Industry Directory | Manufacturer
Rommtech-3S is your partner for reliable and cost effective contract manufacturing!have more than 15 years experience in the production of electronic and electromechanical devices � security products, radiators; cash registers manufacturing; igniters
Industry Directory | Manufacturer
Global soldering materials manufacturer founded in 1980 headquartered in IL. U.S.A. Products include: RoHS lead free solders + leaded, Metals Recycling Program, Solder Check Up Program, Technical Support. ISO 9001:2015 Certified
High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En
New Equipment | Solder Materials
SAC305 is a lead-free alloy that contains 96.5 % tin, 3% silver, and 0.5% copper. This alloy falls under the JEIDA recommendation for lead-free soldering. When used in wave soldering, AIM’s SAC305 bar solder offers far superior fluidity as compared t
Electronics Forum | Wed Sep 28 03:58:05 EDT 2011 | Jacki
Hi All My company is doing PCB assembly.To save cost, we change our wave solder bath from SnAg to SAC 305. What is the pros and cons for using SAC 305 solder? And,will affect to our quailty? Thanks in advance.
Electronics Forum | Tue Oct 18 19:29:06 EDT 2011 | warwolf
hey Jacki we are looking at going from SAC305 to SN100C, if your looking to save cost it's a cheaper option. have a look into it.
Used SMT Equipment | Screen Printers
MPM Momentum+ Printer Substrate treatment Maximum plate size(XxY) 609.6 mm x 508 mm(24”x 20”) Segmented mode-Momentum Elite 457 mm x 508 mm(18"x20") Minimum Plate Size (XxY)
Used SMT Equipment | Soldering - Selective
• Less then 100 hours • Stand-alone Machine • 2 Spray Nozzles/Programable • Dual Solder pots / Dual Heads – Loaded with SAC305 • Heads can run 4 different assembles • Pot level detection / Upgraded self-feeder • Automatic solder refill / Autom
Industry News | 2018-03-29 20:48:41.0
SMTA Europe announces Keynote Speaker Ralph Tuttle of Cree, Inc. on High Power LED Solder Joint Reliability at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.
Industry News | 2011-08-30 19:41:37.0
The SMTA announced two sessions on Alternate Lead-Free Alloys featured during their annual conference, SMTA International, taking place October 16-20, 2011 in Ft. Worth, Texas.
Parts & Supplies | Assembly Accessories
MPM stencil Printer Frame 29’’x29’’ More SMT parts available H1067R A12GD25-1L-Z FUJI CP6 Solenoid valve H1068Z PCD2413-NB-D24 FUJI CP643 13 Solenoid valve H1082T RCS-242-M3-D24MP Solenoid valve H1084A SS23H-M5-D24-UPK Sensor H1124D FUJI XP242
Parts & Supplies | Assembly Accessories
MPM ORIGINAL USED 29’’x29’’ STENCIL PRINTER FRAME More SMT parts available H1067R A12GD25-1L-Z FUJI CP6 Solenoid valve H1068Z PCD2413-NB-D24 FUJI CP643 13 Solenoid valve H1082T RCS-242-M3-D24MP Solenoid valve H1084A SS23H-M5-D24-UPK Sensor H11
Technical Library | 2023-01-17 17:27:13.0
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)
Technical Library | 2023-09-07 14:38:31.0
A repeat customer specializing in high-technology interconnect, sensor, and antenna solutions, partnered with us to dispense small volumes of solder paste (Indium 10.1 SAC305 T6SG 78%m) onto backplane connectors – gold pads 0.175mm x 0.225mm. We performed a test requiring 0.200mm diameter or smaller dots to demonstrate the dispensing capability required.
High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En
Momentum was designed and built to be a no-nonsense production machine. Cost-efficient and featuring a modest footprint, it grows with the user; innovative patented features can be added on or retrofitted as needed as the user’s throughput dema
Career Center | Lakewood, California USA | Engineering,Maintenance,Management,Production
Quality conscience, detail oriented, manufacturing engineer, with a hands on approach to overall process improvement and development. Motivated with excellent communication skills and a dedicated team player. Qualifications include: � Safety /Diver
Career Center | Rochester, New York USA | Engineering
I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research
| https://www.eptac.com/wp-content/uploads/2021/11/webinar_eptac_12_17_08.pdf
Precision PCB Services, Inc | https://precision-pcb-services-inc.com/collections/solder-balls/products/solder-balls-lead-free-20mm
.20mm Lead Free Solder Balls (ROHS), SAC 305 250K Balls per Jar. For reballing BGA Chip. All sizes available in both Lead and Lead Free Ships within 24 hours
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