JUKI JM-20 Hybrid Placement Machine Max PCB:410×560mmComponent Size:0603～50mmPlace Speed:15,500 CPHProduct description: JUKI JM-20 Multi Task Platform Hybrid Placement Machine, Max PCB:410×560mm, Component Size:0603～50mm, Place Speed:15,500 CPH
New Equipment | Rework & Repair Equipment
Infrared BGA & SMT Rework at a Price that Can't Be Beat! The IR 1000 is a low-cost, remarkably flexible and effective rework system, capable of installing and removing passives, QFP's, SOIC's, PLCC's, MLF's, LCCC's, TSOP's, QFN's and BGA's. It is id
Electronics Forum | Sun May 21 23:29:38 EDT 2017 | zsoden
Hi all, We run an old Seho 1135C wave solder with a 63/37 pot at 250°C. It has been running well for a couple of years but we have noticed lately that all of the larger pads (terminal blocks, transformers, etc.) require additional solder to be appli
Electronics Forum | Sat Mar 03 14:51:22 EST 2001 | stefwitt
Hi Dave, I think 6 sigma is here to stay. Unlike any other programs like ISO, six sigma goes to the people�s mind. With drastic examples like � you would not fly a plane which reaches its destination in a three sigma probability � you start to think
Industry News | 2010-07-16 16:42:34.0
Count On Tools Inc., a leading provider of precision components and SMT spare parts, has released PB Swiss Tools’ Holding Ring Hex Keys. The new hex keys allow fasteners to be inserted or removed in hard-to-reach locations without the fastener falling off the tool and without sacrificing strength.
Industry News | 2015-05-14 21:16:43.0
On behalf of IPC – Association Connecting Electronics Industries® and an estimated 800,000 people employed in our 2,200 U.S. member facilities, we commend the House Energy and Commerce Subcommittee on Environment and the Economy for taking action on the draft TSCA Modernization Act of 2015.
In this video we briefly demonstrate the removal of a BGA component from a smart phone circuit board. To get a quote or obtain more information on the IR 1000, visit the link below: https://www.paceworldwide.com/products/area-array-bga-rework/bga-r
Enter PACE’s TF Series BGA/SMD Rework Systems. With its groundbreaking, patented Inductive-Convection Heating Technology, the TF Series top-side heater reaches the target temperature in just seconds for safe, rapid solder joint reflow in virtually an
Career Center | Corpus Christ, Texas USA | Engineering,Quality Control
This position reports to the Quality Manager and provides support in all areas of fabrication and assembly of passive components exceeding customer requirements and expectations in a fast paced environment. Support is defined as but not limited to th
Career Center | Seattle, Washington USA | Sales/Marketing
Summary: AalokTronix is seeking an experienced Sales professional with experience in the Printed Circuit Board Assembly (PCBA) and Electronic Manufacturing Services (EMS) field. The Sales Manager will be responsible for sourcing, generating
Baja Bid | https://bajabid.com/wp-content/uploads/2023/06/XT-V-130-flyer-EN.pdf
• Low cost of ownership and maintenance with open-tube technology • Inherently safe system, does not require special precautions or badges
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/06/688951_OvenSetupWizard-XP4021.pdf
should be selected together. Select Animation to display board animation on the overview screen. Sensor Distance: used for board drop option, animation. Board Drop Warning: to detect a board drop condition (a board which does not reach exit sensor on time
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