New Equipment | Solder Materials
The MULTICORE portfolio of cored solder wire features the award-winning multiple flux core technology that ensures the even and consistent distribution of flux throughout the solder wire. This mainstay in Henkel’s line of solder products delivers eas
New Equipment | Solder Materials
Proposal Pro Contra Vaporphase OT2 SCAN-Ge XF3+ Large melting range Anti-Tombstoning Dull solder joints
Electronics Forum | Mon Mar 19 11:44:22 EST 2001 | sac
My company is a small to mid size contract manufacturer, and relatively new to the business. I was wondering if anyone could tell me what a typical warranty policy is for PCB assemblies. In an effort to get needed sales, I am afraid our sales departm
Electronics Forum | Wed Mar 21 07:50:37 EST 2001 | sac
Our standard warranty states material and workmanship. The problem is the cost involved in determining cause of failure(these are smt boards containing approx 400 placements). Since most of these products are tested before they leave our facility, an
Used SMT Equipment | Soldering - Wave
Technical Devices / Dektec Wave Soldering Machine Model: BEN-Z400 Year: 2017 Lead-Free Full Pot - 400# of SAC 307 Water Soluble Flux L Shape Fingers Bottom Side IR Preheat (26" Long) Complete & Operational
Used SMT Equipment | Soldering - Selective
• Less then 100 hours • Stand-alone Machine • 2 Spray Nozzles/Programable • Dual Solder pots / Dual Heads – Loaded with SAC305 • Heads can run 4 different assembles • Pot level detection / Upgraded self-feeder • Automatic solder refill / Autom
Industry News | 2005-09-19 16:07:56.0
No higher temperature and No process changes needed
Industry News | 2021-03-25 15:48:41.0
The SMTA Officer team is excited to provide our members with a new webinar by Dr. Nathan Blattau, R&D Fellow at Ansys, Inc., on "Next Generation Lead Free Solders for High Reliability and SMT Yield improvement in Client Computing Systems." The webinar will be on Tuesday, April 6th at 12:00 PM EST and will discuss the evolution of lead free (Pb-free) solder, from tin-silver-copper (SAC) system with silver content of 3.0 and 4.0 to low SAC solders and the emergence of high reliability Pb-free solder. It will cover the reasons and the driving forces of industries implementing this change.
Parts & Supplies | Other Equipment
C20-CPU84-E C200H-CPU01 C2000HCPU01E2V C2000HCPU0IE2V1 C200H-CPU02 C200H-CPU03 C200h-CPU11 C200H-CPU21 C200HCPU3E2 C200H-CPU31 C200HCPU31E2 C200HS-CPU01 C200HS-CPU21 C200HS-CPU31 C200HE-CPU11 C200HE-CPU32 C200HE-CPU42 C200HG-CPU33 C200HG-CP
Technical Library | 2023-01-17 17:27:13.0
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)
Technical Library | 2023-09-07 14:38:31.0
A repeat customer specializing in high-technology interconnect, sensor, and antenna solutions, partnered with us to dispense small volumes of solder paste (Indium 10.1 SAC305 T6SG 78%m) onto backplane connectors – gold pads 0.175mm x 0.225mm. We performed a test requiring 0.200mm diameter or smaller dots to demonstrate the dispensing capability required.
Quick Overview: The ADS- 3530 is ideal for electronic assemblers looking for an easy and affordable way to improve soldering speed and consistency. Dramatically more efficient and reliable than hand soldering or manual dipping, the ADS-3530 features
Quick Overview: The ADS- 3530 is ideal for electronic assemblers looking for an easy and affordable way to improve soldering speed and consistency. Dramatically more efficient and reliable than hand soldering or manual dipping, the ADS-3530 features
Events Calendar | Tue Apr 06 00:00:00 EDT 2021 - Tue Apr 06 00:00:00 EDT 2021 | ,
Capital Chapter Webinar: Next Gen Lead Free Solders for High Reliability & SMT Yield improvement
Events Calendar | Wed Mar 18 00:00:00 EDT 2020 - Wed Mar 18 00:00:00 EDT 2020 | College Park, Maryland USA
CALCE Reliability Science Symposium - Spring 2020
Career Center | Lakewood, California USA | Engineering,Maintenance,Management,Production
Quality conscience, detail oriented, manufacturing engineer, with a hands on approach to overall process improvement and development. Motivated with excellent communication skills and a dedicated team player. Qualifications include: � Safety /Diver
Career Center | Rochester, New York USA | Engineering
I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research
be an optimal alloying addition in lead-free SAC (
Effect of Soldering Parameters on Reaction Kinetics and Phase Transformations of SAC 305 Solder Effect of Soldering Parameters on Reaction Kinetics and Phase Transformations of SAC 305 Solder As technology becomes increasingly reliant
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5459
Electromigration Behavior of SAC(305) / SnBiAg Mixed Solder Alloy Assemblies 中文 MEMBERS LOGIN Membership Become a Member! Renew Membership About SMTA Ambassadors Benefits Classifications Member Directory Member Directory Corporate Suppliers Corporate Users Consultants List Advertisers Update Your Info
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/fr-FR/divisions/adhesive-dispensing-systems/industries/packaging/case-carton-bag-sealing?con=t&page=31
Fermeture de caisse, carton et sac | Systèmes de dépose d'adhésif Nordson Systèmes de dépose d'adhésif Collectif | Annuaire mondial | Langues Division uniquement Tout de Nordson Accueil Produits
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