areas with high paste concentrations and was interfering with the adhesion of the conformal coating (Figure 1). For conformal coatings to adhere properly, the printed circuit board (PCB) surface must be clean of fluxes and other residues. In addition, ionic contamination left by flux residues can lead to corrosion and dendrite growth, two common causes of electronic opens and shorts. Other residues can lead to unwanted impedance and physical interference with moving parts.
Technical Library | 2022-03-02 21:26:51.0
The solderability of a nickel-palladium-gold (Ni-Pd-Au) finish on a Cu substrate was evaluated for the Pb-free solder, 95.5Sn-3.9Ag-0.6 Cu (wt.%, abbreviated Sn-Ag-Cu) and the eutectic 63Sn-37 Pb (Sn-Pb) alloy. The solder temperature was 245ºC. The flux was a rosin-based mildly activated (RMA) solution. The Ni-Pd-Au finish was tested in the as-fabricated condition as well as after exposure to one of the following accelerated storage (shelf life) regiments: (1) 33.6, 67.2, or 336 hours in the Battelle Class 2 flowing gas environment or (2) 5, 16, or 24 hours of steam aging (88ºC, 90%RH).
Lewis & Clark | https://www.lewis-clark.com/product-tag/conformal-coating/
) 30cc Air Caps, 0-60 PSI Regulator with Digital Pressure Switches Power: 208/230V ~ 15A ~ 60Hz ~ 3 Phase Previously Running: Rosin Based Flux Condition: Complete
