This oven is used for electron production and maintain of SMT technique. The product adopts the far-infrared heating components and excellent sense temperature materials. Through the precise control of the microcomputer, make the temperature control
The R1816 infrared reflow oven is used for electron production and maintain of SMT technique. The product adopts the far-infrared heating components and excellent sense temperature materials. Through the precise control of the microcomputer, make the
Electronics Forum | Wed Oct 03 17:07:52 EDT 2001 | davef
We have had soldering problems with fine pitch QFP in the past [and probably will in the future]. Several questions leap to mind: * When you took your profile on the component pads, do you profile on the pads that did not solder well? * When you say
Electronics Forum | Wed Jan 15 21:55:41 EST 2014 | padawanlinuxero
we do that and there's a variation on the solder temp. sometimes around 10 degrees, we have 2 solder pallets that are run in intervals of roughly 3 1/2 minutes a part (the time that take the operator to put all 3 terminals in a 42 pcbs per board, and
Industry News | 2018-10-18 08:17:09.0
How to Prevent Solder Joint Voiding and Cold Solder Defects during the SMT Reflow Process
Industry News | 2011-08-18 21:23:09.0
For an industry that is constantly advancing, the technical conference at IPC Midwest Conference & Exhibition on September 21–22, in Schaumburg, Ill., will feature five sessions offering the latest research, methodologies and insights from industry experts to address critical challenges of manufacturing defect-free, quality electronics.
Technical Library | 2007-08-16 13:34:31.0
While experienced inspectors may be able to determine the aesthetic differences between a lead-free PCB assembly and a tin-lead version, one cannot rely on the "experienced eye". "Less wetting out to the pad edges" (Figure A) and "graininess and lack of shininess of the solder joint" (Figure B) are typical comments about some lead-free solder joints. However, in cases where a Nitrogen atmosphere was present during the reflow of the solder joint (Figure C), there will be little visual differences between the lead free alloys and their tin-lead counterparts.
Quick Overview: Motor-driven MDS-508-500/509-500 separates v-scored PCBs without stress to boards, components or solder joints. it is suited for medium to high-volume production,available with 460 mm or 600 mm (option) maximum cutting length. Cut le
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-glossary-of-terms
temperature joints. T Tackiness Ability of solder paste to hold surface-mount components in place after placement. Tensile Strength Characteristic of a material that describes its resistance to fracture when the material is under tension. Through hole A
| https://www.eptac.com/blog/5-common-solder-mistakes-and-how-to-resolve-them
. 4. Cold Solder Joint A cold solder joint occurs when the solder does not melt completely. A result of insufficient heat, cold joints are often characterized by being rigid, rough, and uneven in appearance
