Industry Directory | Manufacturer
Global soldering materials manufacturer founded in 1980 headquartered in IL. U.S.A. Products include: RoHS lead free solders + leaded, Metals Recycling Program, Solder Check Up Program, Technical Support. ISO 9001:2015 Certified
Industry Directory | Manufacturer
The UK's largest producer of ultra pure solder alloys for the electronics assembly and HASL industry across Europe.
New Equipment | Solder Materials
SAC305 is a lead-free alloy that contains 96.5 % tin, 3% silver, and 0.5% copper. This alloy falls under the JEIDA recommendation for lead-free soldering. When used in wave soldering, AIM’s SAC305 bar solder offers far superior fluidity as compared t
New Equipment | Solder Materials
The MULTICORE portfolio of cored solder wire features the award-winning multiple flux core technology that ensures the even and consistent distribution of flux throughout the solder wire. This mainstay in Henkel’s line of solder products delivers eas
Electronics Forum | Wed Sep 28 03:58:05 EDT 2011 | Jacki
Hi All My company is doing PCB assembly.To save cost, we change our wave solder bath from SnAg to SAC 305. What is the pros and cons for using SAC 305 solder? And,will affect to our quailty? Thanks in advance.
Electronics Forum | Tue Oct 18 19:29:06 EDT 2011 | warwolf
hey Jacki we are looking at going from SAC305 to SN100C, if your looking to save cost it's a cheaper option. have a look into it.
Used SMT Equipment | Soldering - Selective
• Less then 100 hours • Stand-alone Machine • 2 Spray Nozzles/Programable • Dual Solder pots / Dual Heads – Loaded with SAC305 • Heads can run 4 different assembles • Pot level detection / Upgraded self-feeder • Automatic solder refill / Autom
Used SMT Equipment | Soldering - Wave
Please enquire to get full documentation and set of pictures
Industry News | 2018-03-29 20:48:41.0
SMTA Europe announces Keynote Speaker Ralph Tuttle of Cree, Inc. on High Power LED Solder Joint Reliability at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.
Industry News | 2011-08-30 19:41:37.0
The SMTA announced two sessions on Alternate Lead-Free Alloys featured during their annual conference, SMTA International, taking place October 16-20, 2011 in Ft. Worth, Texas.
Parts & Supplies | Other Equipment
C20-CPU84-E C200H-CPU01 C2000HCPU01E2V C2000HCPU0IE2V1 C200H-CPU02 C200H-CPU03 C200h-CPU11 C200H-CPU21 C200HCPU3E2 C200H-CPU31 C200HCPU31E2 C200HS-CPU01 C200HS-CPU21 C200HS-CPU31 C200HE-CPU11 C200HE-CPU32 C200HE-CPU42 C200HG-CPU33 C200HG-CP
Technical Library | 2023-01-17 17:27:13.0
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)
Technical Library | 2023-09-07 14:38:31.0
A repeat customer specializing in high-technology interconnect, sensor, and antenna solutions, partnered with us to dispense small volumes of solder paste (Indium 10.1 SAC305 T6SG 78%m) onto backplane connectors – gold pads 0.175mm x 0.225mm. We performed a test requiring 0.200mm diameter or smaller dots to demonstrate the dispensing capability required.
ALPHA® Telecore XL-825 lead-free cored solder wire minimizes spattering in hand soldering operations, thus reducing circuit board contamination and enhancing worker safety and comfort.
SN100C P810 D4????????? ???????????? ??????????????????????????????????? ?????????????? ???http://www.nihonsuperior.co.jp/
Career Center | Lakewood, California USA | Engineering,Maintenance,Management,Production
Quality conscience, detail oriented, manufacturing engineer, with a hands on approach to overall process improvement and development. Motivated with excellent communication skills and a dedicated team player. Qualifications include: � Safety /Diver
Career Center | Rochester, New York USA | Engineering
I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research
be an optimal alloying addition in lead-free SAC (
Effect of Soldering Parameters on Reaction Kinetics and Phase Transformations of SAC 305 Solder Effect of Soldering Parameters on Reaction Kinetics and Phase Transformations of SAC 305 Solder As technology becomes increasingly reliant
| https://www.eptac.com/wp-content/uploads/2021/11/webinar_eptac_12_17_08.pdf
Precision PCB Services, Inc | https://precision-pcb-services-inc.com/products/solder-balls-lead-free-20mm
.20mm Lead Free Solder Balls (ROHS), SAC 305 250K Balls per Jar. For reballing BGA Chip. All sizes available in both Lead and Lead Free Ships within 24 hours
