Full Hot Air Lead-Free Reflow Oven With PC Temp Control System (A800) Introduce: 1, Heating system adopts ETA patent heating technology 2, The use of imported large current solid state relay contact output, safe, reliable, equipped with a dedicated
Main product: SMT Assembly Reflow Oven, SMT Hot Air Reflow Oven, Lead Free Reflow Oven, SMT Reflow Oven, SMT Mounting Machine, Elctronic Equipment, PCB Machine, reflow oven, SMT Assembly, SMT/SMD Equipment, PCB Printer, screen printing SMT assembly
Electronics Forum | Mon Dec 11 15:12:20 EST 2000 | accuspec
we are using alphametals no clean 95sn/5ag CL775 paste. After reflow there are solder balls on the board. mainly are around the cap. We are using a conceptronic concept 60 air. There are 4 zones with 8 chambers. We are not sure what the profile
Electronics Forum | Tue Dec 12 03:15:13 EST 2000 | Chris May
The profile that you should be using, hopefully, is detailed in the paste data sheet. Connect your thermocouples to various parts of the board, depending on layout, population etc; and then run some trials observing the profile on your oven monitor/
Industry News | 2003-05-28 08:28:54.0
For June 2-4 (Mon. - Wed.)Design Automation Conference 2003
Industry News | 2003-04-17 11:35:44.0
Honored for their contributions to IPC and the electronics industry
Full Hot Air Lead-Free Reflow Oven With PC Temp Control System (A800) Introduce: 1, Heating system adopts ETA patent heating technology 2, The use of imported large current solid state relay contact output, safe, reliable, equipped with a dedicated
Main product: SMT Assembly Reflow Oven, SMT Hot Air Reflow Oven, Lead Free Reflow Oven, SMT Reflow Oven, SMT Mounting Machine, Elctronic Equipment, PCB Machine, reflow oven, SMT Assembly, SMT/SMD Equipment, PCB Printer, screen printing SMT assembly
Career Center | Sunrise, Florida USA | Technical Support
local area field srevice technician fixing or replacing desktops and POlocal S's
Strength of Lead-free BGA Spheres in High Speed Loading Strength of Lead-free BGA Spheres in High Speed Loading Concern about the failure of lead-free BGA packages when portable devices such as cell phones are accidentally dropped and a general
Near Term Solutions For 3D Packaging Of High Performance DRAM Near Term Solutions For 3D Packaging Of High Performance DRAM The revolution in performance driven electronic systems continues to challenge the IC packaging industry. To enable the new
Blackfox Training Institute, LLC | https://www.blackfox.com/blackfox-how-to-make-a-printed-circuit-board-at-home/
Printed Circuit Board Repair System Integration ESD Mechanical Assembly Series Lead Free Soldering High Temp Soldering Counterfeit Components Course Overview Course Outline Course Instructor Course
| http://etasmt.com/cc?ID=te_news_bulletin,25762&url=_print
>> News 8 Hot Zone Lead Free Reflow Oven 20005 Running Hours For LED PCB Good Condition Detailed Product Description Brand:: Heller Lead Free MODEL: 1800exl Weight:: 1600KG Lead Time:: 3-5days Packing:: BOX CONdition: Working Voltage: 380v Running Hours: 20005 High Light
