Industry Directory | Manufacturer
AIM is a leading global manufacturer of solder assembly materials for the electronics industry.
Industry Directory | Manufacturer / Other
We are Japanese based solder manufacturer under Nihon Genma Mfg Co Ltd. Our company located in Malaysia and we distribute solder products worldwide. We are looking for aggresive business partner around the world. Contact us!!
New Equipment | Test Equipment
Koh Young ZENITH Alpha 3D AOI chip range: 01005 PCB size:330x330mm Dimension:820x1265x1627mm weight:550KG Product description: Koh Young ZENITH Alpha 3D AOI, chip range: 01005, PCB size:330x330mm, Dimension:820x1265x1627mm, weight:550KG Koh Young Z
New Equipment | Test Equipment
Koh Young ZENITH Alpha UHS 3D AOI chip range: 01005 PCB size:330x330mm Cameral resolution: 12M 15μm, Inspection height: 4mm Dimension:820x1265x1627mm weight:550KG Product description: Koh Young ZENITH Alpha 3D AOI, chip range: 01005, PCB size:330x33
Electronics Forum | Thu Jan 29 09:18:36 EST 2015 | davef
Nichrome, manganin, phosphor bronze etc are easy to solder ... the hard part is removing the corrosion * Manganin: 86% copper, 12% manganese, 2% nickel. Often, it's used in making cryogenic measurements, due to its low heat loss. * Select a flux for
Electronics Forum | Tue Apr 16 05:05:32 EDT 2013 | stivais
We recently had a discussion with customer's QM - he claims that calculations for a proper solder wire diameter and soldering iron tip size (and temperature) have to be performed and documented for all manual (T/H) solderings (based on component size
Used SMT Equipment | Coating and Encapsulation
Reflow oven by Technoprint in good condition. Technoprint Mistral 260 Product information: Forced air convection reflow oven heat to maximum temperatures of up to 300°C. Forced air convection provides uniform heating and prevents shadowing. Th
Used SMT Equipment | Soldering - Wave
BASE-EC Electra Base Machine 1 CE-WS CE Compliance 1 RGDI-EC Rigid Intermix Fingers 1 FMSK-EC Finger Mask 2 FANS-WS Cooling Fans Option 1 VEC-EC Vecta Heater 2 IR-EC Infrared Heater 1 TOPIR-EC Top Infrared Heater 1 O2-WS OptiFlux II 1 O2SLCT
Industry News | 2003-02-17 08:40:25.0
To Meet Government Environmental Standards and Individual Company Policies, While Satisfying Production Requirements
Industry News | 2005-09-19 16:07:56.0
No higher temperature and No process changes needed
Parts & Supplies | Pick and Place/Feeders
101004 TRANSISTOR BC108 NPN 101020 POWER SUPPLY – UPRATED CURRENT 101047 SQUEEGEE MATERIAL 9.5 X 9.5 85-90 101081 CONNECTOR CIRCULAR 14WAY 97-3102A 101142 FRONT SQUEEGEE CARRIAGE 101143 OUTER MTG SQUEEGEE BLOCK 101145 COVER (TXT) 101146
Parts & Supplies | Pick and Place/Feeders
101004 TRANSISTOR BC108 NPN 101020 POWER SUPPLY – UPRATED CURRENT 101047 SQUEEGEE MATERIAL 9.5 X 9.5 85-90 101081 CONNECTOR CIRCULAR 14WAY 97-3102A 101142 FRONT SQUEEGEE CARRIAGE 101143 OUTER MTG SQUEEGEE BLOCK 101145 COVER (TXT) 101146
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2024-06-19 13:59:50.0
The solderability of a nickel-palladium-gold (Ni-Pd-Au) finish on a Cu substrate was evaluated for the Pb-free solder, 95.5Sn-3.9Ag-0.6 Cu (wt.%, abbreviated Sn-Ag-Cu) and the eutectic 63Sn-37 Pb (Sn-Pb) alloy. The solder temperature was 245ºC. The flux was a rosin-based mildly activated (RMA) solution. The Ni-Pd-Au finish was tested in the as-fabricated condition as well as after exposure to one of the following accelerated storage (shelf life) regiments:
DescriptionThe Electrovert® Electra™ is an advanced, meticulously engineered wave soldering system designed for high-mass and high-volume manufacturers. Although intended for maximum throughput requirements, the Electra also offers maximum process fl
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | IPC/WHMA-A-620 Specialist (CIS) Recert.
The Certified IPC/WHMA-A-620 Specialist (CIS) recertification courses are intended for those individuals who were previously certified as IPC/WHMA-A-620 Specialist.
Events Calendar | Wed Apr 21 00:00:00 EDT 2021 - Wed Apr 21 00:00:00 EDT 2021 | ,
Oregon Chapter Tutorial: How Clean is Clean and How Do You Know for Sure?
Events Calendar | Wed Jul 03 00:00:00 EDT 2024 - Wed Jul 03 00:00:00 EDT 2024 | ,
Europe Chapter Webinar: "Back-to-Basics" SMT Assembly
Career Center | South Plainfield, New Jersey USA | Management,Sales/Marketing
Alpha, a business unit of Alent plc and the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED ligh
Career Center | South Plainfield, New Jersey USA | Engineering
Alpha Assembly Solutions, a MacDermid Performance Solutions Business and a world leader in the development, manufacturing, and sales of innovative materials used in the assembly electronics, industrial joining and Photo Voltaic market places, is seek
Career Center | Poplar Grove, Illinois | Engineering,Production,Quality Control,Technical Support
Please see resume.
Career Center | Poplar Grove, Illinois USA | Management,Production,Quality Control,Technical Support
20+ years in electronic manufacturing, sales support,customer support.
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-glossary-of-terms
. Flux comes in three forms: solid, paste, and liquid. Solid flux is most often found inside flux core solder wire. Paste flux is used for precise flux application
Lewis & Clark | http://www.lewis-clark.com/product-category/wave-solder/
: 2011 Operating System: Windows based Details: Dual pot-Lead and Lead Free Includes full pot of Lead Free –SN100C solder and Lead SN63/PB37 solder Carbon Steel Solder pots with high temperature protective coating Automatic solder addition for (2
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